Abstract
The invention relates to a method and a device for the production and preparation of electronic components
Claims
1. A method for the production and preparation of electronic components, comprising: preparing a first substrate with a first substrate surface and a second substrate surface, implementing, after the preparing of the first substrate, a surface treatment on the first substrate surface, applying, after implementing of the surface treatment, a protective layer on the treated first substrate surface, and separating, after the applying of the protective layer, the substrate into components.
2. The method according to claim 1, wherein the implementing of the surface treatment comprises one or more of cleaning the first substrate surface, a plasma treatment of the first substrate surface, and coating the first substrate surface.
3. The method according to claim 2, wherein the cleaning of the first substrate surface comprises one or more of chemical cleaning and physical cleaning of the first substrate surface.
4. The method according to claim 2, wherein the coating of the first substrate surface takes place with water for hydrophilisation of the first substrate surface.
5. The method according to claim 1, wherein, after the separating of the substrate, each of the components comprises a first component surface and a second component surface, and wherein the protective layer is applied on the first component surface of each of the components.
6. The method according to claim 5, wherein the components, after the separating of the substrate, are fixed with the second component surface on a carrier substrate.
7. The method according to claim 1, wherein, before the separating of the substrate, the first substrate is provided with the second substrate surface on a second substrate.
8. The method according to claim 1, wherein, before the separating of the substrate, the first substrate is provided with the first substrate surface with the protective layer on the second substrate.
9. The method according to claim 7, wherein the second substrate is a film.
10. The method according to claim 9, wherein the film has an adhesive layer, and the first substrate is fixed on the adhesive layer.
11. The method according to claim 1, further comprising: removing, after the separating of the substrate, the protective layer from the first component surface of the components.
12. The method according to claim 11, wherein the removing of the protective layer is carried out under a vacuum.
13. The method according to claim 8, wherein, before the separating of the substrate, the first substrate is provided with the first substrate surface with the protective layer on the second substrate, wherein, before the removing of the protective layer, the components are taken with the first component surface over by a pick-and-place tool and fixed on the pick-and-place tool.
14. The method according to claim 13, wherein the removing of the protective layer takes place while the components are fixed on the pick-and-place tool.
15. A device for the production and preparation of electronic components, comprising: surface treatment means for implementation of a surface treatment of a first substrate surface of a first substrate, and means for application of a protective layer on the treated first substrate substrate after the implementation of the surface treatment by the surface treatment means.
16. The device according to claim 15, further comprising: separation means for the separation of the first substrate into components.
17. The method according to claim 2, wherein the cleaning of the first substrated surface is performed by sputtering.
18. The method according to claim 8, wherein the second substrate is a film.
19. The method according to claim 18, wherein the film has an adhesive layer, and the first substrate is fixed on the adhesive layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0102] Further advantages, features and details of the invention emerge from the following description of preferred examples of embodiment and with the aid of the drawings. Diagrammatically:
[0103] FIG. 1a shows a first process step of a first exemplary method,
[0104] FIG. 1b shows a second process step of a first exemplary method,
[0105] FIG. 1c shows a third process step of a first exemplary method,
[0106] FIG. 1d shows a fourth process step of a first exemplary method,
[0107] FIG. 1e shows a fifth process step of a first exemplary method,
[0108] FIG. 1f shows a sixth process step of a first exemplary method,
[0109] FIG. 1g shows a seventh process step of a first exemplary method,
[0110] FIG. 2a shows a first process step of a second exemplary method,
[0111] FIG. 2b shows a second process step of a second exemplary method,
[0112] FIG. 2c shows a third process step of a second exemplary method,
[0113] FIG. 2d shows a fourth process step of a second exemplary method,
[0114] FIG. 2e shows a fifth process step of a second exemplary method,
[0115] FIG. 3a shows a first process step of a third exemplary method,
[0116] FIG. 3b shows a second process step of a third exemplary method,
[0117] FIG. 3c shows a third process step of a third exemplary method,
[0118] FIG. 3d shows a fourth process step of a third exemplary method,
[0119] FIG. 3e shows a fifth process step of a third exemplary method,
[0120] FIG. 3f shows a sixth process step of a third exemplary method,
[0121] FIG. 4 shows a plan view of a second substrate with the most important components and features and
[0122] FIG. 5 shows a plan view of a module system.
DETAILED DESCRIPTION OF THE INVENTION
[0123] Identical components or components with the same function are denoted by the same reference numbers in the figures. The figures are diagrammatic representations. In particular, the ratios of the individual components are not correct. A thin layer 13 is selected as a graphic representation of a treated substrate surface, i.e. a surface treatment 13. Surface treatment 13 is generally representative of a number of different treatments of substrate surface 1o. For example, the surface treatment can include cleaning and thus shows a cleaned surface. In addition, surface treatment 13 can be a further thin layer, for example a water layer. In order to cover all possibilities, however, the representation of surface treatment 13 as a thin layer is used in the figures.
[0124] FIG. 1a shows a first process step of a first exemplary method, in which first substrate surface 1o of a first substrate 1 is treated. Surface treatment 13 is a layer and not just a state of first substrate surface 1o, such as for example a cleaned or a plasma-treated first substrate surface 1o or a first substrate surface provided with a reservoir. Generally, component alignment marks 5 are located on first substrate 1, with the aid of which subsequently separated components 4 (see FIG. 1c) are aligned relative to carrier substrate 6.
[0125] FIG. 1b shows a second process step of a first exemplary method, in which the protection of surface treatment 13 is represented by a protective layer 2. First substrate 1 can be provided on its second substrate surface 1u lying opposite first substrate surface 1o with a bonding layer 3, which enables subsequent fixing of individual components 4 (see FIG. 1c) on a carrier substrate 6.
[0126] FIG. 1c shows a third process step of a first exemplary method, in which a separation a first substrate 1 (see FIG. 1b) into individual components 4 takes place. In particular, surface treatment 13 is protected by protective layer 2.
[0127] FIG. 1d shows a fourth process step of a first exemplary method, in which individual components 4 are aligned with and bonded to a second substrate 6 with their second substrate surface 1u, on which a bonding layer 3 is preferably located. Alignment marks 5 of components 4, which are also referred to as component alignment marks, are preferably used to enable alignment of components 4 relative to alignment marks 5 of second substrate 6. Second substrate 6, moreover, preferably comprises alignment marks 5, which are also referred to as substrate alignment marks, with the aid of which an alignment of third substrate 8 relative to second substrate 6 can be carried out in the subsequent sixth process step. As from this process step it is possible to transport the equipped second substrate 6 into a module system 9 (see FIG. 5). Surface treatment 13 has already been carried out and also continues to be on the first component surface, whilst the separation of first substrate 1 into individual components 4 has preferably been carried out outside a module system 9.
[0128] FIG. 1e shows a fifth process step of a first exemplary method, in which protective layer 2 (no longer shown) is removed. The removal of protective layer 2 preferably takes place in a module system 9 (see FIG. 5), in which all modules 10, 10, 10, 10, 10 are connected to one another in such a way that a vacuum can be continuously generated and maintained in entire module system 9. Surface treatment 13 thus advantageously no longer comes into contact with the atmosphere.
[0129] FIG. 1f shows a sixth process step of a first exemplary method, in which a third substrate 8 is aligned relative to second substrate 6 with the aid of alignment marks 5 that are present.
[0130] A particularly efficient bond between components 4 and third substrate 8 is enabled by means of surface treatment 13. In FIG. 1f, it is shown how components 4 of second substrate 6 are directly connected to third substrate 8.
[0131] FIG. 1g shows a seventh process step of a first exemplary method, in which a separation of first substrate 6 from third substrate 8 takes place. Components 4 become detached with their second component surface 4u from second substrate 6. This separation is referred to as debonding. The debonding can take mechanically and/or thermally and/or chemically and/or with the aid of electromagnetic beams, in particular lasers. Cleaning of component surfaces 4u and/or first substrate surface 6o of second substrate 6 then preferably takes place. Second substrate 6 can then preferably be reused.
[0132] In a particular extension of this first exemplary method for production and preparation, further components can already be present on third substrate/product substrate 8 as from the sixth process step in FIG. 1f. Contacting of components 4 by second substrate 6 and further components by third substrate 8 thus takes place. A plurality of component-to-component stacks, in particular chip-to-chip stacks, can thus be produced or provided particularly efficiently. These component-to-component stacks are simply referred to subsequently as component stacks.
[0133] The use of a second substrate 6A (not represented) would be conceivable, which is equipped with components 4, these being logic switching circuits, for example microprocessors. Furthermore, a second substrate 6B could be produced, which is equipped with components 4 which are memory components, for example a random access memory component. The second substrate with reference A for example is then first bonded to third substrate 8, which is the subsequent product substrate. The second substrate with reference B is then aligned relative to third substrate 8 and components 4 of the second substrate with reference B are bonded to first components 4, which are already located on third substrate 8. A third substrate 8 is thus obtained with a number of component stacks, wherein each component stack includes components with a generally different functionality. The expert in the field also understands that this process can be repeated with a plurality of components in order to produce component stacks with any number of components. It is preferable that the respective new component layer with components 4 from a second substrate 6 always comprises a surface treatment 13 and can thus be bonded particularly efficiently to the last transferred layer of components 4 which is located on third substrate 8.
[0134] FIG. 2a shows a first process step of a second exemplary method. A first substrate 1 is provided at its first substrate surface 1o with a surface treatment 13.
[0135] FIG. 2b shows a second process step of a second exemplary method, in which first substrate 1 is fixed with its second substrate surface 1u lying opposite first substrate surface 1o on a second substrate 6. Second substrate 6 is in particular a film 14, on which an already deposited adhesive layer 3, which can also be referred to as a bonding layer, is located. Most film producers will already provide a film 14 with an adhesive layer 3 during production. Film 14 can then be obtained in the trade with adhesive layer 3. Film 14 is preferably stretched on a frame 15.
[0136] It is also conceivable for the two previous process steps to be exchanged, i.e. for substrate 1 first to be fixed on film 14 of second substrate 6and for surface treatment 13 only then to be obtained. This is advantageous, since first substrate 1 then no longer has to be contacted, but rather the handling and the transport take place via second substrate 6. A drawback, however, is that film 14 can also be affected, in particular unfavourably, due to several surface treatments 13. The sequence is therefore preferably fixed for the given individual case.
[0137] FIG. 2c shows a third process step of a second exemplary method, in which the protection of surface treatment 13 is represented by the application of a protective layer 2 on treated surface 1o. A protective layer 2 is deposited on surface-treated first substrate surface 1o or surface treatment 13. In this case, it is also conceivable for the coating with protective layer 2 to already be carried out before substrate 1 is fixed on second substrate 6.
[0138] FIG. 2d shows a fourth process step of a second exemplary method, in which first substrate 1 is separated into individual components 4. Surface treatment 13 is thereby protected by protective layer 2. This separation into single units preferably takes place outside a module system 9. At the latest after the separation into single units, second substrate 6 can however be transported into a module system 9 (see FIG. 5).
[0139] FIG. 2e shows a fifth process step of a second exemplary method, in which protective layer 2 (no longer shown) is removed from first component surfaces 4o of components 4.
[0140] The removal of protective layer 2 preferably takes place in a module system 9, in which all modules 10, 10, 10, 10, 10 are connected to one another in such a way that a vacuum can be generated and maintained continuously in entire module system 9. Surface treatment 13 thus preferably no longer comes into contact with the atmosphere.
[0141] FIG. 2f shows a sixth process step of a second exemplary method, in which components 4 are individually removed and further processed. Pick-and-place tool 16 contacts the components at treated component surface 4o.
[0142] In an alternative embodiment of the exemplary second method, instead of the individual removal of components 4 according to FIG. 2f, analogous to the sixth process step of the first exemplary method according to FIG. 1f, a third substrate 8 is aligned relative to second substrate 6 and brought into contact with components 4.
[0143] FIG. 3a shows a first process step of a third exemplary method. First substrate 1 is provided at its first substrate surface 1o with a surface treatment 13.
[0144] FIG. 3b shows a second process step of a third exemplary method, in which protective layer 2 is deposited directly onto surface treatment 13 of a first substrate surface 1o of a first substrate 1, before first substrate 1 is fixed to second substrate 6.
[0145] FIG. 3c shows a third process step of a third exemplary method, in which first substrate 1 is fixed on second substrate 6 with its first substrate surface lo, on which surface treatment 13 and protective layer 2 have been produced. Protective layer 2 contacts adhesive layer 3 of film 14.
[0146] FIG. 3d shows a fourth process step of a third exemplary method, in which a separation of first substrate 1 (see FIG. 3c) into individual components 4 takes place. Surface treatment 13 is protected on the one hand by protective layer 2 and on the other hand by the orientation of first substrate 1. The means for the separation of the substrate into single units preferably work first on substrate surface 1u facing away. The influence of the means for the separation into single units is thus minimised in the region of treated surface 13. The separation into single units preferably takes place outside a module system 9.
[0147] FIG. 3e shows fifth process step of a third exemplary method, in which components 4 are removed individually and further processed. The removal of components 4, in particular by contacting of a pick-and-place tool 16 at component surface 4u, is particularly advantageous. On the one hand, no contacting takes place at first component surface 1o. An impairment of the treated surface due to the contacting is thus prevented. Furthermore, the component does not have to be rotated for the bonding of the component surface with the product substrate. After the corresponding component has been taken over at the easily accessible component surface 1u by pick-and-place tool 16, component 4 advantageously points with the treated surface to be bonded away from the take-over by pick-and-place tool 16. In comparison with the second exemplary method, pick-and-place tool 16 cannot change or destroy surface treatment 13, since component 4 is contacted at its component surface 4u, which lies opposite surface treatment 13.
[0148] FIG. 3f shows a sixth process step of a third exemplary method, in which the removal of protective layer 2 takes place, preferably while component 4 is still held by pick-and-place tool 16. Pick-and-place tool 16 can then bond component 4 with its surface treatment 13 on a further component 4 or a third substrate 8 (not represented).
[0149] FIG. 4 shows a plan view of a second substrate 6, 6. A plurality of alignment marks 5 are distributed over second substrate 6, 6. By way of example, sixteen alignment marks 5 are shown. First alignment mark 5 is concealed by a component 4 with alignment mark 5. A further two alignment marks 5 are located on second substrate 6, which are used for the alignment of second substrate 6 with product substrate 8 (not shown, see FIG. 1e). Alignment marks 5 (white), 5 (black) and 5 (grey) has been coloured differently for a clear view. Components 4 are positioned and bonded exclusively in a component positioning region 12.
[0150] FIG. 5 shows a plan view of an exemplary module system 9, comprising a plurality of modules 10, 10, 10, 10, 10. The number of modules is arbitrary. For example, modules 10, 10, 10, 10, 10 are designed as follows. Module 10 represents a coating module, in which bond layer 3 and/or protective layer 2 can be applied (see FIG. 1a). Module 10 represents a module for separating into single units, in which substrate 1 can be separated into single units (see FIG. 1b). Module 10 represents an alignment and bonding module, in which individual components 4 can be aligned and positioned on a second substrate 6. Preferably located in this module, therefore, is a type of pick-and-place device. Module 10 represents a cleaning module, in which protective layer 2 can be removed. Module 10 represents an alignment and bonding module, in which substrates, in particular second substrate 6 equipped with components 4, and a third substrate 8 can be aligned with one another and bonded together.
[0151] A task can also be dealt with by a module, if the necessary means are present in the module. It is also conceivable for module system 9 to comprise further modules. In particular, the coating and separation into single units can also take place outside module system 9, so that only already separated components 4 are introduced into module system 9. In this case, the two aforementioned modules 10, 10 could be left out. Module system 9, in particular the individual modules amongst one another, preferably permits the transfer of components 4 and substrates 6, 8 without the latter being exposed to the atmosphere. Entire module system 9 can thus preferably be evacuated and sealed off with respect to the surrounding atmosphere.
[0152] The loading and unloading of all the necessary objects preferably take place via a lock 11, so that the interior of module system 9 can remain evacuated for as long as possible. Module system 9 or individual modules 10, 10, 10, 10, 10 can be evacuated to a pressure less than 1 bar, preferably less than 1 mbar, still more preferably less than 10.sup.?3 mbar, most preferably less than 10.sup.?9 mbar, with utmost preference up to 10.sup.?12 mbar.
LIST OF REFERENCE NUMBERS
[0153] 1 First substrate [0154] 1o, 1u Substrate surface [0155] 2 Protective layer [0156] 3, 3 Bonding layer/adhesive layer [0157] 4, 4? Component [0158] 4o, 4u Component surface [0159] 5, 5, 5 Alignment marks [0160] 6, 6 Transfer substrate, second substrate [0161] 6o Substrate surface [0162] 8 Third substrate/product substrate [0163] 9 Module system [0164] 10, 10, 10, 10, 10 Module [0165] 11 Lock [0166] 12 Component positioning region [0167] 13 Surface treatment [0168] 14 Film [0169] 15 Frame [0170] 16 Pick-and-place tool
