INTEGRATED CIRCUIT DIE HAVING A SPLIT SOLDER PAD

Abstract

An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.

Claims

1. An integrated circuit die comprising: at least two bond pads a redistribution layer, said redistribution layer comprising: at least one solder pad comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on said solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad, at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.

2. The integrated circuit die according to claim 1, wherein the portions have a shape of a demi-disk.

3. An electronic system comprising: an integrated circuit die according to claim 1, a grounded printed circuit board track connected to the first bond pad via a first bond-wire and to the second bond pad via a second bond wire.

4. The electronic system comprising: an integrated circuit die according to claim 1, a grounded printed circuit board track, a solder ball being placed between the solder pad and the printed circuit board track.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features and advantages of the present invention will appear more clearly upon reading the following detailed description, made with reference to the annexed drawings given by way of non-limiting examples:

[0016] FIG. 1 schematically illustrates a top view of a classical wire-bond package

[0017] FIG. 2 schematically illustrates a side view of the package of FIG. 1

[0018] FIG. 3 schematically illustrates a side view of a classical flip-chip package

[0019] FIG. 4 schematically illustrates an integrated circuit die according to the state of the art

[0020] FIG. 5 schematically illustrates the integrated circuit die of FIG. 4, packaged with a flip-chip technique and used to process a signal from an antenna

[0021] FIG. 6 schematically illustrates the integrated circuit die of FIG. 4, packaged with a wire-bond technique and used to process a signal from an antenna

[0022] FIG. 7 schematically illustrates an integrated circuit die according to a non-limited embodiment of the invention

[0023] FIG. 8 schematically illustrates the integrated circuit die of FIG. 7 that was packaged with a wire-bond technique and is used to process a signal from an antenna.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] FIG. 7 shows an integrated circuit die 10 similar to the integrated circuit die 10 of FIG. 4, with the difference that the solder pad 19 linked to the VSS bond pad 20 and the AVSS bond pad 21 via the redistribution wires 22, 23 is split in half. More precisely, the solder pad 19 comprises a first portion 33 and a second portion 34 facing each other, each having a shape of a demi-disk. The first portion 33 is connected to the VSS bond pad 20 via the redistribution wire 22, and the second portion 34 is connected to the AVSS bond pad 21 via the redistribution wire 23. When no solder ball is placed onto the solder pad 19, the first portion 33 and the second portion 34 are not in electrical contact with each other. However, when a solder ball is placed onto the solder pad 19, the first portion 33 and the second portion 34 become in electrical contact with each other.

[0025] The key feature of the invention is that the electrical connections between the bond pads linked to the different portions are different depending on whether a solder ball is placed on the solder pad 19 or not. As a consequence, as illustrated in FIG. 8, when the die 10 is packaged with wire-bonds and used in the circuit previously detailed in reference to FIG. 6, there is no electrical connection between the AVSS bond pad 21 and the VSS bond pad 20 via the redistribution layer, hence no noise transmission from the digital ground to the analog ground.

[0026] Naturally, the portions 33, 34 may have another shape or be laid out differently on the die 10, as long as a single solder ball can establish an electrical contact between them.