METHOD FOR MANUFACTURING A CAMERA MODULE

Abstract

A method for joining a camera module, including a base plate on which an image sensor is situated, and an objective mount in which an objective of the camera module is accommodated. The base plate is placed on the objective mount, and at least one spring element is laterally mounted and positioned at each of at least two connection areas that are oppositely situated with respect to the optical axis of the camera module. The base plate and the objective mount are pressed flatly against one another via the spring element.

Claims

1-11. (canceled)

12. A method for joining a camera module, including a base plate on which an image sensor is situated, and an objective mount in which an objective of the camera module is accommodated, the method comprising the following steps: placing the base plate on the objective mount; laterally mounting and positioning at least one spring element at each of at least two connection areas that are oppositely situated with respect to an optical axis of the camera module, the base plate and the objective mount being pressed flatly against one another via the spring elements.

13. The method as recited in claim 12, wherein a seal is provided in the connection areas between the base plate and the objective mount prior to mounting the spring element.

14. The method as recited in claim 13, wherein the spring element is mounted in such a way that a force introduction point of the spring element is situated at the seal.

15. The method as recited in claim 13, wherein the spring element is mounted in such a way that a force introduction point of the spring element is situated between the seal and the optical axis of the camera module.

16. The method as recited in claim 13, wherein the spring element is mounted in such a way that the seal is situated between a force introduction point of the spring element and the optical axis of the camera module.

17. The method as recited in claim 12, wherein prior to mounting the spring element in the connection areas at the base plate and/or the objective mount, an indentation is formed via which the spring element is fixed in the connection areas.

18. A camera module, comprising: a base plate on which an image sensor is situated; and an objective mount in which an objective of the camera module is accommodated, the base plate and the objective mount being connected to one another via at least two spring elements that are situated in a respective connection area, at opposite sides with respect to an optical axis of the camera module.

19. The camera module as recited in claim 18, wherein the spring element has a C-shaped contour.

20. The camera module as recited in claim 19, wherein at an open side of the contour the spring element includes an insertion area that widens with respect to a spring element edge.

21. The camera module as recited in claim 18, wherein the spring element is made of a metallic material or a plastic material.

22. A camera system, comprising: a camera module, including: a base plate on which an image sensor is situated, and an objective mount in which an objective of the camera module is accommodated, the base plate and the objective mount being connected to one another via at least two spring elements that are situated in a respective connection area, at opposite sides with respect to an optical axis of the camera module.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1 shows a first exemplary embodiment of a camera module prior to mounting a spring element, in accordance with the present invention.

[0022] FIG. 2 shows the exemplary embodiment according to FIG. 1 after mounting a spring element, in accordance with the present invention.

[0023] FIG. 3 shows a second exemplary embodiment of a camera module, in accordance with the present invention.

[0024] FIG. 4 shows third and fourth exemplary embodiments of a camera module, in accordance with the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0025] FIG. 1 shows a first exemplary embodiment of a camera module 10 prior to mounting a spring element 14 (see FIG. 2, for example). Camera module 10 includes an objective mount 18, in which an objective 26 together with a lens 30 is accommodated in a cutout 22. Objective 26 is fastened to objective mount 18 via an adhesive 34 that is applied between objective mount 18 and objective 26.

[0026] Camera module 10 additionally includes a base plate 38 that rests flatly against objective mount 18 in a connection area 42. Base plate 38 is positionable with respect to objective mount 18 via positioning pins 43 of objective mount 18 that engage with corresponding recesses 44 in base plate 38. In this exemplary embodiment, objective mount 18 has an indentation 45, which in this exemplary embodiment is delimited on both sides, in connection area 42 on an outer side.

[0027] To protect the interior of camera module 10 from environmental influences, a seal 46 which in this exemplary embodiment directly adjoins connection area 42 is situated between objective mount 18 and base plate 38. An image sensor 50, which is joined to base plate 38 via an adhesive layer 54, is situated on base plate 38. Image sensor 50 is situated in flush alignment with objective 26.

[0028] FIG. 2 shows the exemplary embodiment according to FIG. 1 after mounting spring element 14. Base plate 38 and objective mount 18 are pressed against one another via this spring element 14. During mounting of C-shaped spring element 14, on the edge side it is pushed on at two opposite sides with respect to an optical axis 62 of objective 26. In this exemplary embodiment, for easier mounting of spring element 14, at an open side of the C-shaped contour the spring element includes an insertion area 70 that widens with respect to spring element edge 66. After mounting, spring element 14 is fixed by indentation 45, as shown in FIG. 2, so that spring element 14 is prevented from sliding out.

[0029] In an exemplary embodiment that is not shown, positioning pin 43 may be extended in such a way that it protrudes into an opening in spring element 14 so that spring element 14 is fixed. Likewise, in addition a further pin may be provided that is situated on a side of objective mount 18 opposite from positioning pin 43, the further pin likewise engaging with a corresponding opening in spring element 14.

[0030] A second exemplary embodiment of a camera module 10 is shown in FIG. 3. This exemplary embodiment differs from the exemplary embodiment shown in FIG. 2 in that spring element 14 does not include an insertion area 70. In addition, seal 46 is situated within connection area 42 directly in the area of a force introduction point 74 of spring element 14. Elastic force F is thus transmitted directly to seal 46, thereby improving the sealing effect of seal 46.

[0031] FIG. 4 shows third and fourth exemplary embodiments of camera module 10. The third exemplary embodiment is shown on the left side of camera module 10, while the right side of camera module 10 is provided as the fourth exemplary embodiment. In contrast to FIG. 3, on the left side a force introduction point 74 of spring element 14 is situated between optical axis 62 and seal 46, not directly at seal 46. Force introduction point 74 thus has a distance S from seal 46.

[0032] In this exemplary embodiment, seal 46 may be designed in such a way that it protrudes beyond objective mount 18 in a contact area with respect to base plate 38, even after an elastic force F is applied. As the result of an arrangement of spring element 14 as illustrated in the left portion of camera module 10, plate 38 is bent by elastic force F in the direction of objective 26 about a pivot point D that is formed by seal 46. Accordingly, this results in convex bending of base plate 38. A corresponding illustration of the resulting deflection, base plate 38, and force introduction point 74 as well as pivot point D is shown in the graphical illustration below camera module 10. For example, bending of base plate 38 due to temperature or moisture may be compensated for by such a deflection.

[0033] In the right portion of camera module 10, spring element 14 is arranged in such a way that seal 46 is situated between force introduction point 74 and optical axis 62. Accordingly, base plate 38, as shown in the graphical illustration, is bent away from objective 26, resulting in concave bending of base plate 38. Bending of base plate 38 may also be compensated for in this way.