Apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device

Abstract

Disclosed is an apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device, in particular a coater or a bonder. The apparatus includes a sealing structure arranged in the pipe, a flow structure having a fluid inlet arranged upstream of the sealing structure and a fluid outlet arranged downstream of the sealing structure, a first chamber arranged in the pipe upstream of the sealing structure, and a second chamber arranged in the pipe downstream of the sealing structure, and a measuring device, wherein the measuring device is adapted to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.

Claims

1. An apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device comprising: a sealing structure which is arranged in the pipe, a flow structure having a fluid inlet which is arranged upstream of the sealing structure and a fluid outlet which is arranged downstream of the sealing structure, a first chamber which is arranged in the pipe upstream of the sealing structure, and a second chamber which is arranged in the pipe downstream of the sealing structure the first and second chamber being separated from each other by the sealing structure, and a measuring device, wherein the measuring device is configured to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, the first chamber and the second chamber being connected to the measuring device via fluid connections and/or pressure connections, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.

2. The apparatus according to claim 1, wherein the flow structure extends within the pipe.

3. The apparatus according to claim 1, wherein the sealing structure is a sealed barrier.

4. The apparatus according to claim 1, wherein the first chamber and/or the second chamber are connected to the sealing structure.

5. The apparatus according to claim 1, wherein the first chamber and the second chamber each have an opening to allow the fluid to flow into the first respectively second chamber.

6. The apparatus according to claim 1, wherein the first chamber and/or the second chamber are conically shaped.

7. The apparatus according to claim 1, wherein the first chamber and/or the second chamber are arranged coaxially to the sealing structure.

8. The apparatus according to claim 1, wherein the measuring device is connected to the first chamber and the second chamber via fluid lines and/or pressure ports or pressure lines, to measure the first and second fluid pressure.

9. The apparatus according to claim 1, wherein the measuring device comprises at least one pressure sensor element configured for measuring the first fluid pressure and the second fluid pressure.

10. The apparatus according to claim 1, wherein the measuring device comprises a processing unit, which is configured to determine the fluid flow based on a pressure difference between the first and second fluid pressure.

11. The apparatus according to claim 1, wherein the apparatus comprises a flow regulator which is arranged within the pipe, wherein the flow regulator is adjustable to control the fluid flow.

12. The apparatus according to claim 11, wherein the measuring device is configured to control the flow regulator based on the determined fluid flow.

13. The apparatus according to claim 11, wherein the flow regulator is a flap or a turbine, which is arranged within the pipe.

14. A semiconductor manufacturing device comprising a pipe and an apparatus for measuring a fluid flow through the pipe according to claim 1.

15. The semiconductor manufacturing device according to claim 14, wherein the pipe is a discharge line for contaminated fluids.

16. The apparatus according to claim 1, wherein the semiconductor manufacturing device is a coater or a bonder.

17. The apparatus according to claim 1, wherein the sealing structure is a plug.

18. An apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device comprising: a sealing structure which is arranged in the pipe, a flow structure having a fluid inlet which is arranged upstream of the sealing structure and a fluid outlet which is arranged downstream of the sealing structure, wherein the flow structure comprises a plurality of tubes , the tubes being formed by through holes in the sealing structure, or wherein the flow structure is at least one separate tube that bypasses the sealing structure, a first chamber which is arranged in the pipe upstream of the sealing structure, and a second chamber which is arranged in the pipe downstream of the sealing structure, the first and the second chamber being separated from each other by the sealing structure, and a measuring device, wherein the measuring device is configured to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.

19. The apparatus according to claim 18, wherein the flow structure comprises flow straightener tubes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Further embodiments of the invention will be described with respect to the following figures, in which:

(2) FIG. 1 shows a schematic view of an apparatus for measuring a fluid flow through a pipe;

(3) FIG. 2 shows a schematic view of an apparatus for measuring a fluid flow through a pipe according to an alternative embodiment;

(4) FIG. 3 shows a schematic view of an apparatus for measuring a fluid flow through a pipe according to an alternative embodiment;

(5) FIG. 4 shows a cross section view of a sealing element of the apparatus from FIG. 3;

(6) FIG. 5 shows a schematic view of a flow regulator of the apparatus from FIG. 3;

(7) FIG. 6 shows a schematic view of an apparatus for measuring a fluid flow through a pipe; and

(8) FIG. 7 shows a schematic view of a semiconductor manufacturing device.

DETAILED DESCRIPTION OF THE DRAWINGS

(9) FIG. 1. Shows a schematic view of an apparatus 100 for measuring a fluid flow through a pipe 101 according to an embodiment.

(10) The apparatus 100 comprises a sealing structure 103 which is arranged in the pipe 101, a flow structure 105 having a fluid inlet 107 which is arranged upstream of the sealing structure 103 and a fluid outlet 109 which is arranged downstream of the sealing structure 103, a first chamber 123 which is arranged in the pipe 101 upstream of the sealing structure 103, and a second chamber 125 which is arranged in the pipe 101 downstream of the sealing structure 103.

(11) The apparatus 100 further comprises a measuring device 111, wherein the measuring device 111 is adapted to measure a first fluid pressure in the first chamber 123 and a second fluid pressure in the second chamber 125, wherein the measuring device 111 is configured to determine the fluid flow based on the first and second fluid pressure.

(12) The flow structure 105 is a single tube that extends within the pipe 101 and pierces through the sealing structure 103. The flow structure 105 has a lower diameter than the pipe 101 and therefore forms a restriction respectively constriction in the pipe that the fluid has to pass through in order to get past the sealing structure 103.

(13) The diameter of the flow structure 105 can be less than 75% of the diameter of the pipe, preferably the diameter of the flow structure 105 is less than 50% of the diameter of the pipe 101, more preferably the diameter of the flow structure 105 is less than 25% of the diameter of the pipe. The flow structure 105 is sized to correspond to the flow range of the system and the differential pressure sensor range.

(14) Thereby, the flow structure 105 can have a length of at least 2 cm, in particularly a length of at least 5 cm.

(15) The fact that the flow structure 105 has a lower diameter than the pipe 101 causes a pressure increase of the fluid in-front of the fluid inlet 107 and a pressure decrease of the fluid behind the fluid outlet 109. The increased fluid pressure at the fluid inlet 107 spreads into the first chamber 123 and the decreased fluid pressure at the fluid outlet 109 spreads into the second chamber 125.

(16) Therefore, the first chamber 123 is a high pressure chamber, and the second chamber 125 is a low pressure chamber. The sealing structure 103 prevents a pressure equalization between both chambers 123, 125.

(17) The measuring device 111 comprises at least one pressure sensor element configured to measure the fluid pressure in each chamber. The measuring device 111 then determines the flow rate of the fluid based on the measured pressure difference. In particular, the apparatus 100 is a differential pressure flowmeter that uses Bernoulli's equation to determine the flow of fluid based on the pressure measurements.

(18) In order to measure the first fluid pressure and the second fluid pressure the measuring device 111 is connected to the first chamber 123 and the second chamber 125 via two pressure ports 113, 115 that are arranged at a side wall of the pipe 101.

(19) The pressure ports 113, 115 can comprise pressure port adapters or pressure joints that are fixed to the pipe 101 and that pass on the fluid pressure at each port 113, 115 to the pressure sensor element (or multiple pressure sensor elements) of the measuring device 111.

(20) Both pressure ports 113, 115 can each comprise a valve, such that the first pressure port 113 acts as a high pressure tab and the second pressure port 115 acts as a low pressure tap.

(21) The apparatus 100 in FIG. 1 further comprises a first seal 119 upstream of the sealing structure 103 and a second seal 121 downstream of the sealing structure. The first chamber 123 is formed in the pipe 101 between the first seal 119 and the sealing structure 103 and the second chamber 125 is formed in the pipe 101 between the sealing structure 103 and second seal 121.

(22) The flow structure 105 pierces through the first seal 119 and the second seal 121, allowing fluid from upstream the first chamber 123 to flow into fluid inlet 107 and back into the pipe 101 through the fluid outlet 109 downstream of the second chamber 125.

(23) The first and second seal 119, 121 both have an opening 127, 129 allowing the fluid from upstream the first seal 119 respectively downstream the second seal 121 to flow into the first respectively second chamber 123, 125.

(24) The first seal 119 can be arranged approximately at the level of the fluid inlet 107 or shortly behind the fluid inlet 107. Equivalently, the second seal 121 can be arranged approximately at the level of the fluid outlet 109 or shortly before the fluid outlet 109. Hence, the fluid in the chambers will have an equal or similar pressure than the fluid in front of the fluid inlet 107 respectively behind the fluid outlet 109.

(25) The flow structure 105 forms a constriction for the fluids, which can cause fluid turbulences at the fluid inlet 107 and/or outlet 109. These turbulences cause pressure fluctuations which can disturbed the pressure measurement, leading, for instance, to high measurement noise. In addition, fluid contamination can gather at the fluid inlet 107 and/or outlet 109, causing additional disturbances. The chambers 123, 125 protect the pressure measurements against these turbulences and contaminations of the fluid, allowing an undisturbed and noise free measurement of the fluid pressure and flow rate. Thereby, the chambers act as capacitance to smooth out the measurement signal.

(26) The chambers 123, 125 can both comprise a filter or thin diaphragm to prevent contaminations to affect the pressure measurements. The filter or diaphragm can be located at the openings 127, 129, or inside the chambers 123, 125.

(27) FIG. 2 shows a schematic view of an apparatus 100 for measuring a fluid flow through a pipe 101 according to an alternative embodiment.

(28) The flow structure 105 in FIG. 2 comprises a plurality of tubes 201a-d which are arranged side by side in the pipe 101.

(29) Each tube has a fluid inlet 203a-d and a fluid outlet 205ad. The tubes 201a-d are arranged to form a flow straightener for the fluids, thus reducing fluid turbulences at the inlets 203a-d and/or outlets 205a-d

(30) FIG. 3 shows a schematic view of an apparatus 100 for measuring a fluid flow through a pipe 101 according to an embodiment.

(31) The chambers 123, 125 of the apparatus 100 in FIG. 3 are conically shaped and located at the central sealing structure 103. Thereby, the chambers have a smaller diameter than the pipe 101, i.e. they do not fill out the pipe 101 entirely. The shape and position of the chambers 123,125 further reduces the generation of turbulences in the pipe.

(32) The measuring device 111 in FIG. 3 comprises a pressure sensor element 311 for measuring the first and second fluid pressure.

(33) The pressure connection between both chambers 123, 125 and the pressure sensor element 311 is partially realized via two fluid lines 301, 303. The fluid lines 301, 303 are channels in the sealing structure 103.

(34) FIG. 3 further shows a control unit 305 that is connected to the measuring device 111. The control unit receives the fluid pressure values from the measuring device 111 and calculates the fluid flow rate based on these values.

(35) The control unit 305 can be processing unit or comprise a processing unit that receives the pressure values and performs the calculation.

(36) The apparatus 100 in FIG. 3 further comprises a flow regulator 309 which is located downstream of the sealing structure 103.

(37) FIG. 4 shows a cross section view of a sealing structure 103 of the apparatus 100 from FIG. 3 according to an embodiment.

(38) In the exemplary embodiment shown in FIG. 4, the sealing structure 103, the flow structure 105 and the chambers 123, 125 form a single component of the apparatus 100.

(39) Similar to the apparatus 100 shown in FIG. 2, the flow structure 105 in FIG. 4 comprises a plurality of tubes 201a-c which are formed as through holes in the sealing structure 103. In this arrangement the tubes 201a-c form a flow straightener structure that further reduces turbulences in the pipe 101.

(40) The tubes 201a-c and the chambers 123, 125 are arranged coaxially to achieve a steady through flow of the fluid.

(41) FIG. 4 further shows, that the opening 127, 129 of the conical shaped chambers 123, 125 can be positioned at the respective tips of the chamber cones.

(42) FIG. 5 shows a schematic view of a flow regulator of the apparatus from FIG. 3 according to an embodiment.

(43) The flow regulator 309 can comprise a flap which can fully or partially block the fluid flow. Alternatively the flow regulator can comprise a turbine which can increase the fluid flow.

(44) The flow regulator 309 can be connected to the control unit 305 of the apparatus 100. The control unit 305 can receive the determined flow rate of the fluid and control the flow regulator based on this value.

(45) If, for instance, the control unit 305 determines that the flow rate exceeds a predetermined range, than the control unit 305 controls the flow regulator 309 to reduce the fluid flow, e.g. by closing a flap of the flow regulator. The control of the flow regulator 309 can be realized by a PID control loop.

(46) FIG. 6 shows a schematic view of an apparatus 100 for measuring a fluid flow through a pipe 101 according to an embodiment.

(47) In the design shown in FIG. 6, the sealing structure 103 has a larger diameter than the pipe 100, which is connected to the sealing structure 103 on both end. The chambers 123, 125 form a part of the sealing structure are surrounded by the flow straightener tubes (not shown).

(48) Thereby the sealing structure 103, the chambers 123, 125 and the flow structure 105 form a single component of the apparatus 100 to which the pipe 101 can be connected.

(49) FIG. 7 shows a schematic view of a semiconductor manufacturing device 700 according to an embodiment.

(50) The semiconductor manufacturing device 300 comprises a pipe 101 and an apparatus 100 for measuring a fluid flow through the pipe 101. The apparatus 100 in the semiconductor manufacturing device 300 can be the apparatus 100 according to the embodiments of FIG. 1, FIG. 2 or FIG. 3.

(51) The semiconductor manufacturing device 700 can be a bonder, a coater, a mask cleaner or an exposure device.

(52) The semiconductor manufacturing device 700 can comprise a process chamber 701. The pipe 101 can be a discharge line or exhaust duct of the process chamber 701. A semiconductor substrate can be chemically treated in the process chamber 701 giving rise to contaminated fluids, which are discharged from the process chamber through the pipe 101.

(53) A semiconductor manufacturing process in the device 300, for instance a coating process, can be monitored by measuring the fluid flow through the pipe 102.

LIST OF REFERENCES

(54) 100 apparatus 101 pipe 103 sealing structure 105 flow structure 107 fluid inlet 109 fluid outlet 111 measuring device 113 first pressure port 115 second pressure port 119 first seal 121 second seal 123 first chamber 125 second chamber 127 opening 129 opening 201a-d tubes 203a-d fluid inlets 205a-d fluid outlets 301 fluid line 303 fluid line 305 control unit 309 flow regulator 311 pressure sensor element 700 semiconductor manufacturing device 701 process chamber