Wire and methods for preparing a wire to receive a contact element
09991608 ยท 2018-06-05
Assignee
Inventors
Cpc classification
H01R43/28
ELECTRICITY
H01R4/62
ELECTRICITY
B60R16/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
H01R4/62
ELECTRICITY
H01B13/00
ELECTRICITY
Abstract
A method is provided for preparing a wire for installation of a terminal. The method comprises removing an insulating layer from a conductor to expose a portion of a conductor. The method further includes attaching a conductive foil layer to a portion of the exposed portion of the conductor by applying pressure to the conductive foil layer. Terminated wires are also provided.
Claims
1. A terminated wire consisting of: a conductor comprising an exposed portion and being formed of a first material; an insulating layer circumferentially surrounding a portion of the conductor adjacent to the exposed portion; a conductive layer formed of a second material and joined to the exposed portion of the conductor such that the exposed portion of the conductor and the conductive layer cooperate to form an amalgamated mass; and a contact element formed of a third material and secured to the amalgamated mass; wherein: the first material and the second material are different; and the exposed portion of the conductor and the conductive layer are substantially the same length.
2. The terminated wire of claim 1 wherein the first material and the third material are different.
3. The terminated wire of claim 2 wherein the first material comprises an aluminum alloy, the second material comprises copper, and the third material comprises a copper alloy.
4. The terminated wire of claim 1 wherein the third material comprises brass.
5. The terminated wire of claim 1 wherein the conductive layer and the exposed portion of the conductor are joined together by welding.
6. The terminated wire of claim 5 wherein the conductive layer and the exposed portion of the conductor are joined together by ultrasonic welding.
7. The terminated wire of claim 1 wherein the conductor has a diameter, the conductive layer has a thickness, and the ratio of the diameter of the conductor to the thickness of the conductive layer is about 200:1.
8. The terminated wire of claim 1 wherein the contact element comprises a crimped terminal.
9. The terminated wire of claim 1 wherein the conductive layer comprises a ferrule.
10. The terminated wire of claim 9 wherein the ferrule comprises a hollow sleeve that defines respective openings at opposite ends of the hollow sleeve.
11. A terminated wire consisting of: a conductor comprising an exposed portion and being formed of a first material; a conductive layer formed of a second material and joined to the exposed portion of the conductor such that the exposed portion of the conductor and the conductive layer cooperate to form an amalgamated mass; and a contact element formed of a third material and secured to the amalgamated mass; wherein: the first material and the second material are different; and the exposed portion of the conductor and the conductive layer are substantially the same length.
12. The terminated wire of claim 11 wherein: the first material comprises an aluminum alloy; the second material comprises copper; the conductive layer and the exposed portion of the conductor are joined together by ultrasonic welding; the contact element comprises a crimped terminal; and the conductive layer comprises a ferrule.
13. A method for installing a contact element on a wire, the wire comprising a conductor, the conductor comprising an exposed portion and being formed of a first material, the method consisting of: joining a conductive layer and the exposed portion of the conductor together to form an amalgamated mass; and securing the contact element to the amalgamated mass, wherein: the conductive layer is formed of a second material; the contact element is formed of a third material; the first material and the second material are different; and the exposed portion of the conductor and the conductive layer are substantially the same length.
14. The method of claim 13 wherein joining the conductive layer and the exposed portion of the conductor together comprises welding the conductive layer and the exposed portion of the conductor together.
15. The method of claim 14 wherein welding the conductive layer and the exposed portion of the conductor together comprises ultrasonically welding the conductive layer and the exposed portion of the conductor together.
16. The method of claim 13 wherein securing the contact element to the amalgamated mass comprises crimping the contact element to the amalgamated mass.
17. The method of claim 13 wherein the first material comprises aluminum, the second material comprises copper, and the third material comprises a copper alloy.
18. The method of claim 13 wherein the conductor has a diameter, the conductive layer has a thickness, and the ratio of the diameter of the conductor to the thickness of the conductive layer is about 200:1.
19. The method of claim 13 wherein the conductive layer comprises a ferrule.
20. The method of claim 19 wherein the ferrule comprises a hollow sleeve that defines respective openings at opposite ends of the hollow sleeve.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) It is believed that certain embodiments will be better understood from the following description taken in conjunction with the accompanying drawings in which:
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DETAILED DESCRIPTION
(12) In connection with the views and examples of
(13) As illustrated in
(14) Once the conductive foil layer 18 has been provided onto the bare portion 16 of the conductor 12, the bare portion 16 of the conductor 12 and the conductive foil layer 18 can be joined together. In one embodiment, the bare portion 16 and the conductive foil layer 18 can be joined together through welding, such as through ultrasonic welding, for example. Welding the bare portion 16 and the conductive foil layer 18 together can bond the conductive foil layer 18 to the conductor 12 as well as bond the strands of the conductor 12 together to form an amalgamated mass (e.g., a nugget). Welding can also help break apart any oxidation formed on the conductor 12 that might adversely affect the conductivity between the conductor 12 and the conductive foil layer 18. Welding can accordingly enhance the conductivity characteristics between the conductor 12 and the conductive foil layer 18.
(15) Once the conductor 12 and the conductive foil layer 18 have been joined together, a terminal 20 can be slid over the conductive foil layer 18 and secured to the amalgamated mass of the bare portion 16 and the conductor 12, such as with a crimping tool, for example, to create a terminated wire 21, as illustrated in
(16) The conductor 12 and the conductive foil layer 18 can be formed of different conductive materials with the conductive foil layer 18 having about the same or higher conductivity than the conductor 12. As a result, when the conductive foil layer 18 is interposed between the conductor 12 and the terminal 20, the conductive foil layer 18 can enhance the overall conductivity between the conductor 12 and the terminal 20 as compared to the conductive foil layer 18 not being present (i.e., the conductor 12 and the terminal 20 being entirely in contact with each other). In one embodiment, the conductor 12 can be formed of aluminum or an aluminum alloy, the conductive foil layer 18 can be formed of copper, and the terminal 20 can be formed of brass. In such an embodiment, the copper of the conductive foil layer 18 can allow the interaction between the aluminum conductor 12 and the brass terminal 20 to be more conductive than crimping the brass terminal 20 directly to the aluminum conductor 12 (which in some instances can be non-conductive). It is to be appreciated that the conductive foil layer 18 can be formed of a material that is as conductive as or more conductive than the conductor 12. In certain embodiments, the conductor 12 can be formed of a conductive material having a conductivity of about 3.5*10.sup.7 S/m (at 20 degrees C.) or less, and the conductive foil layer 18 can be formed of conductive material having a conductivity of about 4.1*10.sup.7 S/m (at 20 degrees C.) or more. In other embodiments, the conductor 12 can be formed of a conductive material that is substantially susceptible to oxidation, such as an aluminum alloy, a chromium alloy, and/or a magnesium alloy, and the conductive foil layer 18 can be formed of conductive material that is not substantially susceptible to oxidization such as a copper alloy, silver, nickel, and/or gold. It is to be appreciated that the different metals described above for the conductor 12, the conductive foil layer 18, and the terminal 20 can be any of a variety of different metals or metal alloys, such as, for example copper or copper alloys, such as brass.
(17) As illustrated in
(18) In some embodiments, the bare portion 16 of the conductor 12, alone or in combination with the conductive foil layer 18, can be cleaned before or after application of the conductive foil layer 18 to remove any oxides on the conductor 12 and/or between the conductor 12 and the conductive foil layer thus enhancing the effectiveness of the conductivity between the conductor 12, the conductive foil layer 18, and the terminal 20. In one embodiment, the conductor 12 and/or conductive foil layer 18 can be cleaned via a plasma treatment performed by a blown-ion air system (not shown). The blown-ion air system can force pressurized air towards an electrode, through a narrow nozzle, and onto the bare portion 16. The electrode creates positively charged ions in the pressurized air which is then accelerated by the nozzle and provided onto the bare portion 16 of the conductor 12. The positively charged ions in the airstream positively charge the outer surface of the bare portion 16 thereby increasing its surface energy to remove any oxides. In another embodiment, the conductor 12 and/or conductive foil layer 18 can be cleaned via a high temperature induction heating process that applies a flame to the conductor 12 and/or conductive foil layer 18 using any of a variety of fuels, such as, for example, hydrogen gas, alcohol, and/or acetylene.
(19) In certain embodiments, the bare portion 16 of the conductor 12 and the conductive foil layer 18 can be joined by soldering such as by dipping the bare portion 16 and the conductive foil layer 18 together in a molten material (e.g., such as molten tin) or resistance soldering the bare portion 16 and the conductive foil layer 18 together, for example, both of which can enhance the conductivity between the bare portion 16, the conductive foil layer 18, and the terminal 20. It is to be appreciated that cleaning the bare portion 16 and/or the conductive foil layer 18 can encourage the application of solder. However, the soldering can be performed in addition to the welding or in addition to or in lieu of the cleaning described above. It is also to be appreciated that the bare portion 16 and/or the conductive foil layer 18 can undergo any of a variety of other suitable treatment processes to prepare for affixation of the terminal 20.
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(23) Another alternative embodiment of a terminated wire (e.g., an alternative terminated wire) is also contemplated. The alternative terminated wire can be similar in many respects to the terminated wire 21 described above except that the alternative terminated wire does not include a conductive foil layer (e.g., 18). To prepare the alternative terminated wire, a portion of an insulating layer (e.g., 14) can be removed from a conductor (e.g., 12) to expose a bare portion (e.g., 16) of the conductor (e.g., 12). The bare portion can then be cleaned (e.g., with a plasma treatment) and welded (e.g., through ultrasonic welding) to bind individual strands of the conductor together. The steps of cleaning and welding can be performed in any order. Once welded, the bare portion can be soldered (e.g., through tin dipping or resistive soldering). A terminal (e.g., 20) can then be attached to the bare portion insulating layer to create the alternative terminated wire. In one embodiment, the conductor 112 can be formed of aluminum and the conductive foil layer can be formed of nickel.
EXAMPLES
(24) Testing was conducted on a terminated wire similar to the terminated wire 21 described above. The terminated wire that was tested was a 0 AWG (1/0) aluminum wire having a bare portion (e.g., 14) measuring about 20 mm, a copper conductive foil layer (e.g., 18) having a length (e.g., L1) of about 40 mm, a width (e.g., W) of about 18 mm, and a thickness (e.g., T) of about 0.035 mm, and a brass terminal. The copper conductive foil layer was manually wrapped onto the bare portion and then was ultrasonically welded to form a nugget. A terminal was then crimped onto the nugget. Ten separate resistance tests were then performed to measure the resistance between the conductor and the terminal (e.g., between points A and B illustrated on
(25) Comparative testing was also conducted to compare the results for different terminations of a 0 AWG (1/0) aluminum wire having a bare portion (e.g., 14) measuring about 20 mm, a copper conductive foil layer (e.g., 18) having a length (e.g., L1) of about 40 mm, a width (e.g., W) of about 20 mm, and a thickness (e.g., T) of about 0.035 mm, and a brass terminal. A variety of different terminated wires were assembled using certain of the methodologies described above and resistance tests were performed on the terminated wires. The results of the resistance tests are as follows:
(26) TABLE-US-00001 Example Termination Method Resistance (Ohms) Example #1 Bare Conductor with Terminal Open Circuit Crimped Directly to Bare (high resistance) Conductor Example #2 Terminated Conductor Prepared 0.345 milliohms and Terminated Without Conductive Foil Layer as Follows: 1. Ultrasonically Weld Bare Conductor 2. Plasma Clean Welded Bare Conductor 3. Dip Bare Conductor in Molten Solder 4. Crimp Terminal to Soldered End of Bare Conductor. 5. Resistance Solder Outer Surface of Terminal Example #3 Terminated Conductor Prepared 0.179 milliohms and Terminated Without Conductive Foil Layer as Follows: 1. Plasma Clean Bare Conductor 2. Ultrasonically Weld Bare Conductor 3. Plasma Clean Bare Conductor 4. Dip Bare Conductor in Molten Solder 5. Crimp Terminal to Soldered End of Bare Conductor. 6. Resistance Solder Outer Surface of Terminal Example #4 Terminated Conductor Prepared 0.046 milliohms and Terminated With Solid Copper Conductive Foil Layer as Follows: 1. Ultrasonically Weld Bare Conductor and Conductive Foil Layer Together 2. Dip Welded End in Molten Solder 3. Crimp Terminal to Soldered End of Bare Conductor. 4. Resistance Solder Outer Surface of Terminal
(27) The foregoing description of embodiments and examples of the disclosure has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure to the forms described. Numerous modifications are possible in light of the above teachings. Some of those modifications have been discussed and others will be understood by those skilled in the art. The embodiments were chosen and described in order to best illustrate the principles of the disclosure and various embodiments as are suited to the particular use contemplated. The scope of the disclosure is, of course, not limited to the examples or embodiments set forth herein, but can be employed in any number of applications and equivalent devices by those of ordinary skill in the art. Rather it is hereby intended the scope of the invention be defined by the claims appended hereto. Also, for any methods claimed and/or described, regardless of whether the method is described in conjunction with a flow diagram, it should be understood that unless otherwise specified or required by context, any explicit or implicit ordering of steps performed in the execution of a method does not imply that those steps must be performed in the order presented and may be performed in a different order or in parallel.