Circuit Integrated Antenna
20220393357 · 2022-12-08
Inventors
Cpc classification
H01Q1/2283
ELECTRICITY
International classification
Abstract
Arranged on a surface of a substrate are a patch conductor that radiates an electromagnetic field having been fed, a feed line that feeds the patch conductor with the electromagnetic field having been input, two slits parallel to the feed line on both sides of a connection part of the feed line toward an inner side of the patch conductor, and a ring conductor at a space from the patch conductor with an interposition of a gap to surround an outer periphery of the patch conductor. Accordingly, an electric capacitance can be formed between the patch conductor and the ring conductor, and when achieving impedance matching with the feed line, adjustment can be performed using the size of the ring conductor and the gap.
Claims
1.-6. (canceled)
7. An antenna integrated with a circuit, the antenna comprising: a feed line disposed on a surface of a substrate; a patch conductor disposed on the surface of the substrate and configured to radiate an electromagnetic field fed from the feed line; two slits disposed parallel to the feed line on both sides of a connection part between the patch conductor and the feed line to extend toward an inner side of the patch conductor; and a ring conductor disposed on the surface of the substrate spaced apart from the patch conductor with an interposition of a first gap to surround an outer periphery of the patch conductor.
8. The antenna according to claim 7, wherein the ring conductor is connected to the feed line.
9. The antenna according to claim 7, wherein the ring conductor is spaced apart from the feed line with an interposition of a second gap.
10. The antenna according to claim 9, wherein the first gap and the second gap communicate with respective ends of the two slits.
11. The antenna according to claim 7, wherein the ring conductor comprises a strip having a constant width.
12. The antenna according to claim 7, wherein the first gap has an annular shape having a constant width.
13. A method of forming an antenna integrated with a circuit, the method comprising: forming a feed line on a surface of the substrate; forming a patch conductor on the surface of the substrate, wherein the patch conductor radiates an electromagnetic field fed from the feed line; forming two slits parallel to the feed line on both sides of a connection part between the patch conductor and the feed line to extend toward an inner side of the patch conductor; and forming a ring conductor on the surface of the substrate spaced apart from the patch conductor with an interposition of a first gap to surround an outer periphery of the patch conductor.
14. The method according to claim 13, further comprising connecting the ring conductor to the feed line.
15. The method according to claim 13, wherein the ring conductor is spaced apart from the feed line with an interposition of a second gap.
16. The method according to claim 15, wherein the first gap and the second gap communicate with respective ends of the two slits.
17. The method according to claim 13, wherein the ring conductor comprises a strip having a constant width.
18. The method according to claim 13, wherein the first gap has an annular shape having a constant width.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
[0037] Next, embodiments of the present invention will be described with reference to the drawings.
First Embodiment
[0038] First, an antenna 10 integrated with a circuit according to a first embodiment of the present invention will be described with reference to
[0039] The antenna 10 integrated with a circuit according to embodiments of the present invention is an antenna formed on a dielectric substrate B constituting an integrated circuit such as a monolithic microwave integrated circuit (hereinafter referred to as an MMIC) through a common semiconductor process technology. Hereinafter, the antenna 10 integrated with a circuit may be referred to as an on-chip antenna.
[0040] As shown in
[0041] The feed line 11 is a transmission line made of a microstrip line as a whole, and is intended to feed the patch conductor 12 and the ring conductor 13 with an externally input high-frequency electromagnetic field. Hereinafter, for ease of description, a direction in which the feed line ii extends on the front surface P (the lateral direction on the sheet of drawing) will be called a direction Y, and a direction orthogonal to the direction Y (the vertical direction on the sheet of drawing) will be called a direction X.
[0042] The patch conductor 12 is an antenna element (radiation element) that radiates an electromagnetic field fed from the feed line 11 with the feed line 11 being connected to a connection part 12B positioned at the center of one side 12A.
[0043] The ring conductor 13 is a conductor arranged at a distance from the patch conductor 12 with the interposition of the gap 14 to surround the outer periphery of the patch conductor 12 in a ring manner. The ring conductor 13 is formed as a strip with a constant width at a distance from the patch conductor 12 by an interval equivalent to the annular gap 14 having a constant width, and has both ends connected to the feed line 11 in proximity to the connection part 12B.
[0044] To achieve impedance matching with the feed line 11, two slits 15A and 15B parallel to the feed line 11 in the direction Y are formed on both sides of the connection part 12B of the patch conductor 12 in a manner extending from the end of the patch conductor 12 toward the inner side. Two ends of the gap 14 are respectively formed to communicate with one end of each of the slits 15A and 15B. The slits 15A and 15B have a length shorter than the width of the patch conductor 12 in the direction Y.
[0045] Hereinafter, a case in which the feed line 11 is formed linearly will be described as an example, but this is not a limitation, and a bent portion, a curved portion, and furthermore, a stub may be provided in the middle. A case in which the outer shape of the patch conductor 12 and the ring conductor 13 presents a generally square shape will be described as an example, but this is not a limitation, and another shape such as a generally rectangular shape or a generally circular shape may be adopted. A case in which the inner shape of the ring conductor 13 presents a generally square shape will be described as an example, but this is not a limitation, and a shape conformed to the outer shape of the patch conductor 12 in such a manner that the gap 14 has a constant width may be adopted. Note that the width of the gap 14 may not be constant along the entire periphery (entire length), but the width at each part may be changed to adjust the field strength distribution of the patch conductor 12.
[0046] A case of using a substrate made of a compound semiconductor such as InP (indium phosphide) as the substrate B will be described as an example, but this is not a limitation, and a common dielectric substrate for use in a high-frequency circuit may be used. A case of using thin films of gold (Au) as thin film conductors such as the feed line 11, the patch conductor 12, and the ring conductor 13 will be described as an example, but this is not a limitation, and common metallic thin film conductors for use in a high-frequency circuit may be used.
[0047] In the antenna 10 integrated with a circuit according to the present embodiment, the ring conductor 13 is arranged to surround the outer periphery of the patch conductor 12 in addition to the slits 15A and 15B at the connection part of the feed line 11, as shown in
Operation Analysis According to the First Embodiment
[0048] Next, analysis results obtained by simulations will be described with reference to
[0049]
[0050] As to the analysis conditions for the antenna 10 integrated with a circuit shown in
[0051] As shown in
[0052] On the other hand, a conventional patch antenna 50 used as a comparison target is composed of a feed line 51, a patch conductor 52, and a stub 53 which are formed on the front surface P of the substrate B, as shown in
[0053] As to analysis conditions for the conventional patch antenna 50 shown in
[0054] As shown in
[0055]
[0056] Directivity: 5.65 dBi
[0057] Gain: 4.97 dBi
[0058] Radiation efficiency: 87.9%
[0059] Overall efficiency: 85.8%
[0060]
[0061] Directivity: 2.74 dBi
[0062] Gain: 2.24 dBi
[0063] Radiation efficiency: 81.6%
[0064] Overall efficiency: 38.3%
[0065] It is understood that, in the conventional patch antenna 50, the radiation electrolytic pattern spreads widely, and the maximum gain is approximately 2.24 dBi, while, with the antenna 10 integrated with a circuit according to the present embodiment, the radiation electrolytic pattern spreads little, and the electromagnetic field is efficiently radiated upward. It is also understood that the maximum gain is 4.97 dBi, which is more than or equal to twice that of the conventional patch antenna 50, and a significant improvement is obtained.
[0066]
[0067] It is also understood that, with the antenna 10 integrated with a circuit according to the present embodiment, the bandwidth at radiation can be widened by reducing the ring size RingWidth of the ring conductor 13 as shown in
[0068] With the antenna 10 integrated with a circuit according to the present embodiment, a resonance mode on the ring conductor 13 side can be changed by changing the ring size RingWidth of the ring conductor 13 as shown in
Effects of the First Embodiment
[0069] As described above, in the present embodiment, the ring conductor 13 is arranged at a distance from the patch conductor 12 with the interposition of the gap 14 to surround the outer periphery of the patch conductor 12, in addition to the slits 15A and 15B at the connection part of the feed line 11.
[0070] This enables an electric capacitance to be formed between the patch conductor 12 and the ring conductor 13, that is, at the gap 14. Therefore, when achieving impedance matching with the feed line 11, adjustment can be performed using the size of the ring conductor 13 and the gap 14 in addition to the size of the slits 15A and 15B. Therefore, in the design procedure of the antenna 10 integrated with a circuit, high control flexibility can be obtained for the central frequency, bandwidth, directivity, gain, and the like.
[0071] Consequently, the field distribution of the antenna 10 integrated with a circuit can be prevented from spreading and can be stabilized to improve the directivity. Since this enables the directivity and gain of the on-chip antenna to be improved significantly, wireless communication can be performed at a longer distance. Since a broadband radiation property is obtained, the amount of information that can be transmitted increases, so that a larger capacity of wireless communication in the millimeter wave band/terahertz band throughout the whole system can be expected. On the other hand, from the perspective of chip design, the high design flexibility enables the central frequency/bandwidth of the radiation property to be changed without changing basic design elements such as the configuration and size of the antenna. Impedance matching can be easily achieved merely through parameter optimization without using a stub or the like.
[0072] The antenna 10 integrated with a circuit according to the present embodiment has been described from the perspective of individual design, but this is not a limitation, and a plurality of antennas 10 integrated with circuits may be disposed into an array. On that occasion, since an antenna element having a better directivity can relieve a problem such as electromagnetic field coupling between elements, the element interval can be made smaller than in the conventional patch antenna, and size reduction and improvement of beam controllability can be expected.
Second Embodiment
[0073] Next, the antenna 10 integrated with a circuit according to a second embodiment of the present invention will be described with reference to
[0074] The antenna 10 integrated with a circuit according to the present embodiment will be described as to a case in which the ring conductor 13 is electrically separated from the feed line 11 to be brought into a passive state as shown in
[0075] In other words, in the antenna 10 integrated with a circuit according to the present embodiment, the ring conductor 13 is formed as a strip at a distance from the patch conductor 12 by an interval equivalent to the annular gap 14 having a constant width as shown in
Analysis Results According to the Second Embodiment
[0076] Next, analysis results obtained by simulations for the antenna 10 integrated with a circuit according to the present embodiment and the conventional patch antenna will be described with reference to
[0077] As to the analysis conditions for the antenna 10 integrated with a circuit shown in
[0078] As shown in
[0079]
[0080] Directivity: 5.9 dBi
[0081] Gain: 5.07 dBi
[0082] Radiation efficiency: 85.9%
[0083] Overall efficiency: 85.1%
[0084] It is understood that, with the antenna 10 integrated with a circuit according to the present embodiment, spread of the radiation electrolytic pattern is kept small, and the electromagnetic field is efficiently radiated upward, similarly to
[0085]
[0086]
[0087] The field strength distribution within the antenna surface used in
[0088] On the other hand, it is understood that the field strength concentrates on the line between the slits 15A and 15B and between the gaps 16A and 16B in the antenna 10 integrated with a circuit according to the present embodiment as shown in
[0089] In the antenna 10 integrated with a circuit according to the present embodiment, the central frequency and bandwidth are adjustable by mainly changing the patch size Pat of the patch conductor 12 and the ring size RingWidth of the ring conductor 13, similarly to the first embodiment. Specifically, as the patch size Pat is larger, the central frequency is lower, and as the patch size Pat is smaller, the central frequency is higher. As the ring size RingWidth is larger, the bandwidth is narrower, and as the ring size RingWidth is smaller, the bandwidth is wider.
[0090] By changing the patch size Pat and the ring size RingWidth of the ring conductor 13, the central frequency and bandwidth can be optimized.
[0091]
[0092] Directivity: 5.65 dBi
[0093] Gain: 4.97 dBi
[0094] Radiation efficiency: 75.5%
[0095] Overall efficiency: 69.6%
[0096] This optimization enables the central frequency and bandwidth to be maximized to a degree that resonance points are not excessively apart from each other to increase the radiation property in band. Accordingly, the bandwidth is 8 GHz in the property shown in
[0097] By changing the interval between the ring conductor 13 and the feed line 11, that is, the width of the gaps 16A and 16B, the central frequency of the radiation property can be adjusted. Note that, in the case of changing the width of the gaps 16A and 16B, the field strength concentrated on the vicinity of the gaps 16A and 16B is also changed, and therefore, the balance with the directivity needs to be considered.
Effects of the Second Embodiment
[0098] As described above, in the present embodiment, the ring conductor 13 is arranged to be electrically isolated from the feed line 11 and the patch conductor 12.
[0099] Accordingly, the field strength in the vicinity of the connection part 12B can be increased, and the field distribution concentrated on each of four, i.e., the upper, lower, left, and right, surfaces of the patch conductor 12 can be equalized to improve and stabilize the directivity further.
Extension of Embodiments
[0100] The present invention has been described above referring to the embodiments, but the present invention is not limited to the above embodiments. The configuration and details of the present invention can be subjected to various modifications that can be understood by those skilled in the art within the scope of the present invention. The respective embodiments can be implemented in combination arbitrarily within a consistent range.
REFERENCE SIGNS LIST
[0101] 10 antenna integrated with circuit
[0102] 11 feed line
[0103] 12 patch conductor
[0104] 12A one side
[0105] 12B connection part
[0106] 13 ring conductor
[0107] 14 gap (first gap)
[0108] 15A, 15B slit
[0109] 16A, 16B gap (second gap)
[0110] B substrate
[0111] P front surface
[0112] R bottom surface
[0113] GND ground plane