Smart garnish for automobile
11498422 ยท 2022-11-15
Inventors
Cpc classification
B60K35/00
PERFORMING OPERATIONS; TRANSPORTING
H03K2217/960755
ELECTRICITY
International classification
Abstract
Provided is a smart garnish installed on an automobile interior material (a door trim, an instrument panel, a console, or the like), and to a smart garnish for an automobile which is driven when a capacitance change is sensed by a pressed deformation of an upper case through a capacitive touch sensor pad formed of a ground (GND) and capacitive touch sensors corresponding to symbols and capacitive force sensors distributed corresponding to the ground and thus the touch and force of the desired symbol are sensed without noise.
Claims
1. A smart garnish for an automobile comprising: a case; an upper case, in which a film having symbols printed therein is insert-injection-molded, being coupled to the case in front of the case; a capacitive touch sensor pad laminated on a rear surface of the upper case; a capacitive force sensor pad laminated on a front surface of the case; and a PCB (printed circuit board) mounted in the case, wherein LEDs (light emitting diodes) mounted on the PCB illuminate the symbols, wherein a gap is formed between the capacitive touch sensor pad and the capacitive force sensor pad, wherein the capacitive touch sensor pad includes capacitive touch sensors disposed corresponding to the symbols, and a ground (GND) disposed spaced apart from the capacitive touch sensor, and wherein the capacitive force sensor pad includes capacitive force sensors distributed corresponding to the ground (GND), wherein the case includes: a case body in which the PCB is mounted; a cover configured to cover a back surface of the case body; and a case holder disposed on a front surface of the case body, wherein the upper case is assembled on the case holder, and wherein a haptic actuator configured to vibrate the case holder relative to the case body is mounted in the case, wherein both side plates of the haptic actuator are fastened and fixed to ribs formed on the case holder, wherein long holes which allow the ribs to be inserted therethrough and laterally vibrate fife formed in the PCB, and wherein the case holder and the upper case become moving objects which are vibrated, and the case body and the cover become fixed objects which are not vibrated.
2. The smart garnish for an automobile of claim 1, wherein: a surface and the rear surface of the upper case are formed of a three-dimensional (3D) curved surface and a flat surface; the film is installed on the surface of the upper case; and the capacitive touch sensor pad is installed on the flat surface of the upper case.
3. The smart garnish for an automobile of claim 1, further comprising a restoring spring configured to elastically restore the case holder relative to the case body.
4. The smart garnish for an automobile of claim 3, wherein the restoring spring is a plate spring, wherein an end of the plate spring is coupled to the case body and another end of the plate spring is coupled to the case holder, and wherein the plate spring includes: a front horizontal plate spring installed at the case body; a back horizontal plate spring installed at the case holder; and a vertical plate spring configured to connect the front and back horizontal plate springs.
5. The smart garnish for an automobile of claim 4, further comprising a diffusion sheet disposed between the capacitive force sensor pad and the case holder.
6. The smart garnish for an automobile of claim 5, wherein: through-holes through which a light from the LEDs passes are formed on a front surface of the case holder; and light guide tubes configured to connect the LEDs and the through-holes are formed in the case holder.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF SYMBOLS
(9) TABLE-US-00001 1: smart garnish for automobile 10: upper case 12: film 20: case 20a: case body 20b: cover 20c: case holder 25: light guide tube 30: PCB 31: LED 40: capacitive touch sensor pad 41: capacitive touch sensor 50: capacitive force sensor pad 51: capacitive force sensor 60: haptic actuator 70: restoring spring (plate spring) 80: diffusion sheet
DETAILED DESCRIPTION OF EMBODIMENTS
(10) Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
(11)
(12) Referring to
(13) Further, when the upper case 10 is assembled on the front of the case 20, a gap (for example, roughly 0.4 to 0.5 mm) is formed between the capacitive touch sensor pad 40 and the capacitive force sensor pad 50
(14) Particularly, as shown in
(15) That is, the capacitive touch sensors 41 which are black circles in
(16) As such, the ground (GND) pursues stability, and the capacitive touch sensors 41 pursue sensitivity in a case in which the capacitive touch sensors 41 and the ground (GND) are disposed coplanarly in comparison with a case in which the capacitive touch sensors 41 and the ground (GND) are not disposed coplanarly (double placement where the ground pad is stacked under the capacitive touch sensor pad).
(17) The capacitive force sensor pad 50 includes capacitive force sensors 51 distributed on a portion facing the ground (GND) of the capacitive touch sensor pad 40.
(18) That is, as shown in
(19) As can be seen through
(20) Even when the capacitive force sensors 51 are sparsely disposed around the positions where the symbols are located, in the case in which a certain symbol of the upper case 10 is pressed, since not only a pressed portion but also a periphery of the pressed portion are bent downward, at least a plurality of capacitive force sensors 51 prevent a malfunction through one-to-many matching which senses a plurality of deformations of the gap.
(21) Generally, as shown in
(22) Since the upper case 10 having such a thickness is, for example, bent as a whole when a center thereof is pressed, and is bent with a periphery thereof when an edge thereof is pressed, capacitive force sensing may be stable enough to be performed even when the capacitive force sensors 51 are sparsely and widely distributed.
(23) Like a conventional case, when the capacitive touch sensors 41 and the capacitive force sensors 51 are configured to be matched one-to-one in the upper case 10 formed with the 3D curved surface and the large thickness, in the case in which one desired capacitive touch sensor is brought into contact and pressed, since not only the capacitive force sensor at that location, but also the capacitive force sensors at the periphery are also force-sensed, a malfunction occurs due to a lot of noise.
(24) Accordingly, in the embodiment, even when the force sensors 41 are sparsely disposed corresponding to the ground (GND) rather than the positions corresponding to the symbols, since a touch is accurately sensed and broad force sensing is also accurately sensed, the malfunction may be definitely prevented.
(25) Here, when the capacitive touch sensor pad 40 is attached to the curved surface, since a gap is formed and air fills the gap, a malfunction occurs, and thus the rear surface 13 of the upper case 10 is formed not like the curved surface but like the surface 11 having a flat surface to prevent the malfunction.
(26) As shown in
(27) The case body 20a is fastened and fixed to an interior material through a fastening hole bracket 21 formed on a side surface thereof.
(28) The cover 20b is a PCB protection cover, and is fastened and fixed to the case body 20a, and in this case, the PCB 30 is also supported by the case body 20a.
(29) As shown in
(30) Further, the upper case 10 is assembled on a front of the case holder 20c, and fastening protrusions 15 are formed on edges of the case holder 20c and fastening grooves 16 fastened to the fastening protrusions 15 are formed on edges of the upper case 10.
(31) In addition, the case holder 20c is supported on the case body 20a through a haptic actuator 60 to be laterally vibratable.
(32) As shown in
(33) In this case, when the haptic actuator 60 vibrates, since the ribs 21c laterally vibrate and thus the case holder 20c laterally vibrates, long holes 35 which allow the ribs 21c to be inserted therethrough and laterally vibrate are formed in the PCB 30.
(34) The haptic actuator 60 is mounted to laterally vibrate the case holder 20c relative to the case body 20a.
(35) That is, when all the capacitive touch sensors 41 and the capacitive force sensors 51 are sensed, as shown in
(36) Accordingly, the case holder 20c and the upper case 10 become moving objects which are vibrated, and the case body 20a and the cover 20b become fixed objects which are not vibrated.
(37) In this case, restoring springs 70 which elastically restore the case holder 20c to an original position relative to the case body 20a may be further included.
(38) As shown in
(39) The plate springs 70 are bent plates mounted in the case 20, and may include front horizontal plate springs 71 installed at ribs 21a of the case body 20a, back horizontal plate springs 73 installed at ribs 22a of the case holder 20c, and vertical plate springs 75 which connect the front and back horizontal plate springs 71 and 73. The vertical plate springs 75 may connect may connect, for example, lateral ends of the front and back horizontal plate springs 71 and 73
(40) The vertical plate springs 75 substantially serve as the restoring springs.
(41) As shown in
(42) Meanwhile, as shown in
(43) Further, as shown in
(44) The light guide tubes 25 are tubes which extend rearward from the through-holes 22, and also serve to prevent light leakage.
(45) Further, as shown in
(46) The diffusion sheet 80 simultaneously contributes to secondary shielding and uniformity of illuminance.
(47) Hereinafter, an operation according to the embodiment will be described.
(48) First, when a driver pushes the capacitive touch sensor 41 corresponding to a desired symbol among the symbols of the upper case 10 by a finger, a first capacitance is formed between the finger which is a conductor and the capacitive touch sensor 41, and a second capacitance is formed due to a gap change between a pressed and drooping portion of the upper case 10 and the capacitive force sensor pad 50.
(49) Accordingly, when both the first and second capacitances are input to the PCB 30, a mode of the touched symbol is operated, and in addition, feedback is provided due to vibration of the haptic actuator 60.
(50) Since the embodiments according to the concept of the present disclosure may be variously changed and have various forms, the embodiments will be exemplified and described in the drawings, but the embodiments according to the concept of the present disclosure are not limited to the particular embodiments and include all changes, equivalents, and substitutes within the spirit and the scope of the present disclosure.