LASER PROCESSING DEVICE, LASER PROCESSING METHOD, OPTICAL SYSTEM, AND CLADDED ARTICLE
20180345404 ยท 2018-12-06
Assignee
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO (Nagakute-shi, Aichi, JP)
- TOYOTA JIDOSHA KABUSHIKI KAISHA (Toyota-shi, Aichi, JP)
Inventors
- Kazuo HASEGAWA (Nagakute-shi, JP)
- Satoru KATO (Nagakute-shi, JP)
- Chie TOYODA (Nagakute-shi, JP)
- Tomoya OKAZAKI (Ena-shi, JP)
- Yoshinori SHIBATA (Nagoya-shi, JP)
- Yuta FUJIKASA (Nagoya-shi, JP)
Cpc classification
B23K26/14
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0676
PERFORMING OPERATIONS; TRANSPORTING
B23K26/242
PERFORMING OPERATIONS; TRANSPORTING
B23K26/1476
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0006
PERFORMING OPERATIONS; TRANSPORTING
B23K26/144
PERFORMING OPERATIONS; TRANSPORTING
B23K26/34
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23K26/067
PERFORMING OPERATIONS; TRANSPORTING
B23K26/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/06
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A laser processing device includes: a laser source; a collimator that collimates light generated by the laser source; an optical element including a converter that converts the collimated light into a beam of light that includes a plurality of collimated lights which respectively have optical axes that are different from each other and that transmits the beam of light; and a focusing element that focuses the beam of light onto a workpiece.
Claims
1. A laser processing device comprising: a laser source; a collimator that collimates light generated by the laser source; an optical element including a converter that converts the collimated light into a beam of light that includes a plurality of collimated lights which respectively have optical axes that are different from each other and that transmits the beam of light; and a focusing element that focuses the beam of light onto a workpiece.
2. The laser processing device of claim 1, wherein: the converter of the optical element has a wedge shape that has at least two faces, and the converter is disposed within the collimated light so that a ridge line of the wedge shape faces toward the laser source.
3. The laser processing device of claim 1, wherein: the converter of the optical element has a conical shape, and the converter is disposed within the collimated light so that an apex of the conical shape faces toward the laser source.
4. The laser processing device of claim 1, further comprising: a cladding section including a cladding material supply portion that supplies cladding material for a cladding process, wherein the cladding section performs the cladding process by supplying the cladding material to the workpiece from the cladding material supply portion and irradiating the beam of light onto the supplied cladding material while the cladding material supply portion and the beam of light move relative to the workpiece.
5. The laser processing device of claim 4, wherein: the cladding section performs the cladding process to form a valve seat of a cylinder head for an internal combustion engine.
6. An optical system comprising: a collimator that collimates light generated by a light source; an optical element that converts the collimated light into a beam of light that includes a plurality of collimated lights that respectively have optical axes that are different from each other and that transmits the beam of light; and a focusing element that focuses the beam of light.
7. A laser processing method comprising: collimating light generated by a laser source using a collimator; converting the collimated light into a beam of light that includes a plurality of collimated lights that respectively have optical axes that are different from each other, and transmitting the beam of light, using an optical element; and focusing the beam of light onto a workpiece using a focusing element.
8. The laser processing method of claim 7, further comprising: using a cladding section including a cladding material supply portion that supplies cladding material for a cladding process, and performing the cladding process by supplying the cladding material to the workpiece from the cladding material supply portion while moving the cladding material supply portion and the beam of light relative to the workpiece and irradiating the beam of light onto the supplied cladding material.
9. A cladded workpiece comprising: a base material that is composed of a first metal; a cladded portion that is formed on the base material using a second metal; and an alloy portion that is disposed between the base material and the cladded portion, where the base material and the cladded portion are melted and bonded together, wherein: a bonding face between the base material and the alloy portion is bowl shaped, and the cladded portion and the alloy portion are formed via a cladding process in which, in a case in which a cladding material is supplied to the base material, collimated light obtained from light generated by a laser source is converted by an optical element into a beam of light that includes a plurality of collimated lights that respectively have optical axes that are different from each other, the beam of light is focused onto a workpiece by a focusing element, and the beam of light is irradiated onto the supplied cladding material.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0023]
[0024]
[0025]
[0026]
[0027]
[0028]
DESCRIPTION OF EMBODIMENTS
[0029] Detailed explanation follows regarding exemplary embodiments of the present invention, with reference to the drawings.
First Exemplary Embodiment
[0030] Explanation follows regarding a laser processing device 10 according to the present exemplary embodiment, with reference to
[0031] As illustrated in
[0032] The laser source 12 is a heat source for supplying heat during processing, and in the present exemplary embodiment is configured using a semiconductor laser. A non-illustrated collimator lens is built into the laser source 12. The laser source 12 outputs light emitted from the semiconductor laser as collimated light L0. The semiconductor laser configuring the laser source 12 may be a single semiconductor laser, or may be an array of semiconductor lasers arranged having plural points of light emission.
[0033] Note that although a semiconductor laser is given as an example of the laser source 12 in the present exemplary embodiment, there is no limitation thereto, and another kind of laser source may be employed. For example, a Nd:YAG (neodymium-doped yttrium aluminum garnet) solid-state laser, a fiber laser, or a fiber-transmitted laser (a light source where the output of a solid-state laser or the output of a semiconductor laser is transmitted by an optical fiber) may be employed.
[0034] The optical element 14 according to the present exemplary embodiment is an element that converts the optical axis of the collimated light L0 to modify the beam profile of the laser source 12. As illustrated in
[0035] The ridge line R of the optical element 14 is disposed pointing toward the collimated light L0, thereby converting the optical axis of the collimated light L0 so as to be angled inward. Namely, as illustrated in
[0036] The lens 16 is an element that focuses light on the workpiece after the light has been transmitted through the optical element 14 and had its optical axis converted. Together with the optical element 14, the lens 16 configures an optical system 18 according to the present exemplary embodiment.
[0037] Light transmitted through the face P1 of the optical element 14 is focused by the lens 16 so as to form a beam of light L1, and light transmitted through the face P2 is focused by the lens 16 so as to form a beam of light L2. As a result, the focus (image point) of the laser light according to the present exemplary embodiment, or the shape of a spot S in the vicinity thereof in the Y-axis direction, has a shape extended in both Z-axis directions, and for example, as illustrated in
[0038] The optical intensity at the central portion of the spot S, namely, the degree of separation between the spot S1 and the spot S2, can be modified by changing the vertex angle of the optical element 14. Explanation follows regarding the relationship between vertex angle and the optical intensity distribution at the spot S, with reference to
[0039]
[0040] As illustrated in
[0041] As illustrated in
[0042] Thus, configuration of the laser processing device 10 according to the present exemplary embodiment is such that the optical intensity distribution, namely the energy density, at the spot S at the processing point, and in the vicinity of the processing point, on the workpiece is able to be flexibly modified by operation of the optical system 18. This enables choosing the most appropriate optical intensity distribution for obtaining a heat input distribution at the processing point corresponding to, for example, the specifics of processing to be performed using the laser processing device 10.
[0043] Explanation follows regarding an example of processing using the laser processing device 10 according to the present exemplary embodiment, with reference to
[0044]
[0045] As illustrated in
[0046] In contrast to the related art, with the laser processing device 10 according to the present exemplary embodiment, it is possible to respectively irradiate a beam of light L1 and a beam of light L2 that have been split apart onto the workpiece W1 and the workpiece W2. Namely, the beam of light L1 is able to be respectively irradiated onto the end of the workpiece W1, and the beam of light L2 is able to be respectively irradiated onto the end of the workpiece W2. The distance between the beams of light L1 and L1 when being irradiated can be adjusted via the vertex angle of the optical element 14. The workpiece W1 and the workpiece W2 are therefore able to be butt-joined in a state in which the degree of melting of the end of the workpiece W1 and the degree of melting of the workpiece W2 are substantially the same. This enables butt-joining with good energy efficiency, and has the advantageous effect of also reducing the amount of time needed for melting, etc.
Second Exemplary Embodiment
[0047] Explanation follows regarding a laser processing device 10a according to the present exemplary embodiment, with reference to
[0048] The laser processing device 10a is a laser processing device according to the present exemplary embodiment applied to a cladding process. As illustrated in
[0049] The metal powder supply mechanism 30 is configured including a nozzle 32, a metal powder source and a conveyor therefor, a conveyance gas and a conveyor therefor, and a shielding gas and a conveyor therefor, none of which are illustrated in the drawings.
[0050] As illustrated in
[0051] In the cladding process, a material (cladding material) supplied in the form of a powder or a wire, for example, is melted onto the surface of a base material so as to be bonded thereto. It is preferable that the energy density at the spot S during the cladding process be of a level sufficient to melt the cladding material, suppress the amount of heat input to the maximum extent possible, and minimize the size of a heat-affected zone (a region affected by input heat when heat is input) (minimize distortion of the base material due to heat input). Further, in cladding processes, the diffusion of melted base material into the cladding material, a phenomenon known as dilution, inevitably occurs although the degree of this may vary. Issues may occur when the diffusion of the base material becomes excessive and the range of the diluted area becomes large, for example cracking may arise at the cladded portion, and the properties of the cladded portion may suffer such that the cladded portion hardens and becomes brittle.
[0052] On this point, with regards to the energy density at the spot S for the laser processing device according to the related art not employing the optical element 14, the energy of the laser source is generally concentrated at the central portion of the spot S, as illustrated by 1 in
[0053] In the laser processing device 10a according to the present exemplary embodiment, the optical system 18 is operated to adjust the energy density at the spot S at the processing point and in the vicinity of the processing point so as to be most suited to the cladding process. More specifically, the laser processing device 10a is configured such that by suppressing the energy density near the center of the spot S, namely, by scattering the energy near a center line toward both sides, the heat input distribution at the processing point and in the vicinity of the processing point is made uniform. This moderates heat concentration at the processing point and in the vicinity of the processing point such that the cladding material is evenly melted, and moreover the base material is suppressed from melting too much, enabling a high-quality cladded article to be obtained.
[0054] More detailed explanation follows regarding an example in which a cladding process using the laser processing device 10a is employed to form a valve seat of a cylinder head of an engine (internal combustion engine), with reference to
[0055] As illustrated in
[0056] A valve 68 makes contact with and moves away from the valve seat 66 to take in and exhaust gas during engine operation. The valve seat 66 must therefore have a high degree of hardness, and both airtightness and wear resistance are required of the valve seat 66. The cladding process employing the laser processing device 10a according to the present exemplary embodiment is able to be suitably used to form a valve seat for which such properties are required.
[0057] As illustrated in
[0058] When performing the cladding process, as illustrated in
[0059] Explanation follows regarding the cross-section structure of a valve seat 66 formed using the laser processing device 10a according to the present exemplary embodiment, with reference to
[0060]
[0061] As illustrated in
[0062] In contrast thereto,
[0063] As illustrated in
[0064] Note that although in each of the above exemplary embodiments explanation was given using an example in which the optical element 14 is a wedge shaped optical element that includes left-right symmetric faces P1, P2, namely, an optical element with axial symmetry, there is no limitation thereto. The angles of incidence of collimated light L0 thereon may be modified in accordance with the required optical intensity distribution or the like. For example, configuration may be such that the ridge line R is offset from center (a configuration in which the angle between face P1 and the Z-axis differs from the angle between the face P2 and the Z-axis).
[0065] Further, although in each of the above exemplary embodiments explanation was given using an example in which the number of faces configuring the optical element 14 is two (P1, P2), there is no limitation thereto, and three or more faces may be employed in accordance with the required optical intensity distribution or the like. Further, the faces forming the optical element 14 are not limited to being wedge shaped, and a conical shape may be employed therefor. With an optical element 14 with a conical face, the optical intensity distribution at the central portion of a substantially circular spot S would be controlled to a substantially circular shape. Namely, this enables a ring shaped (annular) spot S to be obtained.
[0066] Further, although in each of the above exemplary embodiments explanation was given using an example in which the optical element 14 has a substantially circular profile, there is no limitation thereto, and in accordance with the required optical intensity distribution or the like, configuration may be such that the optical element 14 has another shape, for example, a rectangular shape or an elliptical shape.
[0067] Further, although in each of the above exemplary embodiments explanation was given using an example in which a unitary (bulk) wedge shaped optical element is employed as the optical element 14, there is no limitation thereto. For example, configuration may be such that a composite lens that combines plural lenses with differing curvatures is employed, or configuration may be such that an array of cylindrical lenses is employed.
[0068] The disclosure of Japanese Patent Application No. 2015-249409 is incorporated in its entirety by reference herein.
[0069] All cited documents, patent applications, and technical standards mentioned in the present specification are incorporated by reference in the present specification to the same extent as if each individual cited document, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.