Electronic Control Device and Manufacturing Method for Same

Abstract

Providing an electronic control device excellent in reliability with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin; a terminal for electrically connecting the control substrate with an external device; and a fixing plate for positioning and fixing the terminal with respect to the housing case. After the terminal is fixed to the housing case by the fixing plate, the terminal is electrically connected to the control substrate and subsequently a portion of the terminal and the control substrate are sealed with the sealing resin.

Claims

1. An electronic control device comprising: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; a fixing member at least a portion of which is sealed with the sealing resin; a terminal for providing electrical connection between the control substrate and an external device; and a fixing plate for positioning and fixing the terminal with respect to the fixing member.

2. The electronic control device according to claim 1, wherein the terminal includes a plurality of metal terminals, the sealing resin covers the terminal, and a connector housing to be fitted with an external connector is integrally formed.

3. The electronic control device according to claim 2, wherein the fixing member is a metal plate member and includes an exposed portion at least a portion of which is exposed from the sealing resin, and the exposed portion includes one of a heat sink portion that dissipates heat generated from the electronic component to the outside and a fixture for vehicle body mounting provided to perform fixation to the vehicle body.

4. The electronic control device according to claim 3, wherein the terminal includes a plurality of metal terminals and the terminal is provided so as to perpendicularly penetrate the fixing plate and the fixing member.

5. The electronic control device according to claim 3, wherein the fixing plate includes a pin extending toward the fixing member, the pin is inserted into a penetration hole provided at a portion of the fixing member opposed to the fixing plate, and the fixing plate is fixed to the fixing member by thermal caulking.

6. The electronic control device according to claim 2, wherein a material of the fixing plate is a thermoplastic resin.

7. The electronic control device according to claim 5, wherein a position fixed with the thermal caulking is covered with the sealing resin.

8. The electronic control device according to claim 7, wherein the fixing plate is fixed to the fixing member by thermal caulking at least at two locations.

9. The electronic control device according to claim 5, wherein a tip of the pin protrudes from the penetration hole of the fixing member after the thermal caulking, and the diameter of the pin tip is larger than the diameter of the penetration hole.

10. The electronic control device according to claim 2, wherein the material of the sealing resin is a thermosetting resin.

11. The electronic control device according to claim 2, wherein the fixing plate is fixed to the fixing member by a snap fit.

12. The electronic control device according to claim 2, wherein the fixing plate is fixed to the fixing member by a screw.

13. The electronic control device according to claim 1, wherein the terminal includes a plurality of metal terminals, the fixing plate is a portion of a connector housing to be fitted with an external connector by covering the terminal, and the fixing plate is formed separately from the sealing resin.

14. A method for manufacturing an electronic control device, the method comprising: fixing a fixing plate holding a plurality of metal terminals to a fixing member; electrically connecting a control substrate on which an electronic component is mounted with the plurality of metal terminals after the plurality of metal terminals is fixed to the fixing member by the fixing plate; and sealing a portion of the plurality of metal terminals, the control substrate, and at least a portion of the fixing member with a sealing resin.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a cross-sectional view of an electronic control device.

[0011] FIG. 2 is a configuration and an assembly procedure of an electronic control device of a first embodiment.

[0012] FIG. 3 is an enlarged sectional view of a thermal caulking portion of the first embodiment.

[0013] FIG. 4 is a configuration for fixing a connector unit assembly to a control substrate.

[0014] FIG. 5 is a configuration of an electronic control device of a second embodiment.

[0015] FIG. 6 is a configuration of an electronic control device of a third embodiment.

[0016] FIG. 7 is a configuration of an electronic control device of a fourth embodiment.

DESCRIPTION OF EMBODIMENTS

[0017] Hereinafter, a configuration and an assembly procedure of an electronic control device according to specific embodiments of the present invention will be described with reference to the accompanying drawings.

First Embodiment

[0018] FIG. 1 is a cross-sectional view illustrating a control device according to the first embodiment. FIG. 2 is a configuration and an assembly procedure of the control device illustrated in FIG. 1.

[0019] As illustrated in FIGS. 1 and 2, the electronic control device according to the present invention includes a control substrate 2 on which an electronic component 1 such as a microcomputer is mounted, a housing case 3, a connector 4, and a sealing resin 5.

[0020] As illustrated in FIG. 2 (a), the housing case 3 may be integrally molded together with a heat sink 7 having a heat dissipation fin 6 for dissipating heat generated from electronic components to the outside of the electronic control device, an electromagnetic shield unit 8 that shields electromagnetic noise, and a fixture for vehicle mounting 9 for fixing the electronic control device to a vehicle. The material is preferably a metal material having high thermal conductivity, shielding property and rigidity, and it is preferable to use aluminum or an aluminum alloy from the viewpoints of mass productivity, weight reduction, heat dissipation property, and cost. By integrating the heat sink 7, the shield unit 8, and the fixture for vehicle mounting 9 in this manner, it is possible to reduce the number of components, leading to cost reduction and enhancement of productivity.

[0021] With the fixture for vehicle mounting 9 integrally molded with the housing case 3, heat dissipated from the electronic component 1 towards the housing case 3 such as the heat sink 7 enables enhanced heat dissipation amount to the vehicle body via the fixture for vehicle mounting 9.

[0022] As illustrated in FIG. 2(b), the connector 4 is formed by fabricating a connector unit assembly 12 constituted with a terminal 10 for connecting a vehicle-side harness with the control substrate 2, and a fixing plate 11 for aligning and holding the terminals 10 at a prescribed pitch. The fixing plate 11 includes pins 13 for increasing insertability into the housing case 3 to be described below and for facilitating positioning. The number of the pins 13 is preferably two or more. The material of the terminal 10 may preferably be copper or a copper alloy from the viewpoint of conductivity, downsizing, and cost. The material of the fixing plate 11 may preferably be a polybutylene terephthalate (PBT) resin, a polyamide (PA) 66 resin, and a polyphenylene sulfide (PPS) resin from the viewpoint of light weight and excellent heat resistance.

[0023] Subsequently, as illustrated in FIG. 2(c), the housing case 3 and the connector unit assembly 12 are assembled to each other. At that time, the pins 13 of the connector unit assembly 12 are inserted into mutually opposing penetration holes on the housing case 3, and the fixing plate 11 is brought into contact with the housing case 3, thereby positioning the connector unit assembly 12 and the housing case 3. By designing the diameter of the pin 13 of the connector unit assembly 12 and the diameter of the penetration hole of the housing case 3 so as to have a small diameter difference, it is possible to suppress a positional displacement of the connector unit assembly 12 in a planar direction and thus to prevent the terminal 10 and the housing case from coming in contact with each other.

[0024] When the position of the connector unit assembly 12 with respect to the housing case 3 as a fixing member is determined, tips of the pins 13 protruding from the housing case 3 are fixed by thermal caulking as illustrated in FIG. 2(d). FIG. 3(a) illustrates an enlarged cross-sectional view of the thermal caulking portion. The fixing plate 11 is placed on a cradle 14, and a preheated thermal caulking jig 15 is pressed against the tip of the pin 13 to soften and thermally deform the tip of the pin to be pressed against the housing case 3, thereby forming a thermal caulking portion as illustrated in FIG. 3(b). At this time, a pin diameter (Dp) of the thermal caulking portion is preferably formed to be larger than a housing case penetration hole diameter (Dh). This makes it possible to increase the fixing force.

[0025] After the connector unit assembly 12 is fixed, the control substrate 2 on which the electronic component 1 such as a microcomputer is mounted is assembled to the die casting case 3 as illustrated in FIGS. 2(e) and 2(f). At that time, an electronic component susceptible to external electromagnetic noise and an electronic component likely to generate electromagnetic noise, such as a microcomputer and a quartz oscillator, are mounted on a surface of the control substrate 2 facing the housing case 3. This configuration enables the electronic component 1 to be surrounded by wiring layers of the housing case 3 and the control substrate 2, leading to enhancement of the electromagnetic shielding property. In order to further enhance the electromagnetic shielding property, it is preferable to provide a solid pattern in one layer of the wiring layers of the control substrate or in the periphery where the electronic component 1 is mounted. This makes it possible to also enhance the shielding property against electromagnetic noise from the surface not facing the housing case 3.

[0026] A resin wiring board based on glass epoxy resin or the like is used as the control substrate 2. In connecting the electronic component 1 to the control substrate 2, a lead-free solder such as SnCu solder, SnAgCu solder, and SnAgCuBi solder is applied. By setting the control substrate 2 on a substrate receiving unit 16 of the housing case 3, the position in a height direction is determined, and subsequently the control substrate 2 is fixed to the housing case 3 using screws (not illustrated). The number of fixation points by screws may preferably be three or more. In connecting the terminal 10 of the connector unit assembly 12 with the control substrate 2, a lead-free solder such as SnCu solder, SnAgCu solder, and SnAgCuBi solder is applied to a through hole portion 17 of the control substrate 2, into which the terminal 10 is inserted, so as to achieve connection. Note that the type of the connector 4 may be a surface mounting type or a press fit type.

[0027] What is important here is a method of fixing the connector unit assembly 12. Specifically, in a case where the connector unit assembly 12 is fixed to the control substrate 2 instead of the housing case 3, the positioning pin 13 is to be inserted into the control substrate 2. This would generate a need to provide a penetration hole for the positioning pin 13 on the control substrate 2, and increase the substrate area correspondingly. In addition, in a case where the terminal 10 of the connector unit assembly 12 and the through hole portion 17 of the control substrate 2 are joined with each other by soldering, the connector unit assembly 12 and the control substrate 2 individually expand and contract due to a thermal history by solder joining, leading to individual deformation. In this process, however, there is a difference in the amount of expansion and contraction between the connector unit assembly 12 and the control substrate 2, leading to generation of warping in the connector unit assembly 12 and the control substrate 2 after joining them, with respect to an original shape of the control substrate 2 indicated by the broken line as illustrated in FIG. 4(a).

[0028] In a case where the connector unit assembly 12 and the control substrate 2 in which the warping is generated are fixed to the housing case 3, placing one end 31 of the control substrate 2 on the substrate receiving unit 16 would generate a gap 33 corresponding to the amount of warping at the other end of the control substrate 2 as illustrated in FIG. 4(b). Due to greater rigidity of the housing case 3 than the rigidity of the control substrate 2 and the flat shape of the substrate receiving unit 16, screwing the control substrate 2 to the housing case 3 in this state would bring the warping of the control substrate 2 back to a former state. This would cause a stress to remain in the a solder joint portion 33 between the terminal 10 of the connector unit assembly 12 and the through hole portion 17, and in a solder joint portion 34 between the control substrate 2 and the electronic component 1, leading to a decrease in solder connection lifetime.

[0029] To cope with this problem, as described in the embodiment, the method of fixing the connector unit assembly 12 may preferably include first fixing the connector unit assembly 12 to the housing case 3, and thereafter joining the terminal 10 of the connector unit assembly 12 to the through hole portion 17 of the control substrate 2. With this method, it is possible to suppress the warping of the connector unit assembly 12 and the control substrate 2, and also to suppress stress generated at the joint portion between the terminal 10 and the through hole portion 17.

[0030] As illustrated in FIG. 2(g), a sub-assembly 20 fabricated in this manner is set in a mold for resin sealing. In the present embodiment, the sub-assembly is set on an upper die 18 that is a movable die, then the upper die is moved and set onto a lower die 19 as a fixed die. The fin portion 6 of the housing cover 3 to be desirably exposed from the resin 5 after resin sealing and the fixture for vehicle mounting 9 have a structure to be held by a mold in order to prevent entry of resin during resin molding.

[0031] For the purpose of ensuring the fluidity of the sealing resin 5 and enabling the resin to fill over narrower sites inside of the mold, it is preferable to preheat the mold, the sub-assembly, and the resin. The sealing resin 5 may be a thermosetting epoxy resin, an unsaturated polyester resin, or a thermoplastic resin. Examples of sealing methods include transfer molding, compression molding, injection molding, and hot melt. Physical property values of the sealing resin 5 are desirably such that the linear expansion coefficient is 10 to 3010.sup.6/ C., the thermal conductivity is 0.5 to 3 W/mK.

[0032] After completion of resin filling into the mold, the sealing resin 5 is cured in the mold. After curing, the mold is opened and the resin molded product is taken out to complete fabrication of the electronic control device illustrated in FIG. 2(h).

[0033] Note that a rising portion 22 on the outer periphery of the housing case excluding the fixture for vehicle mounting 9 is preferably covered with the sealing resin 5. This configuration increases the contact area between the housing case 3 and the sealing resin 5, making it possible to enhance waterproof/anti-saline reliability. Since this configuration further enables reduction of expansion and shrinkage of the housing case 3, it is possible to enhance waterproof and anti-saline reliability and solder connection reliability.

[0034] In addition, it is further preferable to cover the thermal caulking portion of the connector terminal fixing plate 11 with the sealing resin 5. This makes it possible to suppress deterioration of the thermal caulking portion and suppress entry of water and salt water from the thermal caulking portion.

[0035] Finally, it is more preferable that a housing 21 of the connector 4 is also integrally molded with the sealing resin 5. This can omit necessity to provide the connector housing as a separate component, leading to reduction of the number of components, and probably leading to cost reduction and productivity enhancement.

Second Embodiment

[0036] The configuration of a second embodiment will be described in comparison with the first embodiment. While the first embodiment is a case where the fixing plate 11 is fixed to the housing case 3 by thermal caulking, the second embodiment uses a structure in which the fixing plate 11 is fixed by a snap fit 26 as illustrated in FIG. 5.

Third Embodiment

[0037] The configuration of a third embodiment will be described in comparison with the first embodiment. While the first embodiment is a case where the fixing plate 11 is fixed to the housing case 3 by thermal caulking, the second embodiment uses a structure in which the fixing plate 11 is fixed by a screw 27 as illustrated in FIG. 6.

Fourth Embodiment

[0038] The configuration of a fourth embodiment will be described in comparison with the first embodiment. While the first embodiment is a case where the connector unit assembly 12 is fixed to the housing case 3, the fourth embodiment uses a connector 40 with a housing separately from the sealing resin 5 as illustrated in FIG. 7. The screw 27, or the like, may be used for fixing the connector 40 and the housing case 3. In the present embodiment, the connector 40 includes a plate portion for fixing the plurality of terminals 10 and this plate portion can be used in place of the fixing plate 11 so as to position and fix the terminals 10 to the housing case 3.

[0039] As above, embodiments of the control device according to the present invention have been described. The present invention is not limited to the above-described embodiments but may include various design modifications without departing from the spirit according to the present invention described in claims.

REFERENCE SIGNS LIST

[0040] 1 electronic component [0041] 2 control substrate [0042] 3 housing case [0043] 4 connector [0044] 5 sealing resin [0045] 5a sealing resin to cover heat dissipation fin [0046] 5b sealing resin to cover rising portion of outer periphery of housing case [0047] 6 heat dissipation fin [0048] 7 heat sink [0049] 8 electromagnetic shield unit [0050] 9 fixture for vehicle mounting [0051] 10 terminal [0052] 11 fixing plate [0053] 12 connector unit assembly [0054] 13 pin [0055] 14 cradle [0056] 15 thermal caulking jig [0057] 16 substrate receiving unit [0058] 17 through hole portion [0059] 18 upper mold [0060] 19 lower mold [0061] 20 sub-assembly [0062] 21 connector housing [0063] 22 rising portion of outer periphery of housing case [0064] 24 penetration hole [0065] 25 mold [0066] 26 snap fit [0067] 27 screw [0068] 30 electronic control device [0069] 31 one end of control substrate [0070] 32 other end of control substrate [0071] 33 solder joint portion between terminal and through hole portion [0072] 34 solder joint portion between control substrate and electronic component