Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device

Abstract

A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70 C. for 1 minute is 0.5 to 0.5% and the bending resistance of the base is 80 mm or more.

Claims

1. A sheet having an adhesive resin layer, comprising: a base comprising a multilayered laminate comprising a low density polyethylene film and a polypropylene film; and the adhesive resin layer comprising a resin coat forming layer stacked on said base, wherein: a shrinkage of the base in MD direction and CD direction after one minute heat applying at 70 C. is 0.5 to 0.5%, a bending resistance of the base is 80 mm or more, the resin coat forming layer has a thermal bonding property and does not have pressure-sensitive adhesiveness at a temperature of 23 C., and the resin coat forming layer comprising a binder polymer component (A) including an acrylic polymer and a curable component (B).

2. The sheet having the adhesive resin layer as set forth in claim 1, wherein a product between Young's modulus of the base and the thickness of the base is 1.010.sup.5 N/m or less.

3. The sheet having the adhesive resin layer as set forth in claim 1, wherein the multilayered laminate comprises the low density polyethylene film, the polypropylene film, and a low density polyethylene film, stacked in this order.

4. The sheet having the adhesive resin layer as set forth in claim 1, wherein the resin coat forming layer is stacked on the base via a re-releasable attaching layer.

5. The sheet having the adhesive resin layer as set forth in claim 1, wherein the binder polymer component (A) further comprises a polyester resin, urethane resin, silicone resin, phenoxy resin, or a rubber-based polymer.

6. The sheet having the adhesive resin layer as set forth in claim 1, wherein the curable component (B) comprises a thermosetting component.

7. The sheet having the adhesive resin layer as set forth in claim 6, wherein the thermosetting component comprises an epoxy resin.

8. The sheet having the adhesive resin layer as set forth in claim 1, wherein the polypropylene film comprises a softening component comprising a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer.

9. The sheet having the adhesive resin layer as set forth in claim 8, wherein a content of the softening component in the polypropylene film is 10 to 30 wt %.

10. The sheet having the adhesive resin layer as set forth in claim 1, wherein said polypropylene film comprises a softening component comprising a hydrogenated product of a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer.

11. The sheet having the adhesive resin layer as set forth in claim 1, wherein the acrylic polymer comprises an alkly (meth)acrylate monomer having an alkyl group of 1-18 carbon atoms.

12. A production method of a semiconductor device comprising; a step of adhering a chip form component to the adhesive resin layer of the sheet having the adhesive resin layer as set forth in claim 1, and a step of picking up the chip form component.

13. A production method of a semiconductor wafer comprising; a step of adhering a chip form component to the adhesive resin layer of the sheet having the adhesive resin layer as set forth in claim 1, a step of releasing the adhesive resin layer from the base while transferring the adhesive resin layer to a backside of the chip form component, and a step of placing the chip form component on a die pad part or on the surface of another chip form component via the adhesive resin layer.

Description

EXAMPLE

(1) Hereinafter, the present invention will be described in further detail using the examples; however the present invention is not to be limited thereto. Note that, in the example and comparative example, each evaluation was carried out follows.

(2) <The Shrinkage of the Base>

(3) The base was cut into 4.5 mm15 mm width, and the thermal shrinkage was measured by the thermomechanical analysis apparatus (TMA4000SA made by Bruker Co., Ltd). The heat applying was carried out by pulling at 2 g of constant load and 70 C./1 min. Then the thermal shrinkage (%) was calculated by the below equation.
The thermal shrinkage=(the base length before the heat applying (15 mm)the base length after the heat applying)/the base length before heat applying100
<The Bending Resistance of the Base>

(4) It was measured in accordance with 45 cantilever method described in JIS L1086:1983.

(5) <The Young's Modulus of the Base>

(6) The Young's modulus of the base was measured in accordance with JIS K7161:1994 using a universal tensile tester (TENSILON RTA-T-2M manufactured by ORIENTEC Co., LTD.), under the atmosphere of the humidity of 50% and the tension speed of 200 mm/min.

(7) <The Thickness of the Base>

(8) The thickness of the base was measured using the thickness gauge (PG-02 made by TECLOCK Corporation).

(9) <The Chip Alignment>

(10) (1) The Formation of the Chip Carried Out with the Pre-Dicing

(11) The dicing device (DFD-6351, made by DISCO Corporation) was used to the silicon wafer having the diameter of 200 mm and thickness of 720 m being mirror polished, and the wafer was formed with the groove having a cut depth of 70 m and the chip size of 5 mm5 mm.

(12) Then, the surface protection sheet (Adwill E-3125KL made by Lintec Corporation) was adhered to the face formed with the groove.

(13) Then, by using the backside grinding device (DGP-8760 made by DISCO Corporation), the backside grinding of the wafer was carried out till the thickness reached 50 m to divide the wafer into a chip, thereby the chip group was obtained. The ultraviolet irradiation (illumination 220 mW/cm.sup.2, and luminous energy 380 mJ/cm.sup.2) was carried out to the surface protection sheet face thereof by using the ultraviolet ray irradiator (RAD-2000 m/12 made by Lintec Corporation).

(14) (2) The Adhering of the Sheet Having the Adhesive Resin Layer and the Releasing of the Surface Protection Sheet

(15) First, the release film (heavy release type) was removed from the sheet having the adhesive resin layer produced in the examples and comparative examples.

(16) Next, using the tape mounter (RAD2700F/12 made by Lintec Corporation), the adhesive resin layer of sheet having the adhesive resin layer contacts the chip so that it has the same concentric circle with the chip group, and it was adhered respectively so that the tacky member adheres to the ring frame. Here, the temperature of the suction table for fixing the chip was 50 C., so that the adhesive resin layer gets closer to the same temperature and softens.

(17) Note that, when the sheet having the adhesive resin layer of the example 3 was adhered, it was carried out so that the re-releasable attaching layer contacts to the ring frame. Also, when the sheet having the adhesive resin layer of the example 4 was adhered, it was carried out so that the adhesive resin layer contacts with both of the ring frame and the chip, and the heat applying process to make the chuck table to be 50 C. was not carried out.

(18) Next, the sheet having the adhesive resin layer adhered to the chip on the surface protection sheet and the ring frame was transferred to the release unit, and the surface protection sheet was released. Here, the temperature of the suction table for fixing the chip adhered with the sheet having the adhesive resin layer was 50 C., and the surface protection sheet was carried out with the heat applying release by making the temperature close thereto.

(19) (3) Evaluation

(20) Using the wafer alignment unit of the full cut laser device (DFL7160 made by DISCO Corporation), regarding the chips adjacent to each other in the scanning direction, the shifting distance in the scanning direction and the vertical direction were measured. The measuring interval was 5 mm interval in the scanning direction, and entire lines were measured then evaluated according to the following standards.

(21) A (Good): the maximum value of the shifting distance is less than 15 m.

(22) B (Bad): the maximum value of the shifting distance is 15 m or more.

(23) <Expanding Property>

(24) (1) Expanding at the Usual Temperature

(25) The ultraviolet irradiation (illumination 220 mW/cm.sup.2, and luminous energy 120 mJ/cm.sup.2) was carried out by using the ultraviolet ray irradiator (RAD-2000m/12 made by Lintec Corporation) to the adhesive resin layer of the sheet having the adhesive resin layer adhered to the chip which was produced in the above mentioned <the chip alignment> from the base side. Then, the adhesive resin layer was cut using the full cut laser (DFL7160 made by DISCO Corporation).

(26) Next, using the expanding device (ME-300 series made by JCM Co., Ltd.), the sheet having the adhesive resin layer adhered with the chip was expanded under the condition of temperature of 23 C., expanding speed of 50 mm/sec, and the expanding amount of 6 mm. If the sheet was able to expand, then it was evaluated as A, and if it was unable then it was evaluated B.

(27) Note that, for those having the evaluation of the chip alignment of B, and also having malfunction during the cutting of the adhesive resin layer by the laser saw, no evaluation was carried out.

(28) (2) The Cool Expanding

(29) The ultraviolet irradiation (illumination 220 mW/cm.sup.2, and luminous energy 120 mJ/cm.sup.2) was carried out by using the ultraviolet ray irradiator (RAD-2000m/12 made by Lintec Corporation) to the adhesive resin layer adhered with the chip which was produced in the above mentioned <the chip alignment> from the base side. Then, using the die separator (DDS2300 made by DISCO Corporation), the sheet having the adhesive resin layer adhered with the chip was expanded under the condition of temperature of 0 C., expanding speed of 200 mm/sec, and the expanding amount of 6 mm. If the sheet was able to expand by expanding, then it was evaluated as A, and if it was unable then it was evaluated B.

(30) <The Pickup Property>

(31) From the sheet having the adhesive resin layer adhered with the chip after carried out with the evaluation of the expanding at usual temperature as mentioned in the above, the pickup was done by die bonder (Bestem-D02, made by Canon Machinery Inc.). As for the pickup property, if the pickup of the chip was carried out from the base without chip crack or chip breakage, then it was evaluated A; if the chip crack or the chip breakage occurred during the pickup, then it was evaluated B; and if the pickup was unable due to the chip crack or the chip breakage during the pickup, then it was evaluated as C. The same method was carried out when the evaluation of above mentioned (2) the cool expanding was carried out to evaluate the pickup property.

(32) Note that, for those having the evaluation of the chip alignment of B, and also having malfunction during the cutting of the adhesive resin layer by the laser saw, this evaluation was carried out only for those which were able to expand.

(33) <The Adhesive Resin Composition>

(34) (A) Binder polymer component: 100 parts by weight of the acrylic polymer comprising 55 parts by weight of n-butyl acrylate, 10 parts by weight of methyl acrylate, 20 parts by weight of glycidyl methacrylate, and 15 parts by weight of 2-hydroxyethylacrylate (the weight average molecular weight: 900,000, the glass transition temperature: 28 C.)

(35) (B-1) Solid epoxy resin: 330 parts by weight of polyfunctional epoxy resin (EPPN-502H made by Nippon Kayaku Co., Ltd.)

(36) (B-2) Liquid form epoxy resin: 330 parts by weight of bisphenol A type epoxy resin comprising 20 wt % of acrylic particle (ACRYSET BPA328 made by NIPPON SHOKUBAI CO., LTD)

(37) (B-3) Curing agent: 300 parts by weight of novolac type phenol resin (Shonol BRG-556 made by SHOWA DENKO K.K.)

(38) (B-4) Energy ray polymerizable compound: 150 parts by weight of dicyclopentadienemethoxydiacrylate (KAYARAD R-684 made by Nippon Kayaku Co., Ltd.)

(39) (D) Heat curing catalyst: 1 parts by weight of imidazole (Curezol 2PHZ made by SHIKOKU CHEMICAL CORPORATION)

(40) (E) Silane coupling agent: 15 parts by weight (MKC silicate MSEP2 made by Mitsubishi Chemical Corporation)

(41) (F) Photopolymerization initiator: 5 parts by weight of -hydroxycyclohexylphenyl ketone (IRGACURE 184 made by Ciba Specialty Chemicals)

(42) (G) Inorganic filler: 200 parts by weight of ADMAFINE SC2050 made by Admatechs.

Example 1

(43) The above mentioned components of the adhesive resin component were blended in the above mentioned amount. Also, as the release film, polyethylene terephthalate film (SP-P502010, the thickness of 50 m made by Lintec Corporation) carried out with the release treatment on the one side was prepared.

(44) As the base, the multilayered laminate comprising the layer of low density polyethylene (NOVATEC-LC520 (density: 0.923 g/cm.sup.3, MFR: 3.6 g/10 min, the thickness: 8 m) made by Japan Polychem Corporation), the layer of polypropylene (the mixture of homopolypropylene resin (Prime Polypro F-300SP (density: 0.90 g/cm.sup.3, MFR: 3.0 g/10 min) made by Prime Polymer Co., Ltd) and the styrene-ethylenebutylne-styrene block copolymer (DYNARON 8601P (density: 0.89 g/cm.sup.3, MFR: 3.5 g/10 min) made by JSR Corporation), and the layer of low density polyethylene (it is the same as mentioned in above except that the thickness is 12 m).

(45) Note that, the source resin of the MFR is measured at the temperature of 190 C. (polyethylene based resin), 230 C. (polypropylene based resin), or the temperature of 230 C. (styrene-butadiene copolymer hydrogenated additives), and at the load of 21.18N which are in accordance with JIS K7210:1999.

(46) On the above mentioned release film, the methlethylketone solution (the solid concentration of 61 wt %) of the above mentioned adhesive resin composition was coated so that the thickness after the drying becomes 20 m. Then, it was dried (the drying condition: 100 C. for 3 minutes in the oven), thereby the adhesive resin layer was formed on the release film. The above mentioned adhesive resin layer was adhered to the side of the low density polyethylene density having the thickness of 8 m of the base; then the release film was removed. Thereby the adhesive resin layer was formed on the base, and the sheet having the adhesive resin layer was obtained.

(47) Also, as the core material, the same multilayered laminate as the above mentioned base was prepared. The acrylic based adhesive agent (PA-T1 made by Lintec Corporation) of the strong adhesive type was coated and dried on the release treated face of the release film (Product name SP-PET 3801, the thickness of 38 m made by Lintec Corporation) of the easy release type, so that the dried thickness is 5 m, thereby the one sided adhesive tape was obtained by adhering with the above mentioned core material.

(48) 100 parts by weight of acrylic based adhesive agent (copolymer between n-butyl acrylate and acrylic acid (n-butyl acrylate/acrylic acid=90/10 (weight ratio), the weight average molecular weight: 600,000, the glass transition temperature: 44 C.)), 200 parts by weight of urethaneacrylate oligomer having the molecular weight of 7000, 10 parts by weight of the crosslinking agent (isocyanate based) and 10 parts by weight of energy ray curing reaction initiator (benzophenone based) were mixed to form the energy ray curable adhesive agent composition.

(49) Next, the above mentioned energy ray curable adhesive composition was coated on the face of the release film (Product name SP-PET 3811, the thickness of 38 m made by Lintec Corporation) of the lightly release type, and dried (90 C. for 1 minute) to obtain the energy ray curable adhesive agent layer with the thickness of 5 m; thereby the both sided adhesive tape was produced by adhering to the core material side of the above mentioned one sided adhesive tape.

(50) The layer from the release film of the both sided adhesive tape to the energy ray curable adhesive agent layer was cut out into a circular shape having the diameter of 220 mm while leaving only the release film (the heavy release type), then this circular shape portion was removed. Next, the release film (the easy release type) of the outer peripheral of the circular portion was released; then the acrylic based adhesive agent face of the strong adhesive type which is exposed was adhered to the adhesive resin layer of the sheet having the adhesive resin layer of the above mentioned.

(51) Then, the layer from the base to the energy ray curable adhesive agent layer was cut out into a circular shape having the diameter of 270 mm while leaving only the release film (the easy release type) so that it is the concentric circle with the circular portion which has been cut out in advance, then this outer peripheral part was removed. Thereby, the tacky member having the width of 25 mm was provided to the outer peripheral part of the sheet having the adhesive resin layer. Each evaluation was carried out using this sheet having the adhesive resin layer. Note that, the adhesive resin layer does not have the pressure sensitive adhesive property under usual temperature, and for the purpose to make a comparison, the adhesive resin layer was adhered to the chip without the heat applying at the same condition as the evaluation for <the chip alignment>; then the surface protection sheet was unable to be released since the adhesive resin layer did not adhere to the chip.

Example 2

(52) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 1; except that the vinyl chloride film (the thickness: 80 m) was used as the core material. The results are shown in Table 1.

Example 3

(53) With respect to 100 parts by weight of acrylic adhesive agent (the copolymer of having the monomers of n-butyl acrylate, 2-ethylhexyl acrylate, and 2-hydroxyethylacrylate, the weight average molecular weight: 900,000, the glass transition temperature: 59 C.), 20 parts by weight of aromatic polyisocyanate (CORONATE L made by NIPPON POLYURETHANE INDUSTRY CO., LTD) was blended; thereby the re-releasable attaching agent composition was obtained.

(54) Methylethylketone solution (the solid portion concentration of 30 wt %) of the above mentioned re-releasable tacky agent composition was coated on the release film (SP-PET 38101 made by Lintec Corporation) so that the thickness after drying is 10 m; then it was dried (the drying condition: 100 C. for 1 minute in oven); and it was adhered to the side of the low density polyethylene having the thickness of 8 m of the base as similar to example 1, thereby the re-releasable attaching layer was formed, then the release film was removed.

(55) On the release film (SP-PET 3811 made by Lintec Corporation), methylethylketone solution of the above mentioned adhesive resin composition (the solid concentration of 61 wt %) was coated so that the thickness after the drying was 20 m, then it was dried (the drying condition: 100 C. for 1 minute in oven); thereby the adhesive resin layer was formed on the release film, followed by adhering with other release film (SP-PET 3801 made by Lintec Corporation). Next, other release film and the adhesive resin layer was cutout in a circular shape having the diameter of 200 mm leaving the release film (the above mentioned SP-PET 3811). Other release film of the outer peripheral portion and the adhesive resin layer were removed while leaving the circular shape. After removing other release film of the circular portion, and exposing the adhesive resin layer of the circular portion, the re-releasable attaching layer on the base produced as in above was adhered thereto. Then, the base and the re-releasable attaching layer were cut out in a circular shape having the diameter of 222 mm leaving the release film. At the end, the release film was removed and the sheet having the adhesive resin layer was obtained. The results are shown in Table 1.

Example 4

(56) 100 parts by weight of acrylic based adhesive agent (copolymer between n-butyl acrylate and acrylic acid (n-butyl acrylate/acrylic acid=90/10 (weight ratio), the weight average molecular weight: 600,000, the glass transition temperature: 44 C.)), 200 parts by weight of urethaneacrylate oligomer having the molecular weight of 7000, 10 parts by weight of the crosslinking agent (isocyanate based) and 10 parts by weight of energy ray curing reaction initiator (benzophenone based) were mixed to form the energy ray curable pressure sensitive adhesive agent composition. To this release film (SP-PET 381031 made by Lintec Corporation), this composition was coated so that the thickness after drying is 10 m, and the heat drying at 90 C. for 1 minute was carried out to form the pressure sensitive adhesive agent layer. The pressure sensitive adhesive agent layer on the release film was adhered to the side of the low density polyethylene density having the thickness of 8 m of the base as similar to example 1, and the release film was removed. Thereby the sheet having the adhesive resin layer (the adhesive sheet) wherein the adhesive rein layer is the pressure sensitive adhesive agent layer was obtained. The results are shown in Table 1.

Example 5

(57) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 1; except that the multilayered laminate comprising the layer of low density polyethylene (NOVATEC-LC520 (density: 0.923 g/cm.sup.3, MFR: 3.6 g/10 min, the thickness: 10 m) made by Japan Polychem Corporation), the layer of polypropylene (the mixture of homopolypropylene resin (Prime Polypro F-300SP (density: 0.90 g/cm.sup.3, MFR: 3.0 g/10 min) made by Prime Polymer Co., Ltd): the styrene-ethylenebutylne-styrene block copolymer (DYNARON 8601P (density: 0.89 g/cm.sup.3, MFR: 3.5 g/10 min) made by JSR Corporation)=70:30 (weight ratio), the thickness: 80 m), and the layer of low density polyethylene (same as the above) as the base and the core material. The results are shown in Table 1.

Comparative Example 1

(58) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 2 except for using the polypropylene film (the thickness: 100 m, Young's modulus: 500 MPa) as the base. The results are shown in Table 1.

Comparative Example 2

(59) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 2; except for using the low density polyethylene film (the thickness: 100 m, Young's modulus: 150 MPa) as the base. The results are shown in Table 1.

Comparative Example 3

(60) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 2; except for using polyterephthalate film (the thickness: 100 m, Young's modulus: 4000 MPa) as the base. The results are shown in Table 1.

Comparative Example 4

(61) The sheet having the adhesive resin layer provided with the tacky member at the outer peripheral was produced as same as the example 2; except for using ethylene-methacrylic acid copolymer film (the thickness: 80 m, Young's modulus: 120 MPa) as the base. The results are shown in Table 1.

(62) TABLE-US-00001 TABLE 1 Base Young's Expanding Pickup Shrinkage (%) Bending Young's modulus property property MD CD resistance modulus Thickness Thickness Chip Condition Condition Condition Condition direction direction (mm) (MPa) (m) (N/m) alignment (1) (2) (1) (2) Example 1 0.3 0.17 97 400 80 3.2 10.sup.4 A A A A A Example 2 0.3 0.17 97 400 80 3.2 10.sup.4 A A A A A Example 3 0.3 0.17 97 400 80 3.2 10.sup.4 A A A A A Example 4 0.3 0.17 97 400 80 3.2 10.sup.4 A A A A A Example 5 0.3 0.5 85 260 100 2.6 10.sup.4 A A A A A Comparative 0.5 0.4 70 500 100 5.0 10.sup.4 A B A B example 1 Comparative 1 0.5 105 150 100 1.5 10.sup.4 B A A example 2 Comparative 0.1 0.05 30 4000 100 4.0 10.sup.5 A B B example 3 Comparative 1.5 1.5 111 120 80 9.6 10.sup.3 B A A example 4