METHOD FOR MANUFACTURING A SENSOR FOR A MOTOR VEHICLE

Abstract

A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

Claims

1. A method for manufacturing a sensor for a motor vehicle, said method comprising: placing a sensor core in a lower indentation of a mold, said sensor core comprising a metal lead frame, comprising a plurality of connection pins and two lateral retention members, and an integrated circuit, comprising at least one measurement cell and being overmolded, in a first overmolding, on a support zone of the metal lead frame so that the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the integrated circuit overmolded on the first overmolding of the previous step; placing two lateral indentations of the mold on either side of the magnet and of the integrated circuit so that said lateral indentations hold the lead frame in the vicinity of the lateral retention members by ensuring both longitudinal and transverse translational locking of the lead frame while forming a space around the integrated circuit and the magnet for an overmolding material; overmolding the overmolded integrated circuit, the magnet and part of the lead frame, the magnet and the overmolded integrated circuit then being fixed in an intermediate overmolding so as to precisely lock them relative to each other for the measurement efficiency of the sensor and so as to allow the free end of the terminals to project; and removing the mold.

2. The method as claimed in claim 1, wherein the free end of each lateral retention member comprises at least one stop and the lateral indentations each comprise two support protrusions, the placement of the two lateral indentations comprises bringing the at least one stop of the lateral retention member into contact with the protrusions of the corresponding lateral indentation.

3. The method as claimed in claim 1, wherein the placement of the magnet in the lower indentation is carried out so that the magnet comes into abutment against each lateral indentation along the longitudinal axis in the vicinity of mold stops.

4. The method as claimed claim 1, further comprising a step of placing a pin allowing the magnet to be vertically translationally locked in the mold.

5. The method as claimed in claim 1, further comprising a step of placing a pin allowing the magnet to be longitudinally translationally locked in the mold.

6. The method as claimed in claim 1, further comprising a step of disposing the integrated circuit on the metal lead frame, a step of electrically connecting the integrated circuit with the connection pins and a step of overmolding the integrated circuit and part of the lead frame so as to reveal the lateral retention members and to allow the end of the connection pins to project, with the magnet then being placed on said overmolding of the integrated circuit.

7. The method as claimed in claim 1, comprising a step of final overmolding of the intermediate overmolding of the integrated circuit, the magnet and part of the lead frame so as to form a connector socket around the ends of the terminals.

8. A mold for manufacturing a sensor using the method as claimed in claim 1, said sensor comprising a metal lead frame comprising a plurality of connection pins and two lateral retention members, each lateral retention member comprising a free retention end in the form of a projecting rectangular portion comprising two corners, said mold comprising two lateral indentations each comprising an inner surface designed to retain the lead frame in the vicinity of the free end of the lateral retention members of the lead frame by ensuring longitudinal and transverse translational locking of the lead frame when the mold is closed onto the lead frame.

9. The mold as claimed in claim 8, wherein each lateral indentation comprises at least one stop element of each lateral retention member.

10. A motor vehicle comprising a sensor obtained using the method as claimed in claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Further features and advantages of aspects of the invention will become more apparent from reading the following description. This description is purely illustrative and should be read with reference to the appended drawings, in which:

[0026] FIG. 1 is a perspective view of a lead frame of one embodiment of the sensor according to the invention.

[0027] FIG. 2 is a perspective view of the lead frame of FIG. 1 provided with an integrated circuit overmolding.

[0028] FIG. 3 is a perspective view of the assembly of FIG. 2 positioned on a lower indentation of a mold.

[0029] FIG. 4 is a perspective view of the assembly of FIG. 3, in which a magnet has been positioned on the integrated circuit overmolding.

[0030] FIG. 5 is a perspective view of the assembly of FIG. 4, in which a left lateral indentation and a right lateral indentation of the mold have been positioned.

[0031] FIG. 6 is a perspective view of the left lateral indentation of the mold, particularly showing the support protrusions for retaining the retention members of the lead frame.

[0032] FIG. 7 is a perspective view of the assembly of FIG. 6, in which an upper support of the mold has been positioned.

[0033] FIG. 8 is a perspective view of the assembly of FIG. 7, in which a vertical pin and an oblique pin have been positioned.

[0034] FIG. 9 is a perspective view of the assembly of FIG. 8, in which a left and a right clamp have been placed for locking the pins.

[0035] FIG. 10 is a perspective view of an intermediate element obtained after molding in the mold.

[0036] FIG. 11 is a perspective view of an embodiment of the sensor according to the invention, obtained after final overmolding.

[0037] FIG. 12 schematically illustrates an embodiment of the method according to the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0038] The sensor obtained using the method according to an aspect of the invention is intended to be mounted in a motor vehicle. The sensor can be of any type. For example, the sensor can be a position or speed sensor of a drive shaft such as a crankshaft or camshaft or any other suitable shaft.

[0039] FIGS. 1 to 11 show an embodiment of the sensor 1 according to the invention at different steps of the manufacturing method and FIG. 12 shows an embodiment of the method according to the invention.

[0040] Firstly, as illustrated in FIG. 1, a metal lead frame 10 is disposed on a support (not shown for the sake of clarity) in a step E1.

[0041] The lead frame 10 is in the form of a metal part comprising a support zone 11, from which a plurality of connection pins 12 extends, along a longitudinal axis X, for electrically connecting the measurement cells 15-1 of an integrated circuit 15 to an external computer (not shown), in a manner per se known. In this example, the lead frame 10 comprises three connection pins 12.

[0042] The support zone 11 of the lead frame 10 comprises two lateral retention members 13, integrally formed with the support zone 11 and extending along a transverse axis Y, perpendicular to the longitudinal axis X.

[0043] The integrated circuit 15 comprising the measurement cells 15-1 is disposed on the support zone 11 in a step E2, and then the integrated circuit is electrically connected with the connection pins 12, for example, by means of metal wires soldered between each connection pin 12 and three connection terminals of the integrated circuit in a step E3.

[0044] The integrated circuit and the support zone 11 are then overmolded using an epoxy resin in a step E4, with the exception of the two lateral retention members 13, which remain visible (FIG. 2). This first overmolding 20 protects the integrated circuit 15 and in particular the measurement cells 15-1.

[0045] The assembly formed by the lead frame 10 and the first overmolding 20 is placed on the lower indentation 31 of a mold 30 (FIG. 3) in a step E5. Metal terminals 12-1, forming extensions of the connection pins 12, are positioned on the free ends of the connection pins 12 in order to allow the subsequent electrical connection of the sensor 1 with the outside, as will be described hereafter. The terminals 12-1 are not soldered at this stage so as to avoid damaging them during the overmolding of step E11 described hereafter.

[0046] A magnet 40 is positioned on the first overmolding 20 in a step E6 (FIG. 4). In this example, the magnet 40 is parallelepiped shaped but it should be noted that in another embodiment, the magnet 40 could assume a different shape, for example, cylindrical.

[0047] A left lateral indentation 32 and a right lateral indentation 33 of the mold 30 are then positioned on the lower indentation 31 so as to retain the magnet on its left part, on its right part and on its rear part in a step E7 (FIG. 5). The left lateral indentation 32 and the right lateral indentation 33 come into contact with the lateral retention members 13 in order to ensure that the lead frame 10 is translationally locked along the transverse axis Y and in contact with the rear part of the magnet 40 via two mold stops 32C, in order to ensure that the magnet is translationally locked along the longitudinal axis X toward the rear.

[0048] More specifically, firstly with reference to FIG. 1, each lateral retention member 13 projects from the support zone 11 along the transverse axis Y and comprises a central portion 13A defining two stops at its free end in the form of two rounded corners 13-1. Each lateral retention member 13 also comprises two lugs 13-2.

[0049] With reference to FIG. 6, the left lateral indentation 32 comprises two prism shaped protrusions 32A with a triangular cross-section vertically formed on the inner wall 32B of said left lateral indentation 32. The structure of the right lateral indentation 33 is symmetrically identical.

[0050] The placement of the two lateral mold indentations 32, 33 involves bringing the two protrusions 32A of each lateral mold indentation 32, 33 into contact with the two corners 13-1 of the corresponding lateral retention member 13 and bringing the mold stops 32C into contact so as to effectively retain and translationally lock the lead frame 10 both longitudinally and transversely by bringing (or by interfering) the two protrusions 32A of the lateral indentations 32, 33 into contact with the lateral retention members 13 in the vicinity of the two corners 13-1. The function of the inner wall 32B and of the mold stops 32C is to properly position the magnet 40 with respect to the integrated circuit (pre-centering). To this end, the inner wall 32B and the mold stops 32C are produced on each of the lateral indentations 32, 33 in order to achieve a better relative position by dispensing with the necessary functional clearances compared to the case whereby this relative positioning would be achieved by means of several movable parts in the mold 30.

[0051] An upper indentation 34 of the mold 30 is then placed over the lower indentation 31, the left lateral indentation 32 and the right lateral indentation 33 so as to cover the magnet and close the mold 30 in a step E8 (FIG. 7). The upper indentation 34 comprises a first hole 34A and a second hole 34B.

[0052] A vertical pin 51 and an oblique pin 52 are then respectively inserted into the first hole 34A and the second hole 34B of the upper indentation 34 in a step E9 in order to respectively translationally lock the magnet along a vertical axis Z and along the longitudinal axis X toward the front (FIG. 8).

[0053] A left clamp 54 and a right clamp 55 are then mounted on the upper indentation 34 of the mold 30 in a step E10 in order to retain the vertical pin 51 and the oblique pin 52 for molding (FIG. 9).

[0054] The integrated circuit, the magnet and part of the lead frame are then overmolded in a step E11 using epoxy resin so as to allow the end of the connection pins 12 to project. The magnet 40 and the overmolding of the integrated circuit are then fixed in an intermediate overmolding 61 (shown in FIG. 10) so as to precisely lock them relative to each other to enable high measurement efficiency for the sensor 1. The corners 13-1 are still visible since they are overlaid by the two protrusions 32A of the indentations 32, 33 of the mold 30.

[0055] The mold 30 is then removed in a step E12 in order to obtain an intermediate element 60 (FIG. 10). The terminals 12-1 then can be soldered onto the connection pins 12 in order to complete the electrical connection and allow the sensor 1 to transmit the signals it measures to an electronic control unit of the vehicle.

[0056] Final overmolding 70 of the intermediate element 60 is carried out in another mold (not shown) in a step E13 (FIG. 11), in order to form the sensor 1 and in particular a connector socket 71 around the terminals 12-1, in order to electrically connect the sensor 1 in the vehicle, and a fixing member 72, for example, in the form of a ring, in order to mount the sensor 1 in the vehicle.