Fingerprint identification module and method for manufacturing the same

Abstract

The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.

Claims

1. A fingerprint identification module, wherein the fingerprint identification module is obtained by dicing a board-level module, comprising: a fingerprint identification chip, a filling material, a color coating and a cover; wherein the color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment; wherein the fingerprint identification chip comprises an identification area, an interconnection gold thread, a molding layer, a substrate layer and a pad; wherein the identification area is disposed inside of the molding layer, the substrate layer is adhered to the molding layer, the pad is disposed on an upper surface and a lower surface of the substrate layer and is further disposed on an upper surface of the identification area, and the pad on the upper surface of the identification area is connected to the pad on the upper surface of the substrate layer via the interconnection gold thread.

2. The fingerprint identification module according to claim 1, wherein an upper surface of the inversely-attached fingerprint identification chip is above an upper surface of the filling material.

3. The fingerprint identification module according to claim 1, wherein the filling material is an organic colloid, a film or a plastic, and has a photo-induced effect; and the hollow area is obtained by exposing and developing a part of the filling material.

4. The fingerprint identification module according to claim 1, wherein the cover is a strip-type glass, a strip-type ceramic, a substrate-type glass, a substrate-type ceramic, or a disc-type glass having the same shape as a wafer.

5. A method for manufacturing a fingerprint identification module, wherein the method comprises: manufacturing at least one fingerprint identification chip; wherein the fingerprint identification chip comprises an identification area, an interconnection gold thread, a molding layer, a substrate layer and a pad; and wherein the identification area is disposed inside of the molding layer, the substrate layer is adhered to the molding layer, the pad is disposed on an upper surface and a lower surface of the substrate layer and is further disposed on an upper surface of the identification area, and the pad on the upper surface of the identification area is connected to the pad on the upper surface of the substrate layer via the interconnection gold thread; manufacturing a board-level module comprising a filling material, a color coating and a cover, and processing an array of hollow areas in a predetermined quantity on the filling material of the board-level module; attaching a fingerprint identification chip into each hollow area in the array of hollow areas of the filling material in a vacuum environment; and dicing the board-level module to obtain fingerprint identification modules.

6. The method according to claim 5, wherein the attaching a fingerprint identification chip into each hollow area in the array of hollow areas of the filling material comprises: uniformly filling a glue with a preset thickness at a bottom of each of the hollow areas, and performing a defoaming process to the glue; inversely placing the fingerprint identification chip in each hollow area in the array of hollow areas of the filling material; and pressurizing the fingerprint identification chip and heating to cure the fingerprint identification chip, such that the fingerprint identification chip is tightly attached to the glue and the glue is solidified.

7. The method according to claim 6, wherein an upper surface of the inversely-placed fingerprint identification chip is above an upper surface of the filling material.

8. The method according to claim 5, wherein the filling material is an organic colloid, a film or a plastic, and has a photo-induced effect; and each hollow area in the array of hollow areas of the filling material is obtained by exposing and developing the filling material.

9. The method according to claim 5, wherein the cover is a strip-type glass, a strip-type ceramic, a substrate-type glass, a substrate-type ceramic, or a disc-type glass having the same shape as a wafer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic structural diagram of a fingerprint identification chip according to an embodiment of the present disclosure;

(2) FIG. 2 is a schematic diagram of an attaching process of a fingerprint identification chip and a flexible printed circuit in the prior art;

(3) FIG. 3 is a schematic diagram of an attaching process of a metal ring and a flexible printed circuit in the prior art;

(4) FIG. 4 is a schematic diagram of an attaching process of a glass cover and a flexible printed circuit in the prior art;

(5) FIG. 5 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present disclosure;

(6) FIG. 6 is a schematic diagram of a cover of the fingerprint identification module according to an embodiment of the present disclosure;

(7) FIG. 7 is a schematic diagram of a cover and a color coating of the fingerprint identification module according to an embodiment of the present disclosure;

(8) FIG. 8 is a schematic diagram of a board-level module according to an embodiment of the present disclosure;

(9) FIG. 9 is a schematic diagram of a hollow area of a board-level module according to an embodiment of the present disclosure;

(10) FIG. 10 is a schematic diagram of glue filling of the board-level module according to an embodiment of the present disclosure; and

(11) FIG. 11 is a schematic diagram of attaching of the fingerprint identification chip according to an embodiment of the present disclosure.

(12) Reference numerals and denotations thereof: 100fingerprint identification chip, 101identification area, 102interconnection gold thread, 103molding layer, 104substrate layer, 105pad, 200fingerprint identification module, 201filling material, 202color coating, 203cover, 204glue layer, 300flexible printed circuit, 400metal ring, and 500glass cover.

DETAILED DESCRIPTION

(13) In order to facilitate understanding of the present disclosure, the present disclosure will be described more comprehensively with reference to relevant drawings. The accompanying drawings show preferential embodiments of the present disclosure. However, the present disclosure may be implemented in a plurality of forms or ways, and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosed contents of the present disclosure more thorough and comprehensive.

(14) Unless otherwise defined, all the technical and scientific terms used in this specification are the same as those usually understood by persons skilled in the art of the present disclosure. The terms in the specification of the present disclosure are only used to describe the specific embodiments, but not to limit the present disclosure.

(15) Referring to FIG. 1, a fingerprint identification chip 100 included in a fingerprint identification module provided in the embodiments of the present disclosure includes an identification area 101, an interconnection gold thread 102, a molding layer 103, a substrate layer 104 and a pad 105. The identification area 101 is disposed inside of the molding layer 103, the substrate layer 104 is adhered to the molding layer 103, the pad 105 is disposed on an upper surface and a lower surface of the substrate layer 104 and is further disposed on an upper surface of the identification area 101, and the pad 105 on the upper surface of the identification area 101 is connected to the pad 105 on the upper surface of the substrate layer 104 via the interconnection gold thread 102.

(16) Referring to FIG. 5, a fingerprint identification module provided in the embodiments of the present disclosure includes a fingerprint identification chip 100, a filling material 201, a color coating 202, a cover 203 and a glue layer 204. The color coating 202 is disposed between the filling material 201 and the cover 203, and the fingerprint identification chip 100 is inversely attached in a hollow area of the filling material 201 in a vacuum environment. The filling material 201 is a material having a photo-induced effect such as an organic colloid, a film or a plastic. The hollow area is obtained by exposing and developing a part of the filling material 201. The hollow area is filled with the glue layer 204, which is configured to attach the fingerprint identification chip 100. The fingerprint identification module is manufactured in batches on a board-level module, and is subsequently obtained via dicing. The structure is simple and easy to manufacture.

(17) A method for manufacturing for a fingerprint identification module provided in the embodiments of the present disclosure includes the following steps.

(18) Step S1: A board-level module is manufactured by using a filling material 201, a color coating 202 and a cover 203.

(19) Referring to FIG. 6, the cover 203 is used as a carrier, and may use such materials as a strip-type glass, a strip-type ceramic, a substrate-type glass, a substrate-type ceramic, or a disc-type glass having the same shape as a wafer. Different sizes may be selected for the cover 203 according to the features of the industry or the wafer level module technology. Referring to FIG. 7, the color coating 202 may be coated on the cover 203 by using such processes as silk screening, and a specific color may be customized according to customer's needs.

(20) Referring to FIG. 8, a layer of the filling material 201 is coated on the color coating 202, the filling material 201 may be a material having a photo-induced effect such as an organic colloid, a film or a plastic, and the thickness of the filling material is customized according to the thickness of the fingerprint identification chip 100.

(21) Step S2: An array of hollow areas in a predetermined quantity is processed on the filling material 201 of the board-level module.

(22) Referring to FIG. 9, with respect to step S2, since the filling material 201 has the photo-induced effect, the hollow area may be acquired by a photolithography process such as, exposing and developing the filling material 201. After the filling material 201 is hollowed, the size of each hollow area is a little bit greater than that of the fingerprint identification chip 100, and the filling material 201 may surround and support the fingerprint identification chip 100, and thus protect the fingerprint identification chip 100. A plurality of hollow area arrays may be manufactured on the filling material 201 of the same board-level module for manufacturing of the fingerprint identification module, such that the materials and processes are reduced, and the production efficiency is improved.

(23) Step S3: The fingerprint identification chip 100 is attached into each hollow area in the array of hollow areas of the filling material in a vacuum environment.

(24) In step S3, the attaching a fingerprint identification chip 100 into each hollow area in the array of hollow areas of the filling material 201 includes the following steps.

(25) S31: A glue with a preset thickness is uniformly filled at a bottom of each of the hollow areas, and a defoaming process is performed for the glue.

(26) Referring to FIG. 10, the bottom of each of the hollow areas is coated by the glue layer 204, such that the glue with a suitable thickness is uniformly filled at the bottom of the hollow area. In addition, the defoaming process is performed for the glue layer 204 to eliminate the bubbles.

(27) S32: The fingerprint identification chip 100 is inversely placed in each hollow area in the array of hollow areas of the filling material 201.

(28) The manufactured board-level module is placed in a vacuum environment, and the atmospheric environment that exists in the hollow area is cleared. In addition, the fingerprint identification chip 100 is inversely placed in the hollow area, and an upper surface of the inversely-placed fingerprint identification chip 100 is above an upper surface of the filling material 201.

(29) S33: The fingerprint identification chip 100 is pressurized and heated, such that the fingerprint identification chip 100 is tightly attached to the glue and the glue is solidified.

(30) Referring to FIG. 11, with respect to step S33, in the vacuum environment, when being attached, the fingerprint identification chip 100 may be suitably pressurized and heated, such that the glue layer 204 is solidified, and the bubbles between the fingerprint identification chip 100 and the cover 203 may be greatly eliminated.

(31) Step S4: The board-level module is diced to obtain fingerprint identification modules.

(32) Since the size of the cover 203 may be 8 inches, 12 inches, or bigger, hundreds of hollow areas may be formed at one time on a corresponding board-level module. When the manufacture is performed at a time, a plurality of fingerprint identification modules may be manufactured on the board-level module. After the manufacture, the plurality of fingerprint identification modules on the same board-level module may be diced, such that a plurality of attached fingerprint identification modules may be obtained, which improves the production efficiency, and facilitates large-scale mass production.

(33) The foregoing method for manufacturing the fingerprint identification module is not limited to manufacturing the fingerprint identification module of the present disclosure.

(34) The embodiments provided in the present disclosure create the follow beneficial effects:

(35) 1. The fingerprint identification module 200 according to the embodiments of the present disclosure is obtained by dicing a board-level module, and includes a fingerprint identification chip 100, a filling material 201, a color coating 202 and a cover 203. The color coating 202 is disposed between the filling material 201 and the cover 203, and the fingerprint identification chip 100 is inversely attached in a hollow area of the filling material 201 in a vacuum environment. This fingerprint identification module has a simple structure, and is easy to manufacture.

(36) 2. The method for manufacturing the fingerprint identification module according to the embodiments of the present disclosure includes: manufacturing a board-level module using a filling material 201, a color coating 202 and a cover 203, and processing an array of hollow areas in a predetermined quantity on the filling material 201 of the board-level module; attaching a fingerprint identification chip 100 into each hollow area in the array of hollow areas of the filling material 201 in a vacuum environment; and dicing the board-level module to obtain a plurality of fingerprint identification modules. The method effectively eliminates bubbles between the fingerprint identification chip 100 and the cover 203, and improves the manufacture efficiency of the fingerprint identification module.

(37) Detailed above are exemplary implementation manners of the present disclosure, but the implementation manners of the present disclosure are not limited by the above embodiments. Any change, modification, replacement, combination, and simplification made within the spirit and principle of present disclosure should be equivalent displacement manners, and shall fall within the protection scope of the present disclosure.