Graphene device and method of fabricating a graphene device

Abstract

In accordance with an example embodiment of the present invention, a device comprising one or more porous graphene layers, the or each graphene porous layer comprising a multiplicity of pores. The device may form at least part of a flexible and/or stretchable, and or transparent electronic device.

Claims

1. A device comprising: a substrate; a graphene semiconductor on said substrate, said graphene semiconductor comprising a porous graphene layer, said porous graphene layer having a plurality of randomly distributed pores, and including a plurality of graphene nanoribbons, each having a width between 0.1 nm and 20 nm and a porosity providing each with semiconductivity; and a gate electrode in contact with the graphene semiconductor.

2. The device according to claim 1 further comprising at least one additional porous graphene layer.

3. The device according to claim 1, wherein the graphene nanoribbons are substantially aligned with one another.

4. The device according to claim 1 further comprising a graphene electrode.

5. The device according to claim 4 further comprising at least one additional graphene electrode.

6. The device according to claim 4 wherein the graphene electrode is a graphene conductor.

7. The device according to claim 4 wherein the graphene electrode is a continuous layer of graphene.

8. The device according to claim 5 wherein the porous graphene layer electrically connects two of the graphene electrodes.

9. The device according to claim 5 wherein the porous graphene layer electrically connects each of the graphene electrodes.

10. An electronic device comprising: a first graphene electrode; a second graphene electrode; a graphene semiconductor; a gate electrode in contact with said graphene semiconductor between said first and second graphene electrodes; and an electrical power supply, wherein the graphene semiconductor, the first, and the second graphene electrodes are configured such that supply of a current by the electrical power supply, between a first location, in the first graphene electrode, and a second location, in the second graphene electrode, establishes a potential difference between the first location and the second location, such that the potential difference remains substantially constant with variation of the first or second location, and wherein the graphene semiconductor comprises a porous graphene layer having a plurality of randomly distributed pores, and including a plurality of graphene nanoribbons, each having a width between 0.1 nm and 20 nm and a porosity providing each with semiconductivity.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) For a more complete understanding of example embodiments of the present invention, reference is now made to the following descriptions taken in connection with the accompanying drawings in which:

(2) FIG. 1 shows a process for fabricating a device according to one aspect of the invention;

(3) FIG. 2 shows a two variants for one of the stages in the FIG. 1 process; and

(4) FIG. 3 shows a device according to one aspect of the invention.

DETAILED DESCRIPTON OF THE DRAWINGS

(5) An example embodiment of the present invention and its potential advantages are understood by referring to FIGS. 1 to 3 of the drawings.

(6) FIG. 1 shows a fabrication process in accordance with one aspect of the present invention. An initial step 1 is deposition of a layer of graphene 12 on a substrate 11. One example process for implementing the deposition is described in US20090110627. The graphene deposition process comprises the forming a graphitizing catalyst; heat-treating a gaseous carbon source in the presence of the graphitizing catalyst to form graphene, and cooling the graphene to form a graphene layer 12.

(7) The gaseous carbon source may comprise a compound having molecules containing between 1 and 7 carbon atoms, may comprise a compound selected from: carbon monoxide, ethane, ethylene, ethanol, acetylene, propane, propylene, butane, butadiene, pentane, pentene, cyclopentadiene, hexane, cyclohexane, benzene, toluene, methane, and a combination comprising at least one of the foregoing compounds.

(8) The heat-treating may be performed at a temperature between 300 C to about 2000 C, and for between 0.001 hour to about 1000 hours. The graphitizing catalyst may comprise Ni, Co, Fe, Pt Au, Al, Cr, Cu, Mg, Mn, Mo, Rh, Si, Ta, Ti, W, U, V, Zr, or any combination thereof. Hydrogen is further supplied with the gaseous carbon source.

(9) The graphene film 12 may be fabricated by chemical vapour deposition described by Alfonso Reina et al in Nano Letters, 9 (1), 30-35 (2009); or by chemical reduction of exfoliated graphite oxide, which is described by Stankovich, S. etc al, in Carbon 2007, 45 (7), 1558-1565.

(10) Once the graphene layer 12 has been deposited, a continuous mask 16 may be fabricated by step 2, on the graphene layer 12, by electron beam lithography using a hydrogen silsesquioxane (HSQ) resist as described in Semiconducting Graphene Ribbon Transistor by Zhihong Chen et al, IEEE Xplore, p 265 to 266. Alternatively, once the graphene layer 12 has been deposited, a continuous mask 16 may be fabricated by step 2, on the graphene layer 12, using a hydrogen silsesquioxane (HSQ) deposition by a spin-on process. Example of such process is described in U.S. Pat. No. 6,232,662.

(11) Once the continuous mask 16 has been deposited, a nanowire mask 14 is deposited, at step 3a. The nanowire mask comprises nanowires, such as silicon nanowires that may be randomly oriented. Step 3a may comprise fabrication of silicon nanowires on a sacrificial substrate and transfer of silicon nanowires on to the graphene layer 12 by mechanical contact pressure. An example of step 3a is described by Javey, A. et al in Nano Lett. 2007, 7, 773. Alternative methods of nanowire deposition are: spin casting, ink-jet printing, shear force contact printing, or nanowire suspensions as described in Nanowire lithography on silicon, Alan Coli et al, Nano Lett, Vol 8, No 5, 2008, p 1358 to 1362.

(12) Once the nanowire mask 14 has been deposited, graphene not under the continuous mask or nanowire mask 14 is removed by etching, at step 4. This can be implemented for example by using oxygen plasma in a reactive ion etching apparatus. One example of etching is described by B. Ozyilmaz et all in Appl. Phys. Lett. 91, 192107 (2007).

(13) Once step 4 is complete, the continuous mask 16 is removed by step 5 that comprises a process of reactive ion etching. Example of the process is described in U.S. Pat. No. 6,211,063. The nanowire mask removed by using hydrogen fluoride solution, e.g. as described in Single-crystal metallic nanowires and metal/semiconductor nanowire hetero structures Yue Wu et al, Nature, Vol 430, 1 Jul. 2004, p 61 to 65.

(14) Removal of part of the graphene layer 12 results in the formation of a porous graphene layer 15 having a multiplicity of pores which may correspond to the location of the nanowires in the nanowire mask 14. The porous graphene layer 15 may comprise a number of graphene nanoribbons, each nanoribbon having a smallest dimension, measured in the plane of the substrate, between 1 nm and 20 nm. Some graphene nanoribbons may be interstitial nanoribbons, each interstitial nanoribbon being located between at least two pores formed in graphene layer 15.

(15) In accordance with a further aspect of the invention, the process shown in FIG. 1 may be repeated, with the exception of step 3, which may be replaced by an alternative step 3b. Steps 3a and 3b are shown in FIG. 2. Step 3a is the same as step 3 in FIG. 1. Step 3b differs from the step 3b, in that an electric field is applied in the vicinity of the continuous mask 16 such that an aligned nanowire mask 14b is depositedThe aligned nanowire mask 14b comprises nanowires that are aligned with by the presence of the electric field.

(16) The electrical properties of components comprising one or more graphene ribbons may be altered by changing the width of the ribbon or ribbons. Depending on the width, the component may be a semiconductor or a metallic conductor.

(17) FIG. 3 shows a device that may be fabricated by employing the FIG. 1 process, or by the variant of this process, partly depicted in FIG. 2. The device 31 comprises a power supply 32, a first graphene electrode 17, and a second graphene electrode 18. The device further comprises a graphene semiconductor 15, which is between, and in electrical contact with, the first and second graphene electrodes 17, 18. It has been shown that when graphene is confined to nanoribbons it changes from semi-metallic to semiconducting material, the graphene semiconductor 15 therefore comprises such nanoribbons. A potential difference is applied between a first point 37, in the first graphene electrode 17, and a second point 38, in the second graphene electrode 18, and an electric current is passed through the graphene semiconductor 15, between the first and second points 37, 38, such that a potential difference is established between the first and second points, and such that there is substantially no potential difference across the first graphene electrode 17, and substantially no potential difference across the second graphene electrode 18. In other words the potential difference remains constant with variation of the first or second location. The graphene electrodes 17, 18, and the graphene semiconductor 15 may have a low coefficient of absorption, and/or be flexible and/or stretchable. The FIG. 3 device 31 may therefore be at least partly flexible and/or stretchable, and at least partly transmit light through some of its components. A modification of the FIG. 3 device may comprise a gate electrode, disposed between electrodes 17 and 18, in contact with the semiconductor 15, to which a potential may be applied, such a modification may form part of a field effect transistor.

(18) Without in any way limiting the scope, interpretation, or application of the claims appearing below, a technical effect of one or more of the example embodiments disclosed herein may be fabrication of large surface area graphene layers. Another technical effect of one or more of the example embodiments disclosed herein may be fabrication of transparent electronic devices. Another technical effect of one or more of the example embodiments disclosed herein may be fabrication of flexible and/or stretchable electronic devices. Yet another technical advantage may high charge carrier mobility. Yet other advantages may be at least one of ballistic transport, high current density, high thermal conductivity, and the possibility to control the electrical properties.

(19) If desired, the different functions discussed herein may be performed in a different order and/or concurrently with each other. Furthermore, if desired, one or more of the above-described functions may be optional or may be combined.

(20) Although various aspects of the invention are set out in the independent claims, other aspects of the invention comprise other combinations of features from the described embodiments and/or the dependent claims with the features of the independent claims, and not solely the combinations explicitly set out in the claims.

(21) It is also noted herein that while the above describes example embodiments of the invention, these descriptions should not be viewed in a limiting sense. Rather, there are several variations and modifications which may be made without departing from the scope of the present invention as defined in the appended claims.