METHOD OF ENHANCING A DLC COATED SURFACE FOR ENHANCED MULTIPACTION RESISTANCE

Abstract

A method for creating an enhanced multipaction resistant diamond-like coating (DLC) coating with lower Secondary Electron Emission (SEE) properties is performed on an initial surface by etching a DLC coating deposited on the surface after deposition and optionally creating interlayers to enhance adhesion mechanical properties between the DLC coating and the initial surface.

Claims

1. A method of creating an enhanced DLC coating on multipaction prone surfaces comprising: (a) preparing a surface to be coated; (b) coating said surface with a DLC coating layer; and (c) etching with said DLC coating layer with an inert gas.

2. The method of claim 1 wherein the step of coating the surface with a DLC coating also includes other gases.

3. The method of claim 1 wherein the step of coating the surface with a DLC other gases one of, or a combination of nitrogen and fluorine.

4. The method of claim 1 wherein the step of coating the surface with a DLC includes said other gases that become dopants within the DLC coating.

5. A method of creating an enhanced DLC coating on multipaction prone surfaces comprising: (a) preparing a surface to be coated; (b) etching said surface with an inert gas; (c) coating said etched surface with one or more interlayers with adhesive properties, said top interlayer having a top surface; (d) coating said top interlayer surface with adhesive properties with a DLC coating layer; and (e) etching with said DLC coating layer with an inert gas.

6. A method according to claim 5 wherein said step (a) preparing a surface is ultrasonic cleaning.

7. A method according to claim 5 wherein said step (a) preparing a surface is plasma etching.

8. A method according to claim 5 wherein said step (a) preparing a surface is by ultrasonic cleaning and plasma etching.

9. A method according to claim 5 wherein said inert gas of each of step (b) and step (e) has one or more noble gases.

10. A method according to claim 5 wherein each of said interlayers is one of silicon, carbide, and metal nitride.

11. A method according to claim 5 wherein said step (d) DLC coating is by one of PVD, PECVD, and hybrid PVD/PECVD coating processes.

12. A method according to claim 5 wherein said step (d) also includes additional gases.

13. A method of claim 5 wherein said step (d) includes additional gasses that are one of or a combination of nitrogen and Fluorine.

14. A method according to claim 5 wherein step (d) includes additional gasses that become dopants to said DLC layer.

15. A method according to claim 5 wherein said step (d) DLC layer thickness is between 0.142 nm and 200 nm.

16. A method according to claim 5 wherein said DLC layer is a plurality of parallel sp.sup.2 and sp.sup.3 hybridized carbon sheets

17. A method according to claim 5 wherein said step (e) etching comprises: a first predetermined voltage for a first predetermined duration and a second predetermined voltage greater than said first predetermined voltage for a second predetermined duration less than said first predetermined duration.

18. A method of creating an enhanced DLC coating on multipaction prone surfaces comprising: (a) preparing a surface to be coated; (b) etching said surface with an inert gas; (c) coating said etched surface with one or more interlayers with adhesive properties, said top interlayer having a top surface; (d) coating said top interlayer surface with adhesive properties with a DLC coating layer; (e) etching with said DLC coating layer with an inert gas; and (f) coating said DLC layer with a protectant layer.

19. The method of claim 18 wherein said protectant layer of step (f) is a purified material of a composition and thickness to sublimate in a vacuum in less than 24 hours without residue is maintained in a solid state and used as a surface protectant coating.

20.

21. The method of claim 18 wherein the protectant layer of step (f) is condensed onto the surface within the same chamber as the chamber used for etching and/or deposition.

22. The method of claim 18 wherein the protectant layer of step (f) is CO2 in a solid state is used as a surface protectant coating.

23. The method of claim 18 wherein said protectant coating step (f) is condensing a material into a solid state that sublimates onto the DLC coating surface.

24. The method of claim 18 wherein said protectant coating step (f) is condensing a material into a solid state that sublimates onto the DLC coating surface having a further step of maintaining the condensed material in a solid state in a state of evaporative equilibrium.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0044] FIG. 1 is a flowchart of surface preparation steps for preparing a component to be coated with an enhanced multipaction resistant coating.

[0045] FIG. 2 is a flowchart of surface deposition steps for manufacturing a component to be coated with an enhanced multipaction resistant coating.

[0046] FIG. 3 a flow chart of a post deposition step for etching the coated an enhanced multipaction resistant coating.

DETAILED DESCRIPTION OF THE INVENTION

[0047] Prior to proceeding to the more detailed description of the present invention, it should be noted that, for the sake of clarity and understanding, identical components which have identical functions have been identified with identical reference numerals throughout the several views illustrated in the drawing figures.

[0048] FIG. 1 and Flowchart 100 illustrate a flowchart of surface preparation steps for preparing a component to be coated with an enhanced multipaction resistant coating.

[0049] In step 102, an optional ultrasonic cleaning process will begin that will remove surface contaminants such as finger oils, oils, silica dust, etc. The ultrasound cleans the surface of macro contaminants and oils causes their substantial removal, mechanically removing surface contaminants, finger oil, silica dust, manufacturing oils, and manufacturing residues. The ultrasound cleaned device is now typically ready for step 104.

[0050] In step 104, the decision is made to be store the component in a cleaned container or immediately transfer it for the next step in the preparation process. If storage is chosen in step 104, in step 106, the component should optionally be stored in a clean container until it can be transferred.

[0051] In step 108, the component must then be transferred into the etching/deposition chamber using latex gloves or using a clean mechanical apparatus such as tongs, pliers, or a bolt-able attachment transfer assembly, and attaching to surfaces not affected by multipaction such as the outsides of waveguides so that contact with the coating surface is avoided. During this transfer step it is best to minimize touching and use gloves with typically pre-cleaning gloves in alcohol before handling. Especially avoid touching surfaces prone to multipaction, as an example, a device transfer fixture

[0052] In step 110, the device is Argon etched, or etched with another suitable gas such as a different noble gas or chemically active gas or inactive gas to remove surface contaminants. A Chamber dressing or pre-etch liquid precursor may be used before Argon etching the device.

[0053] The Etch removes Oxygen, oxidation, the pre-etch results in enhanced adhesion. The Etch in the deposition system is to better control environment. This is considered Pre-deposition etching.

[0054] In step 112, preparation for the components enhanced multipaction resistant coating is considered complete.

[0055] FIG. 2 and Flowchart 200 illustrate a flowchart of surface deposition steps for manufacturing a component to be coated with an enhanced multipaction resistant coating.

[0056] In step 202, the process of depositions is considered to begin.

[0057] In step 204, the question of is resolved as to whether one or more interlayers are required before deposition of the DLC layer. A Gold, silver, or silicon interlayer may typically be used. Copper typically requires an interlayer, sometimes it is not needed for example if high surface adhesion is not required. Multiple interlayers may be decided to be employed based on substrate materials used and desired adhesion DLC layer. Silane gas or another gas containing silicon may be used to deposit a silicon interlayer.

[0058] In step 206, if an interlayer was decided and needed, a deposition of the inter-layer PECVD/PVD/Hybrid process begins, such as gold, silver, silicon, etc.

[0059] In step 208, it is determined if adding yet another interlayer is required.

[0060] In step 210, the component will then be deposited with the DLC layer using the PECVD/PVD/Hybrid process. A gas containing carbon will be used. Other optional gasses such as nitrogen or Fluorine may also be used to enhance the properties of the DLC layer. For example, Nitrogen incorporated into the layer may be used to strengthen the layer. Alternately, fluorine may be used to change the electro-negativity or hydrophobicity of the surface. Complex geometries and shapes may be coated in this fashion. In step 212, the DLC coating for the component is complete.

[0061] FIG. 3 and Flowchart 300 a post deposition step for etching the coated prepared in step 2 to create an enhanced multipaction resistant coating.

[0062] In step 302, the post deposition etching for the coated component begins

[0063] In step 304, the Argon/noble gasses etching will be initiated. A two-step process has been found effective wherein using initial low voltage etch followed by a high voltage etch. For example, a 200V for 5 minutes and then a high voltage of 500V etch for 90 seconds has been shown to create a suitable etched surface with lower SEE than an unetched surface and even a surface with a SEE below 1.00 which completely eliminates multipaction.

[0064] In step 306, the coated device must then be transferred

[0065] In step 308, the component should be placed in a sealed container with no surface contact.

[0066] In step 310, the component should be placed in storage with an inert atmosphere.

[0067] In step 312, the process of creating an enhanced multipaction resistant coating is complete. A further step may be used to place a protective layer coating overtop the etched DLC coating. The protective layer may be comprised of a material that is easily removed by heating or sublimation. The material which sublimates may be naphthalene or paradichlorobenzene. As an example only, a layer of frozen CO2 gas may be placed overtop the etched DLC coating at reduced ambient temperatures. The layer of frozen CO2 gas may then sublimate into a vacuum such as a space vacuum before the coated surface is exposed to multipaction inducing conditions. In an additional embodiment protectant coating is a deposited by condensing a material in a solid state that sublimates onto the DLC coating surface.

[0068] 1. An additional embodiment is maintaining the condensed material in a solid state in a state of evaporative equilibrium.

[0069] While the device and method of the present invention have been described with respect to preferred embodiments, various modifications and alterations may be made without departing from the spirit and scope of the present invention. The scope of the present invention is defined in the appended claims and equivalents thereto.

[0070] Thus, the present invention has been described in such full, clear, concise and exact terms as to enable any person skilled in the art to which it pertains to make and use the same. It will be understood that variations, modifications, equivalents and substitutions for components of the specifically described embodiments of the invention may be made by those skilled in the art without departing from the spirit and scope of the invention as set forth in the appended claims.