PRESSURE-SINTERING METHOD EMPLOYING DEFORMATION UPTAKE MEANS
20240316638 ยท 2024-09-26
Inventors
- Mohammad Goushegir (Flensburg, DE)
- Martin Becker (Kiel, DE)
- Ralf Kalischko (Flensburg, DE)
- Fernando Sanchez (Flensburg, DE)
Cpc classification
B22F7/08
PERFORMING OPERATIONS; TRANSPORTING
B22F7/064
PERFORMING OPERATIONS; TRANSPORTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
H01L23/3735
ELECTRICITY
H01L24/80
ELECTRICITY
International classification
Abstract
A method for fixing an attachment object to a side of a patterned object comprising a plurality of protrusions with tip portions, by pressure-sintering. A deformation uptake means made of a material having a lower yield strength and/or a lower hardness than the tip portions, is arranged between the patterned object and at least a fraction of the tip portions.
Claims
1. A method for fixing an attachment object to a patterned object by pressure-sintering, wherein the attachment object becomes fixed to an attachment side of the patterned object and wherein the patterned object comprises a patterned side facing away from the attachment side, the patterned side including a plurality of protrusions with tip portions, the method including: providing a sintering material between the attachment object and the attachment side of the patterned object; arranging the patterned object and the attachment object in a sintering tool, wherein the patterned object is arranged at a first tool side of the sintering tool and the attachment object is arranged at a second tool side of the sintering tool; arranging an additional deformation uptake means between the first tool side and at least a fraction of the tip portions, wherein the deformation uptake means is made of a deformation material having a lower yield strength and/or a lower hardness than the tip portions; a solidification step including pressing the patterned object and the attachment object towards each other for densifying the sintering material and applying heat to the sintering material, thereby sintering the sintering material and forming a sinter layer between the attachment side and the attachment object.
2. The method according to claim 2, further including plastically deforming the deformation uptake means locally by pressing the deformation uptake means against the patterned object at its patterned side.
3. The method according to claim 1, including plunging at least 20 number-% and/or at least 20 area-% of the tip portions into the deformation uptake means causing local plastic deformation of the deformation uptake means during the solidification step and/or an adaption step preceding the solidification step, by pressing the deformation uptake means against the patterned object at its patterned side.
4. The method according to claim 1, wherein the fraction of the tip portions corresponds to at least 50% of all of the tip portions.
5. The method according to claim 1, wherein a yield strength of the deformation material is at the most 80% of a yield strength of the protrusions.
6. The method according to claim 1, wherein a hardness of the deformation material is at the most 80% of a hardness of the tip portions.
7. The method according to claim 1, wherein the deformation material has a thermal conductivity of at least 30 W/(m.Math.K).
8. The method according to claim 1, wherein the deformation uptake means includes a metal sheet.
9. The method according to claim 1 wherein the deformation material is aluminum with a purity of at least 99.0 weight-%.
10. The method according to claim 1, wherein the yield strength of the deformation material is at least 8 MPa.
11. The method according to claim 1, wherein an elevated sintering temperature is in the range from 200? C. to 300? C. and wherein the deformation material is stable at the elevated sintering temperature.
12. The method according to claim 1, wherein at least cores of the protrusions are made of copper and/or aluminum.
13. The method according to claim 1, wherein a thickness of the deformation uptake means is in the range from 0.5 mm to 5 mm.
14. The method according to claim 1, wherein the patterned object is or comprises a heat dissipator, a heat sink, and/or a part for a cooler, and wherein the attachment object is or comprises at least one of the following: a heat generating component, an electronic component, and a semiconductor power module.
15. The method according to claim 1, wherein the protrusions are fins.
16. An assembly comprising an attachment object and a patterned object, wherein the attachment object is fixed to an attachment side of the patterned object by pressure-sintering, and wherein the patterned object comprises a patterned side facing away from the attachment side, the patterned side including a plurality of protrusions, wherein the attachment object has been permanently fixed to the patterned object by the method according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0146] Preferred embodiments of the invention will now be described with reference to the drawings, in which:
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DETAILED DESCRIPTION
[0156]
[0157] The attachment side 32 of the patterned object 30 is substantially flat, at least in respective contact areas at which the attachment objects 50 become fixed. A normal direction N is perpendicular to said contact areas. In this example, the whole attachment side 32 is flat. Correspondingly, the normal direction N is perpendicular to the complete attachment side 32.
[0158] Before the situation shown in
[0159] In
[0160] The sintering material 40 can include sintering paste. Additionally or alternatively, it can include one or more sintering pads. The sintering material 40 can include a volatile organic component and silver particles. It may be applied wet.
[0161] The method can further include pre-drying the applied sintering material 40 before the solidification step. During the pre-drying, the volatile organic component at least partly evaporates. In particular, pre-drying can be performed before the attachment objects 50 are placed at the attachment side 32 with the sintering material 40 in between. The pre-drying can be performed outside of the pressure-sintering tool 10.
[0162] In the examples shown in
[0163] In this example, each attachment object 50 comprises a direct bonded copper (DCB) structure with a ceramic insulation layer 52, an integrated heat spreader 51, and an internal circuit layer 53. The integrated heat spreader 51 is arranged at the interface side of the attachment object 50. The integrated heat spreader 51 is formed on one side of the insulation layer 52 and fixed to the latter. The internal circuit layer 53 is formed on and fixed to an opposite side of the insulation layer 52 (e.g. the upper side in
[0164] According to one aspect, (at least some of) the internal sinter layers 54 can be formed from sintering material by solidification in the same solidification step as a sinter layer that is formed from the sintering material 40.
[0165] However, in the exemplary embodiments shown, the attachment objects 50 are molded (semiconductor power) modules. The internal sinter layers 54 are already sintered. Each molded module comprises a resin cover 57. The resin cover 57 covers the whole semiconductor power module except the integrated heat spreader 51 at the interface side. The resin cover 57 exhibits electrical insulation, protection against humidity as well as protection against mechanical and chemical damage.
[0166] The attachment side 32 of the patterned object 30 is substantially flat, at least in contact areas at which the attachment objects 50 become fixed. The normal direction N is perpendicular to said contact areas. In this example, the whole attachment side 32 is flat. Correspondingly, the normal direction N is perpendicular to the complete attachment side 32.
[0167] The patterned object 30 comprises a planar main plate 31, which (at least substantially) extends perpendicular to the normal direction N. One end side of the main plate 31 along the normal direction N is the attachment side 32. A side opposite to the attachment side 32 is a patterned side 33. The patterned side 33 comprises a plurality of protrusions 34. The protrusions 34 protrude along the normal direction N from the main plate 31.
[0168] In this exemplary embodiment, all protrusions 34 are formed as pin fins. The pin fins can be seen best in
[0169] Alternatively or in addition, protrusions with other shapes can be formed at the patterned side 33. For example, such other shapes can include oblong fins (e.g. cooling ribs).
[0170] In this exemplary embodiment, the patterned object 30 is a heat sink. It is configured to take up heat from the attachment objects 50 during operation, to spread the heat and further dissipate it by the protrusions (pin fins) 34 to an environmental fluid, e.g. air.
[0171] Additionally or alternatively, the patterned side 33 may include a channel structure for guiding fluid, e.g. a coolant. The patterned object 30 can be a cooler or a component for forming a substantial part of a cooler (a part for a cooler). For example, the patterned object 30 can include or consist of a metal layer with an internal structure for a flow distributor, e.g. according to any one of the embodiments disclosed in EP 2 559 063 Bi. In this context, the inner walls of the metal layer can be considered protrusions 34.
[0172] In the shown embodiments, the protrusions (pin fins) 34 at the patterned side 33 are produced by stamp forging. They are not subjected to additional mechanical postprocessing, e.g. milling, for improving a manufacturing tolerance regarding protrusion lengths of the protrusions 34. Therefore, the protrusion lengths along the normal direction N vary. In
[0173] The patterned object 30 can be made of copper, e.g. of a copper-based alloy. Copper and copper-based alloys facilitate a strong and reliable fixation of the sinter layer formed from the sintering material 40. At least the protrusions 34 might be coated with a coating, e.g. with a nickel coating (including coatings made of nickel-based alloys).
[0174] Alternatively, the patterned object 30 is basically made of aluminum, e.g. of an aluminum alloy. This facilitates producing the protrusions 34 by stamp forging. Optionally, the patterned object 30 may include at least one inlay 36 at the attachment side 32 where the attachment objects 50 are fixed. The inlay(s) 36 may be made of copper, e.g. of a copper-based alloy. As noted above, this facilitates strong and reliable fixation of the sinter layer. Furthermore, copper has a particularly high heat conduction. The heat taken up from the attachment objects 50 via the sinter layer is efficiently pre-dissipated within the patterned object 30 by the inlay(s) 36.
[0175] The pressure-sintering tool 10 comprises a first tool side 11 and a second tool side 12. The first tool side 11 and the second tool side 12 are configured to apply forces F.sub.11 and F.sub.12 for pressing the attachment objects 50 and the patterned object 30 towards each other along the normal direction N. In
[0176] Conventionally (not shown), the patterned side 33 of the patterned object 30 directly abuts the first tool side 11. Only the tip portions of the longest protrusions 34m (those with the longest protrusion length L34m) abut on and engage the first tool side 11. The first tool side 11 must be hard and strong, e.g. have a high hardness and a high yield strength, because the pressure-sintering tool 10 must not be damaged during the solidification step. The pressure-sintering tool 10 must be reliable, long-lasting, and usable for performing a large plurality of solidification steps. Hence, the first tool side 11 must not yield, at least not plastically, in the course of the solidification step.
[0177] As a consequence, in conventional pressure-sintering (not shown), the force F.sub.11 applied by the first tool side 11 is transferred to the main plate 31 of the patterned object 30 exclusively via the longest protrusions 34m. The intermediate protrusions 34i and the shortest protrusions 34s are not involved in the force transfer. This results in excessive local stresses and deformations of the patterned object 30 during the solidification step. The attachment side 32 can locally bulge. This leads to variations of the pressure applied to the sintering material 40 and to local variations of the sintering quality.
[0178] In addition, depending on a spatial distribution of the longest protrusions 34m laterally to the normal direction N and/or due to different thicknesses of the attachment objects 50 (along the normal direction N), it can happen that the patterned object 30 (especially its attachment side 32) is not aligned properly perpendicularly to the normal direction N during the solidification step. This results in global thickness variations of the sinter layer. For example, at least a section of the sinter layer for one of the attachment objects 50 may have a cross-sectional shape (in a plane parallel to the normal direction) that is more similar to a trapezoid, e.g. a right trapezoid, than to a rectangle. Additionally, the thickness of the sinter layer may vary for the different sections for the different attachment objects 50.
[0179] According to the present invention and as shown in
[0180] The deformational uptake means 20 partially deforms during the solidification step in order to allow more and more of the protrusions 34 to engage with the deformation uptake means 20 while the pressure applied on the sintering material 40 is increased.
[0181] The deformation uptake means 20 is made of a deformation material. The deformation uptake means 20 is softer than the first tool side 11 and softer than the protrusions 34. In the exemplary embodiment shown in
[0182] Further, the exemplary deformation uptake means 20 shown in
[0183] The pure aluminum exhibits sufficient heat conduction for applying heat to the sintering material 40 in the solidification step and is chemically stable at an elevated sintering temperature.
[0184] If the patterned object 30, especially its protrusions 34 are made of aluminum, this kind of aluminum has a higher yield strength and hardness than the pure aluminum. For example, the aluminum used for the attachment object 50 is aluminum with less purity, e.g. an aluminum alloy, and/or it is of another temper condition. In every case, it exhibits higher yield strength and hardness than the pure aluminum used as the deformation material.
[0185]
[0186] In the first stage of the solidification step shown in
[0187] If the forces F.sub.11 and F.sub.12 are increased further, stresses at the engagement areas of the deformation uptake means 20 with the tip portions of the longest protrusions 34m rise. At first, the deformation uptake means 20 yields (at least predominantly) elastically. When the stresses at the engagement areas exceed a certain threshold, the deformation uptake means 20 yields plastically at the corresponding engagement areas. The deformation material starts to plastically flow around the corresponding tip portions and these tip portions plunge into the deformation uptake means 20 further with local plastic deformation of the latter at the corresponding engagement areas.
[0188]
[0189] Compared to the first stage shown in
[0190] Naturally, the tip portions of the longest protrusions 34m continue to engage the deformation uptake means 20. Now, the tip portions of the intermediate protrusions 34i have additionally come into direct contact with the deformation uptake means 20. They additionally abut and hence additionally engage the deformation uptake means 20 now. In other words, additional engagement areas are formed between the deformation uptake means 20 and tip portions, which are different from the longest protrusions 34m. From now on, the intermediate protrusions 34i additionally contribute to the transfer of the force F.sub.11 from the first tool side 11 to the rest of the patterned object (particularly to the main plate 31) and hence to the sintering material 40. This prevents that excessive loads are applied onto the longest protrusions 34m only.
[0191]
[0192] The tip portions of the intermediate protrusions 34i have also plunged into the deformation uptake means 20 to a certain extent with plastic deformation. Even the tip portions of the shortest protrusions 34s have plunged into the deformation uptake means 20 with plastic deformation. Naturally, the tip portions of the shortest protrusions 34s are not plunged as deep into the deformation uptake means 20 as the tip portions of the intermediate protrusions 34i and the tip portions of the intermediate protrusions 34i are not plunged as deep into the deformation uptake means 20 as the tip portions of the longest protrusions 34m.
[0193] Compared to the first stage shown in
[0194] Although the maximum pressure in the solidification step is reached in
[0195] In
[0196] The protrusions 34 do not plastically deform during the solidification step.
[0197] During the solidification step, the sintering material is not only subjected to the high pressure. In addition, the sintering tool 10 also heats up the sintering material 40 to the elevated sintering temperature. For example, the solidification step may include applying the elevated sintering temperature in a temperature range from 200? C. to 300? C. and the pressure in the range from 10 to 40 MPa to the sintering material 40 for a sintering time. The sintering time may be at least 2 minutes in order to ensure proper sintering of the whole sintering material 40. Additionally or alternatively, the sintering time may be 10 minutes at the maximum in order to reduce a risk of thermal degradation of the sinter layer formed from the sintering material 40 and/or of the attachment objects 50. Furthermore, shorter sintering times reduce the costs for heating and allow faster production.
[0198] The heat application from the second tool side 12 is limited in order not to risk thermal damage of the attachment objects 50. As the deformation uptake means 20 exhibits high heat conduction, the sintering material 40 can be heated up quickly by applying a majority of the heat from the first tool side 11.
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[0200] In general, the method can be performed with other numbers of attachment objects 50 and other numbers of patterned objects 30 as well. For example, only one attachment object 50 may be fixed to the patterned object 30. In another modification, there are three attachments objects 50 and three corresponding separate metal sheets 20a, 20b.
[0201] As shown in
[0202] It is possible that the deformation uptake means 20 covers (overlaps with) only a fraction of all protrusions 34 in the solidification step. For example, in a modification of
[0203] There are several approaches for quantifying how much percent of the tip portions have plunged into the deformation uptake means 20 with plastic deformation in the solidification step.
[0204] For example, it can be referred to a percentage of a number of the indentations 21 (as shown in
[0205] Another approach is to sum up opening areas 22 (unit: m.sup.2 or the like) of all indentations 21 in the deformation uptake means 20, resulting in an area A.sub.p1. In
[0206] The deformation uptake means 20 can be re-used. For example, when the solidification step is finished and when an assembly, which is formed by fixing the attachment objects 50 to the patterned object 30 by pressure-sintering, is taken out of the sintering tool. The deformation uptake means 20 is simply turned upside down and re-used for a new method cycle, in which new attachment objects 50 are fixed to a new patterned object 30.
[0207] When the solidification step is finished, the sintering material 40 has been transformed to a sinter layer. The resulting assembly includes the patterned object 30, the attachment objects 50, and the sinter layer in-between. The sinter layer permanently fixes the attachment objects 50 to the patterned object 30. With the disclosed method, a very thin and uniform sinter layer is produced, despite of the height tolerances. This allows easier and more cost-efficient production of the patterned object 30. The thin and uniform sinter layer exhibits particularly good heat conduction from the attachment objects 50 to the patterned object 30 and particularly high reliability.
[0208]
[0209] While the present disclosure has been illustrated and described with respect to a particular embodiment thereof, it should be appreciated by those of ordinary skill in the art that various modifications to this disclosure may be made without departing from the spirit and scope of the present disclosure.