Abstract
A method and mould for producing millimetre and/or micrometre and/or nanometre-size structures on a substrate surface of a substrate.
Claims
1-15. (canceled)
16. A method for producing millimetre and/or micrometre and/or nanometre-size structures on a substrate surface of a substrate, the method comprising: a) arranging a mould over the substrate surface, said mould having a structured surface and a network comprised of a plurality of channels; b) mechanically and/or optically aligning the mould relative to the substrate surface by means of alignment marks; c) contacting the structured surface of the mould with the substrate surface of the substrate; d) introducing a casting compound into the network of the mould for the distribution of the casting compound over the structured surface of the mould; e) hardening the casting compound to produce the structures on the substrate surface of the substrate; and removing the mould from the casting compound.
17. The method according to claim 16, wherein the structures on the substrate surface are produced free from a residual layer.
18. The method according to claim 16, wherein the casting compound is introduced. by capillary forces into the network of the mould.
19. The method according to claim 16, wherein the casting compound is introduced into the network by generating an underpressure in the network, wherein the pressure in the network is less than 1 bar.
20. The method according to claim 16, wherein the casting compound is introduced into the network of the mould by a pressure (p1) between 10 bar and 10.sup.6 mbar.
21. The method according to claim 16, wherein the casting compound has a low viscosity, wherein the viscosity at room temperature lies between 10E6 mPa*s and 1 mPa*s.
22. The method according to claim 16, wherein the mould is located in a process chamber capable of being evacuated and the method is carried out in a vacuum atmosphere with a pressure less than 0.1 bar.
23. A mould for producing millimeter and/or micrometer and/or nanometer-size structures on a substrate surface, the mould comprising: a structured surface; a mould surface that lies opposite the structured surface; at least one inflow for receiving a casting compound; and a network comprised of a plurality of channels, said network connected to the at least one inflow for distributing the casting compound over the structured surface, wherein a mask with apertures is arranged on the mould surface.
Description
[0135] Further advantages, features and details of the invention emerge from the following description of preferred examples of embodiment and with the aid of the drawings. In the figures:
[0136] FIG. 1a shows a diagrammatic cross-sectional side view of a first embodiment of a mould according to the invention, not true to scale,
[0137] FIG. 1b shows a diagrammatic view of the first embodiment according to the invention from beneath, not true to scale,
[0138] FIG. 2a shows a diagrammatic cross-sectional side view of a second embodiment according to the invention, not true to scale,
[0139] FIG. 2b shows a diagrammatic view of the second embodiment according to the invention from beneath, not true to scale,
[0140] FIG. 3a shows a diagrammatic cross-sectional side view of a third embodiment according to the invention, not true to scale,
[0141] FIG. 3b shows a diagrammatic view of the third embodiment according to the invention from beneath, not true to scale,
[0142] FIG. 4a shows a diagrammatic cross-sectional side view of a fourth embodiment according to the invention, not true to scale,
[0143] FIG. 4b shows a diagrammatic view of the fourth embodiment according to the invention from beneath, not true to scale,
[0144] FIG. 5a shows a diagrammatic cross-sectional side view of a fifth embodiment according to the invention, not true to scale,
[0145] FIG. 5b shows a diagrammatic view of the fifth embodiment according to the invention from beneath, not true to scale,
[0146] FIG. 6a shows a diagrammatic side view of a first process step according to the invention, not true to scale,
[0147] FIG. 6b shows a diagrammatic side view of a second process step according to the invention, not true to scale,
[0148] FIG. 6c shows a diagrammatic side view of a third process step according to the invention, not true to scale,
[0149] FIG. 6d shows a diagrammatic side view of a fourth process step according to the invention, not true to scale,
[0150] FIG. 6e shows a diagrammatic side view of a fifth process step according to the invention, not true to scale,
[0151] FIG. 6f shows a diagrammatic side view of a sixth process step according to the invention, not true to scale,
[0152] FIG. 7 shows a diagrammatic side view of a first embodiment of the casting according to the invention, not true to scale,
[0153] FIG. 8 shows a diagrammatic side view of a second embodiment of the casting according to the invention, not true to scale,
[0154] FIG. 9 shows a diagrammatic side view of a third embodiment of the casting according to the invention, not true to scale,
[0155] FIG. 10 shows a diagrammatic enlarged side view of a part of a sixth exemplary mould according to the invention, not true to scale,
[0156] FIG. 11 shows a diagrammatic enlarged side view of a part of a seventh exemplary mould according to the invention, not true to scale and
[0157] FIG. 12 shows a diagrammatic enlarged side view of a part of an eighth exemplary mould according to the invention, not true to scale.
[0158] Identical components or components with the same function are denoted by the same reference numbers in the figures.
[0159] FIG. 1a shows a lateral cross-sectional representation along intersecting line A-A (see FIG. 1b) of a first mould 1 according to the invention with an inflow 2 and an outflow 3, which are connected to one another via a network 22, comprising a plurality of channels 4. A network 22 is understood to mean the aggregate of all channels 4 in mould 1. Mould 1 comprises an edge 8. Inflow 2 and outflow 3 leave mould 1 via upper mould surface 1o. Possible adapters, which are connected to inflow 2 and/or outflow 3, have not been shown for the sake of clearer illustration. Moreover, mould 1 comprises structures 5 on its structured surface 5o. Structures 5 are elevations, structural surfaces 5o whereof make contact with the substrate.
[0160] FIG. 1b shows a view of first mould 1 according to the invention from beneath.
[0161] FIG. 2a shows a lateral cross-sectional representation of a second mould 1 according to the invention with an edge 8 as well as an inflow 2 and an outflow 3, which are connected to one another via a network 22. Inflow 2 and outflow 3 leave mould 1 via lateral mould face 1s. Possible adapters, which are connected to inflow 2 and/or outflow 3, have not been shown for the sake of clearer illustration. Moreover, reference is made to the embodiments in respect of FIG. 1a and FIG. 1b.
[0162] FIG. 2b shows a view of second mould 1 according to the invention from beneath.
[0163] FIG. 3a shows a lateral cross-sectional representation of a third mould 1 according to the invention with two symmetrically positioned inflows 2 and an outflow 3, which are connected to one another via a network 22. Inflows 2 leave mould 1 via lateral mould face 1s. Outflow 3 leaves mould 1 via mould surface 1o. Possible adapters, which are connected to inflows 2 and/or outflow 3, have not been shown for the sake of clearer illustration. Moreover, reference is made to the embodiments in respect of FIG. 1a and FIG. 1b.
[0164] FIG. 3b shows a view of third mould 1 according to the invention from beneath.
[0165] FIG. 4a shows a lateral cross-sectional representation of a fourth mould 1 according to the invention with inflow 2. The embodiment according to the invention does not comprise an outflow. Mould 1 is preferably porous, so that gases can escape via mould 1. Outflow 3 is therefore identical to porous mould 1. Moreover, reference is made to the embodiments in respect of FIG. 1a and FIG. 1b.
[0166] FIG. 4b shows a view of fourth mould 1 according to the invention from beneath.
[0167] FIG. 5a shows a lateral cross-sectional representation of a fifth mould 1.sup.IV according to the invention, in particular a special variant of the second embodiment according to the invention, wherein network 22 comprises few, in particular branching, channels 4. Mould 1.sup.IV comprises an edge 8. Moreover, reference is made to the embodiments in respect of FIG. 1a and FIG. 1b and respectively FIG. 2a and FIG. 2b.
[0168] FIG. 5b shows a view of mould 1.sup.IV from beneath.
[0169] FIG. 6a shows a first process step according to the invention, wherein a robot 9 loads a, in particular transparent (indicated with three strokes), mould 1 according to the invention over a substrate 6. Substrate 6 is fixed on a sample holder 10 by means of fixings 11, in particular vacuum tracks.
[0170] In FIG. 6b, a second process step according to the invention is represented, wherein mould 1 according to the invention is aligned relative to substrate 6. The alignment takes place in the x- and/or y-direction. Mould 1 is preferably still located on robot 9. Fixing of mould 1 by robot 9 on a second, upper sample holder (not represented), which sample holder has a better resolution accuracy, is also conceivable. In particular, the loading of mould 1 in an alignment system is conceivable in order to carry out the alignment with a high degree of precision.
[0171] FIG. 6c shows a third process step according to the invention, wherein the contacting of structured surface So with substrate surface 6o takes place. Structured surface 5o can in particular be coated, in order to facilitate mould removal in a subsequent process step. An interconnecting and open network 22 arises as a result of the contacting of structured surface 5o with substrate surface 6o. Network 22 represents the aggregate of all channels 4. Interconnecting means that the channels are connected to one another. Open means that there is at least one access to the network, and therefore to a least one of the channels.
[0172] FIG. 6d represents a fourth process step according to the invention, the introduction of casting compound 14 into network 22. The introduction of casting compound 14 can take place in several different ways.
[0173] According to the invention, the supply of casting compound 14 to all inflows 2 is of particular importance. FIG. 6d, this takes place for example by means of a supply 15, comprising a line 12 and a seal 13, which is or are fastened to sample holder 10 and/or substrate 6 and mould by a form-fitting and/or friction-locked connection. Casting compound 14 is transported into network 22 either by an excess pressure and/or by an evacuation of network 22, in particular via outflow 3, and/or by capillary forces. It is also conceivable for casting compound 14 to be deposited by means of a deposition system with a needle in the vicinity of inflows 2, Capillary forces then transport casting compound 14 through network 22.
[0174] FIG. 6e shows a fifth process step according to the invention, wherein casting compound 14 is hardened. The hardening takes place through mould 1 and/or through sample holder 10 or substrate 6. The hardening preferably takes place, however, exclusively through mould 1 in order to be independent of the physical properties of substrate 10. The hardening preferably takes place electromagnetically, since only a very small amount of heating, if any, and therefore a vanishingly small thermal expansion arises through exposure of casting compound 14. In order to be able to harden casting compound 14 electromagnetically through mould 1, mould 1 must have a corresponding transparency for the electromagnetic radiation used. Thermal hardening of the casting compound 14 is also conceivable. The arrows represented in FIG. 6e stand symbolically for the electromagnetic radiation and/or the amount of heat.
[0175] In a final, sixth process step according to FIG. 6t, the removal of mould 1 from casting compound 14 takes place. The removal is represented in FIG. 6f by the raising of mould 1. A gradual withdrawal of mould 1, in particular starting from the edge of mould 1 or of substrate 6, is however also conceivable, if mould 1 is a soft mould. The height of the generated casting compound structures from casting compound 14 on substrate surface 6o corresponds to the height of channels 4.
[0176] FIG. 7 shows a first embodiment according to the invention for filling network 22 in the optimum manner with a casting compound 14. Casting compound 14 is introduced by means of a supply 15, comprising a line 12 and a seal 13, which directly adjoins inflows 2. A vacuum is preferably generated simultaneously in network 22 by means of a suction device 16, which adjoins outflow 3, for example via a further line 12 and a further seal 13. Two particularly preferred effects according to the invention arise due to the generation of a vacuum. In the first place, a force 1 is exerted on casting compound 14 due to the pressure difference between the exterior and the network, which force pushes casting compound 14 into network 22. In the second place, this pressure difference generates an area force F2 and thus pushes mould 1 onto substrate 6. A particularly optimum and preferred fixing of mould 1 on substrate 6 is thus brought about. In order that mould 1 does not rise from substrate 6, pressure p1 in casting compound 14 must be less than or in the extreme case of equal magnitude to pressure p2 acting from the exterior. Furthermore, pressure p3 prevailing in network 22 must be less than pressure p1 acting in casting compound 14. Otherwise, a propagation of casting compound 14 through network 22 is not possible. The effect of the capillary forces on the advance of casting compound 14 through network 22 is overlooked in this regard. Pressure p2 is 1.1 times, preferably 1.2 times, still more preferably 1.3 times, most preferably 1.4 times, with utmost preference 1.5 times as great as pressure p1. Pressure p1 is 1.1 times, preferably 1.2 times, still more preferably 1.3 times, most preferably 1.4 times, with utmost preference 1.5 times as great as pressure p3.
[0177] FIG. 8 shows a second embodiment according to the invention for filling network 22 in the optimum manner with a casting compound 14. Casting compound 14 is introduced by means of a supply 15, comprising a line 12. Supply 15 is for example a tube, a needle or a nozzle. Supply 15 does not make contact either with sample holder 10, substrate 6 or mould 1, but rather deposits casting compound 14 in the vicinity of inflow 2. If there is a plurality of inflows, a corresponding number of supplies 15 must be provided. Casting compound 14 is preferably drawn into network 22 exclusively by the capillary effect. Still more preferably, however, a vacuum is generated in network 22 simultaneously by means of suction device 16, which for example adjoins outflow 3 via line 12 and seal 13. As a result of the generation of a vacuum, two particularly preferred effects according to the invention arise. In the first place, as in FIG. 7, a force F1 is exerted on casting compound 14 due to the pressure difference between the exterior and network 22, which force pushes casting compound 14 into network 22. In the second place, this pressure difference generates an area force F2 and thus pushes mould 1 onto substrate 6. A particularly optimum and preferred fixing of mould 1 on substrate 6 is thus brought about.
[0178] FIG. 9 shows a third embodiment according to the invention for filling network 22 in the optimum manner with a casting compound 14. Casting compound 14 is introduced by means of a supply 15, comprising a line 12 and a seal 13, which directly adjoins inflows 2. A process chamber 17, in which mould 1 and substrate 10 are located, is preferably evacuated simultaneously by means of a suction device 16. A vacuum thus arises in network 22. A force F1 is thus exerted on casting compound 14 due to the pressure difference between casting compound 14 and network 22, which force pushes casting compound 14 into network 22.
[0179] FIG. 10 shows a diagrammatic, enlarged partial detail of a further mould 1 according to the invention, on mould surface to whereof mask 18 has been deposited. Mask 18 is in particular opaque for the wavelengths of the wavelength region of the radiation with the aid of which the casting compound is hardened. By using a mask 18, those regions of the casting compound that are to be hardened can be precisely determined. In particular embodiments according to the invention, apertures 21 do not necessarily have to be congruent with network 22. A finer structuring of network 22 is thus permitted, since those regions of network 22 that are not hardened by the electromagnetic radiation can be removed from substrate surface 6o in subsequent process steps. In FIG. 10, this situation is represented by way of example by the fact that mask 18 on the right-hand side of the drawing covers a part of network 22, so that no aperture 21 is formed above this part of the network. Masks 18, apertures 21 whereof are congruent with network 22 are of course also conceivable. Apertures 21 are incorporated in mould 1 in a much preferred embodiment.
[0180] FIG. 11 shows a further embodiment according to the invention of a mould 1 with a coating 19 of structures 5. Coating 19 is preferably an anti-adhesion coating, which permits easy detachment of mould 1, more precisely of structures 5, from substrate 6 and/or embossing compound 14. Moreover, reference is made to the embodiments of FIG. 10.
[0181] FIG. 12 shows a further embodiment according to the invention of mould 1. Mould 1 has an open porosity with pores 20, which permit enclosed gases to be carried away via mould 1. Moreover, reference is made to the embodiments of FIG. 10.
LIST OF REFERENCE NUMBERS
[0182] 1, 1, 1, 1, 1.sup.IV mould
[0183] 1o, 1o, 1o, 1o.sup.IV mould surface
[0184] 1s, 1s, 1s, 1s, 1s.sup.IV lateral mould face
[0185] 2, 2, 2, 2, 2.sup.IV inflow
[0186] 3, 3, 3, 3, 3.sup.IV outflow
[0187] 4, 4 channel
[0188] 5 structure
[0189] 5o structured surface
[0190] 6 substrate
[0191] 6o substrate surface
[0192] 7, 7, 7, 7 stack
[0193] 8, 8, 8 edge
[0194] 9 robot
[0195] 10 sample holder
[0196] 11 fixings
[0197] 12, 12, 12 line
[0198] 13, 13 seal
[0199] 14 casting compound
[0200] 15, 15 supply
[0201] 16 suction device
[0202] 17 process chamber
[0203] 18 mask
[0204] 19 coating
[0205] 20 pores
[0206] 21 aperture
[0207] 22 network
[0208] p1, p2, p3 pressures
[0209] F1 force
[0210] F2 area force
