PLASMONIC METAL NITRIDE AND TRANSPARENT CONDUCTIVE OXIDE NANOSTRUCTURES FOR PLASMON ASSISTED CATALYSIS
20180003865 ยท 2018-01-04
Assignee
Inventors
- Urcan Guler (Lafayette, IN, US)
- Alberto Naldoni (West Lafayette, IN, US)
- Alexander Kildishev (West Lafayette, IN, US)
- Alexandra Boltasseva (West Lafayette, IN)
- Vladimir M. Shalaev (West Lafayette, IN)
Cpc classification
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
B01J23/00
PERFORMING OPERATIONS; TRANSPORTING
E06B2009/2464
FIXED CONSTRUCTIONS
International classification
B01J35/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A nanostructured material system for efficient collection of photo-excited carriers is provided. They system comprises a plurality of plasmonic metal nitride core material elements coupled to a plurality of semiconductor material elements. The plasmonic nanostructured elements form ohmic junctions at the surface of the semiconductor material or at close proximity with the semiconductor material elements. A nanostructured material system for efficient collection of photo-excited carriers is also provided, comprising a plurality of plasmonic transparent conducting oxide core material elements coupled to a plurality of semiconductor material elements. The field enhancement, local temperature increase and energized hot carriers produced by nanostructures of these plasmonic material systems play enabling roles in various chemical processes. They induce, enhance, or mediate catalytic activities in the neighborhood when excited near the resonance frequencies.
Claims
1. A nanostructured material system for efficient collection of photo-excited carriers, comprising: a plurality of plasmonic metal nitride core material elements coupled to a corresponding plurality of semiconductor material elements.
2. The system of claim 1, wherein the plasmonic nanostructured elements form ohmic junctions at the surface of the semiconductor material elements or at close proximity with the semiconductor material elements.
3. The system of claim 1, wherein the plasmonic metal nitride core material is titanium nitride (TiN).
4. The system of claim 3, wherein the semiconductor is titanium dioxide (TiO.sub.2) or TiO.sub.xN.sub.1-x, where 0<x<1.
5. The system of claim 1, wherein the plasmonic metal nitride core material comprises tantalum nitride (TaN).
6. The system of claim 5, wherein the semiconductor material elements comprise tantalum oxide (Ta.sub.xO.sub.y), wherein x and y>1.
7. The system of claim 6, wherein the semiconductor material elements comprise tantalum pentoxide (Ta.sub.2O.sub.5).
8. The system of claim 5, wherein the semiconductor material elements comprise Ta.sub.3N.sub.5.
9. The system of claim 1, further comprising a substrate upon which the nanostructured elements are mounted on a substrate.
10. The system of claim 8, wherein the nanostructured elements are arranged in an array on the substrate.
11. A nanostructured material system for efficient collection of photo-excited carriers, comprising: a plurality of plasmonic transparent conducting oxide core material elements coupled to a corresponding first plurality of semiconductor material elements.
12. The system of claim 11, wherein the plasmonic transparent conducting oxide core material elements comprise indium tin oxide (ITO).
13. The system of claim 12, wherein the first plurality of semiconductor material elements comprise tin oxide.
14. The system of claim 11, wherein the plasmonic transparent conducting oxide core material elements comprise gallium doped zinc oxide (GZO) or aluminum doped zinc oxide (AZO).
15. The system of claim 14, wherein the first plurality of semiconductor material elements comprise zinc oxide.
16. The system of claim 11, further comprising a substrate upon which the nanostructured elements are mounted on a substrate.
17. The system of claim 11, wherein the nanostructured elements are arranged in an array on the substrate.
18. The system of claim 11, further comprising: a plurality of plasmonic metal nitride core material elements coupled to a corresponding second plurality of semiconductor material elements.
19. The system of claim 18, wherein the plasmonic metal nitride core material elements comprise titanium nitride (TiN).
20. The system of claim 19, wherein the second plurality of semiconductor material elements comprise titanium dioxide (TiO.sub.2) or TiO.sub.xNi.sub.1-x, where 0<x<1.
21. The system of claim 18, wherein the plasmonic metal nitride core material elements comprise tantalum nitride (TaN).
22. A nanostructured material system for efficient catalytic activities supported by local heating and local field enhancement, comprising: a plurality of plasmonic metal nitride nanostructures covered with seed layers and illuminated with resonant light source under precursor flow in a reaction chamber, the see layers comprising.
23. The system of claim 22, wherein the seed layers comprise silicon, silica, silicon germanium, silicon nitride, carbon, or metal.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In the following description and drawings, identical reference numerals have been used, where possible, to designate identical features that are common to the drawings.
[0009]
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[0014] The attached drawings are for purposes of illustration and are not necessarily to scale.
DETAILED DESCRIPTION
[0015] Transition metal nitrides exhibit plasmonic resonances in the visible and near infrared regions and their performance can reach levels comparable to metals when the growth parameters of the materials are optimized. A significant superiority of some transition metal nitrides over metals is that they also exhibit refractory properties, meaning that they are durable materials at high temperatures. Titanium nitride (TiN) and zirconium nitride (ZrN) are two prominent refractory plasmonic transition metal nitrides. In addition to their good plasmonic performance and refractory properties, they also accommodate self-passivating native oxide layers, which can be removed by nitridation or further extended by oxidation.
[0016] According to one embodiment, a chemical vapor deposition (CVD) chemical process is enhanced via local heating and field enhancement through plasmonic resonance when illuminated by a light source 4 as shown in
[0017] As shown in
[0018] The formation of efficient junctions involving plasmonic transition metal nitrides and doped transparent conductive oxides can be generalized to the use of other common semiconductor used in solar energy conversion such as Si, -Fe.sub.2O.sub.3, and 2D transition metal dichalcogenides.
[0019] According to one embodiment, refractory transition metal nitrides form the core of a structure for plasmon-assisted catalysis such as biomass conversion, (photo) steam reforming, and carbon dioxide photoreduction, where the hot carriers generated from surface plasmon decay decrease the transition state energy of a certain chemical reaction and/or decrease the catalyst deactivation due to side effects such as coke formation, surface reconstruction, and metal passivation. As shown in
[0020] The invention is inclusive of combinations of the aspects described herein. References to a particular aspect and the like refer to features that are present in at least one aspect of the invention. Separate references to an aspect (or embodiment) or particular aspects or the like do not necessarily refer to the same aspect or aspects; however, such aspects are not mutually exclusive, unless so indicated or as are readily apparent to one of skill in the art. The use of singular or plural in referring to method or methods and the like is not limiting. The word or is used in this disclosure in a non-exclusive sense, unless otherwise explicitly noted.
[0021] The invention has been described in detail with particular reference to certain preferred aspects thereof, but it will be understood that variations, combinations, and modifications can be effected by a person of ordinary skill in the art within the spirit and scope of the invention.