Tinsel Wire Structure and Manufacturing Method Thereof
20190088385 ยท 2019-03-21
Inventors
Cpc classification
H01B13/22
ELECTRICITY
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
H01B7/04
ELECTRICITY
B32B15/20
PERFORMING OPERATIONS; TRANSPORTING
B32B3/26
PERFORMING OPERATIONS; TRANSPORTING
B32B5/02
PERFORMING OPERATIONS; TRANSPORTING
B32B15/02
PERFORMING OPERATIONS; TRANSPORTING
B32B15/14
PERFORMING OPERATIONS; TRANSPORTING
B32B2255/02
PERFORMING OPERATIONS; TRANSPORTING
H01B5/14
ELECTRICITY
H01B7/30
ELECTRICITY
International classification
H01B5/00
ELECTRICITY
B32B15/02
PERFORMING OPERATIONS; TRANSPORTING
H01B13/22
ELECTRICITY
B32B15/20
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A tinsel wire structure and a manufacturing method thereof are provided. The tinsel wire structure has a core, a conductive layer and a metal cladding layer. The core has an outer surface and defines a length direction. The conductive layer is spirally wound along the length direction on the outer surface of the core. The metal cladding layer is provided on the periphery of the conductive layer to cover the core and the conductive layer. The conductive layer is spirally wound on the outer surface of the core in a non-overlapping manner to define a gap so that the gap is spirally wound on the outer surface of the core in a non-overlapping manner. When the metal cladding layer covers the core and the conductive layer, the metal cladding layer covers the gap at the same time.
Claims
1. A tinsel wire structure, comprising: a core, having an outer surface and defining a length direction; a conductive layer, spirally wound along the length direction on the outer surface of the core; and a metal cladding layer, being provided on a periphery of the conductive layer to cover the core and the conductive layer; wherein the conductive layer is spirally wound on the outer surface of the core in a non-overlapping manner to define a gap so that the gap is spirally wound on the outer surface of the core in a non-overlapping manner, and when the metal cladding layer covers the core and the conductive layer, the metal cladding layer covers the gap at the same time.
2. The tinsel wire structure of claim 1, wherein the core is a fibrous core, and the conductive layer is a metal foil.
3. The tinsel wire structure of claim 2, wherein the metal foil defines a first width along the length direction, the gap defines a second width along the length direction, and a ratio of the first width to the second width ranges between 10:1 and 15:1.
4. The tinsel wire structure of claim 2, wherein the metal foil has a thickness ranging between 0.01 mm and 0.05 mm.
5. The tinsel wire structure of claim 2, wherein the metal foil is a copper alloy foil.
6. The tinsel wire structure of claim 5, wherein the copper alloy foil is a tin-copper alloy foil, a silver-copper alloy foil or an iron-copper alloy foil.
7. The tinsel wire structure of claim 1, wherein the metal cladding layer is provided on the periphery of the conductive layer through a hot dipping process.
8. The tinsel wire structure of claim 7, wherein a liquid metal used in the hot dipping process is liquid tin.
9. A manufacturing method of a tinsel wire structure, comprising the following steps: providing a core that has an outer surface and defines a length direction; spirally winding a conductive layer along the length direction of the core on the outer surface of the core; and forming a metal cladding layer on a periphery of the conductive layer to cover the core and the conductive layer; wherein the conductive layer is spirally wound on the outer surface of the core in a non-overlapping manner to define a gap so that the gap is spirally wound on the outer surface of the core in a non-overlapping manner, and when the metal cladding layer covers the core and the conductive layer, the metal cladding layer covers the gap at the same time.
10. The manufacturing method of claim 9, wherein the core is a fibrous core, and the conductive layer is a metal foil.
11. The manufacturing method of claim 10, wherein the metal foil is a copper alloy foil.
12. The manufacturing method of claim 11, wherein the copper alloy foil is a tin-copper alloy foil, a silver-copper alloy foil or an iron-copper alloy foil.
13. The manufacturing method of claim 9, wherein the metal cladding layer is provided on the periphery of the conductive layer through a hot dipping process.
14. The manufacturing method of claim 13, wherein a liquid metal used in the hot dipping process is liquid tin.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0013]
[0014]
[0015]
[0016]
[0017]
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0018] As shown in
[0019] As shown in the embodiment of
[0020] In detail, as shown in cross-sectional views of
[0021] In the tinsel wire structure 10 of the present invention, the core 20 is a fibrous core so that the core 20 has a characteristic of being resistant to high temperature and bending, while the conductive layer 30 is a metal foil. Still referring to
[0022] In a preferred embodiment of the present invention, as shown in
[0023] In order to make the metal cladding layer 40 provided on the periphery of the tinsel wire structure 10 really and completely cover the core 20, the conductive layer 30 and the gap 32, the metal cladding layer 40 of the present invention is provided to cover the periphery of the conductive layer 30 through a hot dipping process, and a liquid metal used in the hot dipping process is liquid tin.
[0024] Therefore, as shown in
[0025] On the other hand, after the transmission path of the signal is reduced, the heat generated during the transmission process will accordingly be reduced so that the tinsel wire structure 10 of the present invention may also have the following advantage of: being capable of effectively preventing the softening of the conductive layer 30 and increasing the flexibility thereof.
[0026] As shown in
[0027] Like the above description of the tinsel wire structure 10, in the manufacturing method of the tinsel wire structure 10, the core 20 is a fibrous core so that the core 20 has a characteristic of being resistant to high temperature and bending, while the conductive layer 30 is a metal foil. The metal foil for forming the conductive layer 30 is preferably a copper alloy foil, and the copper alloy foil is a tin-copper alloy foil, a silver-copper alloy foil or an iron-copper alloy foil.
[0028] On the other hand, in order to make the metal cladding layer 40 provided on the periphery of the tinsel wire structure 10 really and completely cover the core 20, the conductive layer 30 and the gap 32, the metal cladding layer 40 of the present invention is provided to cover the periphery of the conductive layer 30 through a hot dipping process, and a liquid metal used in the hot dipping process is liquid tin.
[0029] According to the above descriptions, by the arrangement of the metal cladding layer in the tinsel wire structure and a manufacturing method thereof disclosed in the present invention, the signal can be transmitted in a nearly linear manner, thereby reducing the generation of waste heat and effectively preventing the softening of the conductive layer to increase the flexibility thereof. Furthermore, the metal cladding layer provided through the hot dipping process can also effectively avoid the increase in the overall wire diameter of the tinsel wire structure so that the overall wire diameter of the tinsel wire structure still remains at a relatively small size to meet customized requirements of different manufacturers.
[0030] The above disclosure is related to the detailed technical contents and inventive features thereof. People skilled in this field may proceed with a variety of modifications and replacements based on the disclosures and suggestions of the invention as described without departing from the characteristics thereof. Nevertheless, although such modifications and replacements are not fully disclosed in the above descriptions, they have substantially been covered in the following claims as appended.