DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

Abstract

A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewalls within the cavity and is spaced apart from the package bottom. Sensors are attached to a top surface of the plate on opposite sides of an opening. Wire bondings electrically connect pads on a top face of the sensor to corresponding pads on a top face of the integrated circuit, for example by passing through the opening in the plate or passing past a side end of the plate. A lid extends across and between the sidewalls to close the cavity.

Claims

1. A sensor package, comprising: a packaging comprising a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, wherein the first, second, third, and fourth sidewalls and the package bottom define a cavity; an integrated circuit attached to the package bottom; a plate extending between at least two of the sidewalls within the cavity and being spaced apart from the package bottom; at least one sensor attached to a top surface of the plate; wire bondings electrically connecting pads on a top face of the at least one sensor to corresponding pads on a top face of the integrated circuit; and a lid extending across and between the first, second, third, and fourth sidewalls to thereby close the cavity.

2. The sensor package of claim 1, wherein the plate extends between the first and second sidewalls and has an opening formed therein; and wherein the wire bondings pass through the opening to electrically connect the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit.

3. The sensor package of claim 2: wherein the first sidewall comprises a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf; wherein the second sidewall comprises a first portion extending upwardly from the second side of the package bottom and a second portion extending upwardly from a distal end of the second portion, with the second portion of the second sidewall being thinner than the first portion of the second sidewall in a stair-stepped shape so as to define a second support shelf; and wherein the plate is carried by and extends between the first and second support shelves.

4. The sensor package of claim 1: wherein the plate extends between the first and second sidewalls and has an opening formed therein; wherein the at least one sensor comprises first and second sensors attached to the top surface of the plate on opposite sides of the opening; and wherein the wire bondings comprise: first wire bondings passing through the opening to electrically connect the pads on the top face of the first sensor to the corresponding pads on the top face of the integrated circuit; and second wire bondings passing through the opening to electrically connect the pads on the top face of the second sensor to the corresponding pads on the top face of the integrated circuit.

5. The sensor package of claim 1, wherein the packaging and plate are constructed from ceramic.

6. The sensor package of claim 1, wherein the lid is constructed from metal.

7. The sensor package of claim 1, wherein the integrated circuit is an application specific integrated circuit (ASIC).

8. The sensor package of claim 1, further comprising: vias formed within the package bottom to electrically connect pads on a top surface of the package bottom to corresponding pads on a bottom surface of the package bottom; and additional wire bondings electrically connecting the pads on the top surface of the package bottom to corresponding pads on the top face of the integrated circuit.

9. The sensor package of claim 1, wherein the plate extends between the third and fourth sidewalls, adjacent to the first sidewall; and wherein the wire bondings extend past a side end of the plate to electrically connect the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit.

10. The sensor package of claim 9, wherein the plate is sized to extend outwardly from the first sidewall toward the second sidewall but not reach the second sidewalls.

11. The sensor package of claim 9: wherein the first sidewall comprises a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf; and wherein the plate is carried by the first support shelf.

12. The sensor package of claim 11, wherein the second sidewall has a substantially constant thickness.

13. The sensor package of claim 1: wherein the plate extends between the third and fourth sidewalls, adjacent to the first sidewall, with the plate being sized to extend outwardly from the first sidewall toward the second sidewall but not reach the second sidewall; wherein the at least one sensor comprises first and second sensors attached to the top surface of the plate; and wherein the wire bondings comprise: first wire bondings extending past a side end of the plate to electrically connect the pads on the top face of the first sensor to the corresponding pads on the top face of the integrated circuit; and second wire bondings extending past the side end of the plate to electrically connect the pads on the top face of the second sensor to the corresponding pads on the top face of the integrated circuit.

14. A method, comprising: a) attaching an integrated circuit to a top surface of a package bottom of a package; b) attaching at least one sensor to a top surface of a plate on opposite sides of an opening formed in the plate; c) mounting the plate between sidewalls of the package in a spaced apart fashion from the top surface of the package bottom; d) electrically connecting pads on a top face of the at least one sensor to corresponding pads on a top face of the integrated circuit using wire bondings; and e) affixing a lid to extend across and between the sidewalls to thereby close a cavity within the package defined by the sidewalls and the package bottom.

15. The method of claim 14, wherein electrically connecting the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit includes passing the wire bondings through an opening in the plate.

16. The method of claim 15, further comprising, prior to a), providing the package as having a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom; and wherein, in c), the plate is mounted to extend at least between the first and second sidewalls.

17. The method of claim 16, wherein the package is provided as having the first sidewall formed by a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf, and as having the second sidewall formed by a first portion extending upwardly from the second side of the package bottom and a second portion extending upwardly from a distal end of the second portion, with the second portion of the second sidewall being thinner than the first portion of the second sidewall in a stair-stepped shape so as to define a second support shelf; and wherein, in c), the plate is mounted between the sidewalls of the package by affixing a bottom surface of the plate to the first and second support shelves.

18. The method of claim 14, further comprising, prior to c), electrically connecting pads on the top surface of the package bottom to corresponding pads on the top face of the integrated circuit using additional wire bondings.

19. The method of claim 14, wherein electrically connecting the pads on the top face of the at least one sensor to the corresponding pads on the top face of the integrated circuit includes passing the wire bondings past a side end of the plate.

20. The method of claim 19, further comprising, prior to a), providing the package as having a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom; and wherein, in c), the plate is mounted to extend from the first sidewall.

21. The method of claim 20, wherein the package is provided as having the first sidewall formed by a first portion extending upwardly from the first side of the package bottom and a second portion extending upwardly from a distal end of the first portion, with the second portion being thinner than the first portion in a stair-stepped shape so as to define a first support shelf; and wherein, in c), the plate is mounted between the sidewalls of the package by affixing a bottom surface of the plate to the first support shelf.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a perspective view of a sensor package described herein.

[0029] FIG. 2 is a cross sectional view of a sensor package described herein, showing the mounting of the sensors and ASIC within the package.

[0030] FIG. 3 is a top view of the sensor package of FIG. 2 with the lid removed.

[0031] FIG. 4 is a top view of the sensor package of FIG. 2 with the ceramic plate removed.

[0032] FIG. 5A is a cross sectional view of the package itself of the sensor package of FIG. 2 at the beginning of a manufacturing process flow.

[0033] FIG. 5B is a cross sectional view of the sensor package of FIG. 2 during manufacturing with the ASIC mounted to the top surface of the bottom of the package.

[0034] FIG. 5C is a cross sectional view of the sensor package of FIG. 2 during manufacture after wire bonding has been formed between pads on the ASIC and pads on the bottom of the package.

[0035] FIG. 5D is a cross sectional view of the sensor package of FIG. 2 during manufacture, with the ceramic plate carrying the sensors having been mounted on the supports defined within the sensor package.

[0036] FIG. 5E is a cross sectional view of the sensor package of FIG. 2 during manufacture after wire bonding has been formed between pads on the sensors and the pads on ASIC.

[0037] FIG. 5F is a cross sectional view of the sensor package of FIG. 2 during manufacture after the lid has been affixed to the package.

[0038] FIG. 6 is a cross sectional view of a variation of the sensor package of FIG. 2 in which the ceramic plate does not extend completely across the interior of package and instead forms a shelf carrying the sensors.

[0039] FIG. 7 is a top view of the sensor package of FIG. 6 with the lid removed.

[0040] FIG. 8 is a top view of the sensor package of FIG. 6 with the ceramic plate removed.

[0041] FIG. 9A is a cross sectional view of the package itself of the sensor package of FIG. 6 at the beginning of a manufacturing process flow.

[0042] FIG. 9B is a cross sectional view of the sensor package of FIG. 6 during manufacturing with the ASIC mounted to the top surface of the bottom of the package.

[0043] FIG. 9C is a cross sectional view of the sensor package of FIG. 6 during manufacture after wire bonding has been formed between pads on the ASIC and pads on the bottom of the package.

[0044] FIG. 9D is a cross sectional view of the sensor package of FIG. 6 during manufacture, with the ceramic plate carrying the sensors having been mounted on the support defined within the sensor package.

[0045] FIG. 9E is a cross sectional view of the sensor package of FIG. 6 during manufacture after wire bonding has been formed between pads on the sensors and the pads on ASIC.

[0046] FIG. 9F is a cross sectional view of the sensor package of FIG. 6 during manufacture after the lid has been affixed to the package.

[0047] FIG. 10 is a cross sectional view of another sensor package described herein, showing the mounting of the sensors and ASIC within the package.

[0048] FIG. 11A is a cross sectional view of the ceramic plate of the sensor package of FIG. 10 during manufacture, with the ceramic plate having the ASIC embedded therein.

[0049] FIG. 11B is a cross sectional view of the ceramic plate of the sensor package of FIG. 10 during manufacture with a second sensor mounted to the bottom surface of the ceramic plate.

[0050] FIG. 11C is a cross sectional view of the sensor package of FIG. 10 during manufacture after wire bonding has been formed between the second sensor and the plate.

[0051] FIG. 11D is a cross sectional view of the sensor package of FIG. 10 during manufacture after flipping.

[0052] FIG. 11E is a cross sectional view of the sensor package of FIG. 10 during manufacture after mounting of a first sensor to the top surface of the ceramic plate.

[0053] FIG. 11F is a cross sectional view of the sensor package of FIG. 10 during manufacture after wire bonding has been formed between the first sensor and the ASIC.

[0054] FIG. 11G is a cross sectional view of the sensor package of FIG. 10 during manufacture after the ceramic plate has been mounted on the supports defined within the sensor package and wire bonding has been formed between the plate and the bottom of the sensor package.

[0055] FIG. 11H is a cross sectional view of the sensor package of FIG. 10 during manufacture after the lid has been affixed to the package.

[0056] FIG. 12 is a cross sectional view of yet another sensor package described herein, showing the mounting of the sensors and ASIC within the package.

[0057] FIG. 13A is a cross sectional view of the ceramic plate of the sensor package of FIG. 12 during manufacture, with the ceramic plate having the ASIC embedded therein.

[0058] FIG. 13B is a cross sectional view of the ceramic plate of the sensor package of FIG. 12 during manufacture with first and second sensors mounted to the top surface of the ceramic plate.

[0059] FIG. 13C is a cross sectional view of the sensor package of FIG. 12 during manufacture after wire bonding has been formed between the sensors and the ASIC.

[0060] FIG. 13D is a cross sectional view of the sensor package of FIG. 12 during manufacture after the ceramic plate has been mounted on the supports defined within the sensor package and wire bonding has been formed between the plate and the bottom of the sensor package.

[0061] FIG. 13E is a cross sectional view of the sensor package of FIG. 12 during manufacture after the lid has been affixed to the package.

[0062] FIG. 14A-14B are a series of contour plots comparing the stresses placed on the sensors in prior art packages after soldering to the stresses placed in the sensors in the packages disclosed herein after soldering.

DETAILED DESCRIPTION

[0063] The following disclosure enables a person skilled in the art to make and use the subject matter disclosed herein. The general principles described herein may be applied to embodiments and applications other than those detailed above without departing from the spirit and scope of this disclosure. This disclosure is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed or suggested herein. In addition, in the below description, where any individual wire bonding connecting two pads is described, understand there may instead be multiple such wire bondings connected between a corresponding number of pads on the same surfaces/faces/devices in the same fashion.

[0064] Now described with initial reference to FIGS. 1-4 is a sensor package 10. The sensor package 10 includes a package 11 that is shaped as a rectangular box with an open top defining a cavity 19, with a lid 12 affixed over the open top of the package 11 to close the cavity 19. The package 11 is constructed from ceramic and the lid 12 is constructed from either metal or ceramic.

[0065] The interior of the package 11 includes four sidewalls, with two of the sidewalls 11a, 11b opposite each other across the bottom 11c of the package 11 being shown in the cross section of FIG. 2, and the two other sidewalls not being shown but have, in an embodiment, a shape and configuration like that of sidewalls 11a, 11b. The sidewall 11a is formed as a thick portion 18a extending upwardly from the package bottom 11c and a thin portion 18b extending upwardly from the thick portion 18a in a stair-stepped shape to define a support shelf 15a. Similarly, the sidewall 11b is formed as a thick portion 18c extending upwardly from the package bottom 11c and a thin portion 18d extending upwardly from the thin portion 18c in a stair-stepped shape to define a support shelf 15b. A plate 16 is supported within the cavity 19 by the support shelves 15a, 15b that the bottom surface of the plate 16 is adhesively bonded to, with the plate extending between the support shelves 15a, 15b. The plate 16 is sized to fully close off a lower portion of the cavity 19 (the lower portion of the cavity being the portion of the cavity below the support shelves 15a, 15b) and has an opening 25 defined therein.

[0066] An application specific integrated circuit (ASIC) 20 is attached to the upper surface of the package bottom 11c, with wire bonding 20a connecting pad 20f on the top face of the ASIC 20 to pad 20b and via 20c within the package bottom 11c of the package that are in turn connected to dual-flat no lead (DFN) pad 13 on the bottom surface of the package bottom 11c. A first sensor 21 is attached to the top surface of the plate 16 adjacent the support shelf 15a, and a second sensor 22 is attached to the top surface of the plate 16 adjacent the support shelf 15b. The first sensor 21 may be a microelectromechanical systems (MEMS) device such as an accelerometer, and the second sensor 22 may be another MEMS device such as a gyroscope.

[0067] Indeed, the sensors 21, 22 are silicon based and may be any suitable sensors that either include mechanical components (e.g., MEMS components, optical components, etc.) or electrical components sensitive to the piezoelectric effect (e.g., at least one piezo-resistor and/or a Hall effect sensor).

[0068] A wire bonding 21a passes through the opening 25 in the plate 16 to connect pad 21b on the top face of the sensor 21 to corresponding pad 20d on the top face of the ASIC 20, and a wire bonding 22a passes through the opening 25 in the plate 16 to connect pad 22b on the top face of the sensor 22 to corresponding pad 20e on the top face of the ASIC 20.

[0069] To ease a full understanding, a top plan view of the plate 16 with the sensors 21, 22 attached to the top surface thereof opposite to each other across the opening 25 is shown in FIG. 3, with the various wire bondings not being shown for ease of reading. Likewise, a top plan view of the package bottom 11c showing the placement of the ASIC 20 and the support shelves 15a, 15b is shown in FIG. 4, with the various wire bondings not being shown for ease of reading.

[0070] As a result of soldering the sensor package 10 to a printed circuit board (PCB), mechanical stresses (e.g., normal and/or shear stresses, generally lateral but also out of plane) are applied to the sensor package 10. The advantage of the design of the sensor package 10 is that while mechanical stresses placed on the package 11 are imparted to the package bottom 11c through the mechanical connection to the PCB, those mechanical stresses are not ultimately passed through to the plate 16, and are therefore not imparted to the sensors 21, 22 on the top surface of the plate 16. While the ASIC 20 will be subjected to the stresses imparted to the package 11 (which are transmitted to the ASIC 20 through its connection to the top surface of the package bottom 11c), the ASIC contains solely electrical components and does not contain mechanical components, and as such its proper operation is not impacted.

[0071] This design of the sensor package 10 therefore results in a significant reduction in stresses passed to the sensors 21, 22, contributing to a longer service life and more predictable behavior. In addition, the performance of the sensors 21, 22 themselves may be increased, as their performance will be similar to what it would be if the sensor package 10 was a standalone device and not attached to a PCB. This in turn may help reduce the amount of testing to be performed.

[0072] Additional designs and process flows for forming those designs (as well as the design of FIG. 2) will be described below, with it being understood that those designs have the same benefits and advantages as that of the sensor package 10 of FIG. 2 described hereinabove.

[0073] Now described with reference to FIGS. 5A-5F is a process flow for forming the sensor package 10 of FIG. 2. The process flow begins with the provision or formation of the package 11, as shown in FIG. 5A. Thereafter, the ASIC 20 is attached to the top surface of the package bottom 11c and the sensors 21, 22 are attached to the top surface of the plate 16 on opposite sides of the opening 25, as shown in FIG. 5B.

[0074] Wire bonding 20a is then used to connect pad 20f on the top face of the ASIC 20 to corresponding pad 20b and via 20c on the top surface of the package bottom 11c, as shown in FIG. 5C, and then the assembled plate 16 is mounted within the package 11 such that it is affixed to and extends between the support shelves 15a, 15b, as shown in FIG. 5D. This mounting of the plate 16 is accomplished by dispensing adhesive on the support shelves 15a, 15b, positioning the plate 16 into the appropriate place, and then performing a curing. Next, wire bondings 21a, 22a are passed through the opening 25 and used to connect pads 21b, 22b on the top faces of the sensors 21, 22 to corresponding pads 20d, 20e on the top face of the ASIC 20, as shown in FIG. 5E. As should be understood, the opening 25 is sized and shaped so as to provide access to the top face of the ASIC 20 and allow for the wirebonding tool to form the desired wire bond connections.

[0075] The lid 12 is then affixed over the tops of the sidewalls 11a, 11b to seal off the cavity 19 within the package 11, as shown in FIG. 5F. This completes the formation of the sensor package 10.

[0076] An alternative to the design of the sensor package 10 is now described with reference to FIG. 6. In this alternative, instead of the plate 16 extending completely across the cavity 19 between shelves 15a, 15b, the plate 16 may be shorter in length and affixed to just one shelf 15a, as shown in the sensor package 10 of FIG. 6. Notice that in this instance, the sidewall 11b is constant in thickness, and the shelf 15b (of FIG. 2) is not present. Again, the other sidewalls are not shown but in an embodiment may be constructed similar to each sidewall 11a or sidewall 11b. Through this design, an opening need not be formed in the plate 16 since a portion of the chamber will be left open adjacent the plate 16. Thus, here, the wire bondings 21a, 22b extend past the side end of the shelf 15a to connect pads 21b, 22b on the top faces of the sensors 21, 22 to corresponding pads 20d, 20e on the top face of the ASIC 20. As can be observed in the top plan view of the plate 16 in FIG. 7, both sensors 15a, 15b are carried by the plate 16 adjacent the sidewall 11a. In addition, as can be observed in the top plan view of the package bottom 11c in FIG. 8, the ASIC 20 is positioned adjacent to the sidewall 11b to permit the wire bondings 21a, 22b to easily reach its pads.

[0077] Now described with reference to FIGS. 9A-9F is a process flow for forming the sensor package 10 of FIG. 6. The process flow begins with the provision or formation of the package 11, as shown in FIG. 9A. Thereafter, the ASIC 20 is attached to the top surface of the package bottom 11c and the sensors 21, 22 are attached to the top surface of the plate 16 adjacent to each other, as shown in FIG. 9B.

[0078] Wire bonding 20a is then used to connect pad 20d on the top face of the ASIC 20 to corresponding pad 20b on the top surface of the package bottom 11c, as shown in FIG. 9C, and then the assembled plate 16 is mounted within the package 11 such that it rests on the support shelf 15a, as shown in FIG. 9D. This mounting of the plate 16 is accomplished by dispensing adhesive on the support shelf 15a positioning the plate 16 into the appropriate place, and then performing a curing. Next, wire bondings 21a, 22a are passed past the side end of the plate 16 and used to connect pads 21b, 22b on the top faces of the sensors 21, 22 to pads 20d, 20e on the top face of the ASIC 20, as shown in FIG. 9E. The lid 12 is then affixed over the tops of the sidewalls 11a, 11b to seal off the cavity 19 within the package 11, as shown in FIG. 9F. This completes the formation of the sensor package 10.

[0079] Other embodiments of sensor packages and process flows for manufacturing those embodiments are now described. Beginning with the embodiment of the sensor package 10 of FIG. 10, the ASIC 20 may be embedded within the plate 16, with the sensors 21 and 22 being attached to opposite faces of the ASIC 20 (wherein techniques known to those skilled in the art are used for encapsulating the ASIC 20 within the plate with coplanar upper and lower surfaces). In greater detail, as shown, the plate 16 is affixed to and extends across the tops of the sidewalls 11a, 11b to seal off the cavity 19, with the ASIC 20 being embedded in a central location within the plate 16. Sensor 21 is attached to the top face of the ASIC 20 and wire bonding 21a is connected to and extends between pad 21b on the top face of the sensor 21 and corresponding pad 20d on the top face of the ASIC 20. A wire bonding 20j connects pad 20i on the top face of ASIC 20 to pad 20k on the top surface of the plate 16. Pad 20k on the top surface of the plate 16 is connected to pad 20m on the bottom surface of the plate 16 by via 20l, and wire bonding 20a connects pad 20m on the bottom surface of the plate 16 to pad 20b on the top surface of the bottom 11c of the package 11. Sensor 22 is attached to the bottom face of the ASIC 20 and wire bonding 22a is connected to and extends between pad 22b on the top face of the sensor 22 and corresponding pad 20n on the bottom surface of the plate 16. Via 20g connects pad 20n on the bottom surface of the plate 16 to pad 20o on the top surface of the plate 16, and a wire bonding 20h connects the pad 20o on the top surface of the plate 16 to corresponding pad 20e on the top face of the ASIC 20.

[0080] Now described with reference to FIGS. 11A-11F is a process flow for forming the sensor package 10 of FIG. 10. The process flow begins with the provision of formation of the plate 16 as having the ASIC 20 embedded therein, as shown in FIG. 11A. Thereafter, the sensor 22 is attached to the bottom face of the ASIC 20, as shown in FIG. 11B, and then a wire bonding 22a is connected to and extends between pad 22b on the top face of the sensor 22 and corresponding pad 20f on the bottom face of the plate 16, as shown in FIG. 11C.

[0081] Next, the plate 16 is flipped, as shown in FIG. 11D, and the sensor 21 is attached to the top face of the ASIC 20, as shown in FIG. 11E. After that, a wire bonding 21a is connected to and extends between pad 21b on the top face of the sensor 21 and pad 20d on the top face of the ASIC 20, as shown in FIG. 11F. Additionally, wire bonding 20j connects pad 20i on the top face of the ASIC 20 to pad 20k on the top surface of the plate 16. The assembled plate 16 is mounted within the package 11 such that it rests on and extends between the support shelves 15a, 15b, as shown in FIG. 11G. This mounting of the plate 16 is accomplished by dispensing adhesive on the support shelves 15a, 15b, positioning the plate 16 into the appropriate place, and then performing a curing. During this step, a wire bonding 20a is connected to and extends between pad 20m on the bottom face of the ASIC 20 and pad 20b on the top surface of the package bottom 11c. The lid 12 is then affixed over the tops of the sidewalls 11a, 11b to seal off the cavity 19 within the package 11, as shown in FIG. 11H, thereby completing formation of the sensor package 10.

[0082] Instead of the sensors 21, 22 being attached to opposite faces of the ASIC 20 as in the sensor package 10 of FIG. 10, they may instead be attached to the same face of the ASIC 20 as shown in the sensor package 10 of FIG. 12. In greater detail, as shown, the plate 16 is affixed to and extends across the tops of the sidewalls 11a, 11b to seal off the cavity 19, with the ASIC 20 being embedded in a central location within the plate 16. Sensors 21, 22 are attached to the top face of the ASIC 20. Wire bonding 21a is connected to and extends between the pad 21b on top face of the sensor 21 and corresponding pad 20d on the top face of the ASIC 20, and sensor 22 is attached to the top face of the ASIC 20 opposite to the sensor 21 and wire bonding 22a is connected to and extends between pad 22b on the top face of the sensor 22 and corresponding pad 20e on the top face of the ASIC 20. Wire bonding 20j connects pad 20j on the top face of the ASIC 20 to pad 20k on the top surface of the plate 16. Wire bonding 20a connects pad 20m on the bottom surface of the plate 16 to pad 20b on the top surface of the bottom 11c of the package 11. Via 20l connects pad 20k on the top surface of the plate 16 to pad 20m on the bottom surface of the plate 16. Via 20c connects pad 20b on the top surface of the bottom 11c of the package 11 to pad 13 on the bottom surface of the bottom 11c of the package 11.

[0083] Now described with reference to FIGS. 13A-13E is a process flow for forming the sensor package 10 of FIG. 12. The process flow begins with the provision of formation of the plate 16 as having the ASIC 20 embedded therein, as shown in FIG. 13A. Thereafter, the sensors 21, 22 are attached to the top face of the ASIC 20, as shown in FIG. 13B, and then wire bondings 21a, 22a are connected to and extending between pads 21a, 22a on the top faces of the sensors 21, 22 and corresponding pads 20d, 20e on the top face of the ASIC 20, as shown in FIG. 13C. Additionally, wire bonding 20j is connected between pad 20i on the top face of the ASIC 20 and pad 20k on the top surface of the plate 16.

[0084] Next, the assembled plate 16 is mounted within the package 11 such that it rests on and extends between the support shelves 15a, 15b, as shown in FIG. 13D. This mounting of the plate 16 is accomplished by dispensing adhesive on the support shelves 15a, 15b, positioning the plate 16 into the appropriate place, and then performing a curing. During this step, a wire bonding 20a is connected to and extends between pad 20m on the bottom surface of the plate 16 and corresponding pad 20b on the top surface of the package bottom 11c. The lid 12 is then affixed over the tops of the sidewalls 11a, 11b to seal off the cavity 19 within the package 11, as shown in FIG. 13E, thereby completing formation of the sensor package 10.

[0085] As has been explained, the sensor packages 10, 10, 10, 10 described herein reduce the mechanical stresses placed on the sensors 21, 22. In fact, this reduction has been found by the Inventors to be on the order of 40.34% to 49.4%, as shown in the graphs of FIGS. 14A and 14B that show the deformation of the sensors 21, 22 as a result from stresses imparted by being soldered to a PCB.

[0086] Finally, it is clear that modifications and variations may be made to what has been described and illustrated herein, without thereby departing from the scope of this disclosure, as defined in the annexed claims.

[0087] While the disclosure has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be envisioned that do not depart from the scope of the disclosure as disclosed herein. Accordingly, the scope of the disclosure shall be limited only by the attached claims.