LIGHT IRRADIATING DEVICE
20170191650 ยท 2017-07-06
Assignee
Inventors
Cpc classification
F21V29/503
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/62
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/80
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/65
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G02B19/0019
PHYSICS
F21V31/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V7/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/505
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2105/16
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V29/65
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V7/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V31/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/505
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/503
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/62
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
The light irradiating device includes a substrate; a plurality of light emitting diode elements disposed on a surface of the substrate; a cooling unit which is disposed on a rear surface of the substrate; an inner wall which is disposed to enclose a light passage area through which light of the plurality of light emitting diode elements passes; a housing which accommodates the substrate, the plurality of light emitting diode elements, the cooling unit, and the inner wall and generates a space between the inner wall and the housing; an air inlet which introduces air in the light passage area onto the rear surface of the substrate; a flow channel which passes through the rear surface of the substrate and connects the air inlet and the space; and a circulation port which is provided to discharge the air in the space to the light passage area.
Claims
1. A light irradiating device comprising: a substrate; a plurality of light emitting diode elements disposed on a surface of the substrate; a cooling unit which is disposed on a rear surface of the substrate and cools the substrate and the plurality of light emitting diode elements; an inner wall which is disposed to enclose a light passage area through which light of the plurality of light emitting diode elements passes; a housing which accommodates the substrate, the plurality of light emitting diode elements, the cooling unit, and the inner wall and generates a space between the inner wall and the housing; an air inlet which introduces air in the light passage area onto the rear surface of the substrate; a flow channel which passes through the rear surface of the substrate and connects the air inlet and the space; and a circulation port which is provided to discharge the air in the space to the light passage area, wherein the cooling unit cools the air introduced in the air inlet, and the air is convected between the light passage area and the space.
2. The light irradiating device of claim 1, wherein the inner wall includes a reflective mirror which guides the light from the plurality of light emitting diode elements.
3. The light irradiating device of claim 1, wherein the housing includes a light emission window which allows the light to pass therethrough and air-tightly closes the light passage area.
4. The light irradiating device of claim 3, wherein the circulation port is formed between the light emission window and the inner wall.
5. The light irradiating device of claim 1, wherein the inner wall includes an opening and the opening configures the circulation port.
6. The light irradiating device of claim 1, further comprising: a fan which accelerates convection of the air, in an area other than the light passage area.
7. The light irradiating device of claim 1, further comprising: a driver circuit which drives the plurality of light emitting diode elements, in the space.
Description
DESCRIPTION OF THE DRAWINGS
[0017]
[0018]
[0019]
[0020]
[0021]
[0022]
[0023]
DETAILED DESCRIPTION
[0024] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. Further, in the drawings, like elements are denoted by like reference numerals, and description thereof will not be repeated.
First Exemplary Embodiment
[0025]
[0026] As illustrated in
[0027]
[0028] As illustrated in
[0029] As illustrated in
[0030] Further, as illustrated in
[0031] The heat radiating member 400 is a member which fixes the LED modules 200 and radiates heat generated from each LED module 200. The heat radiating member 400 is configured by two water cooling heat sinks 402 which are formed of metal such as copper having high heat conductivity and a heat radiating frame 404 which is fixed to another end face of two water cooling heat sinks 402 to be thermally coupled and support the two water cooling heat sink 402. Further, as illustrated in
[0032] The water cooling heat sink 402 is a panel shaped member in which the LED module 200 is mounted on one end face and a plurality of water channels 402a (see
[0033] The heat radiating frame 404 is a rectangular panel shaped metal member which cools air flowed from the air inlet 404b. A plurality of heat radiating pins 404a which is erected in a direction opposite to the Z-axis direction and extends in the Y-axis direction is formed on the other end face (a surface opposite to the surface to which the water cooling heat sink 402 is fixed) of the heat radiating frame 404. The plurality of heat radiating pins 404a is disposed to be divided into two groups in the Y-axis direction with respect to the air inlet 404b and the air which flows therein from the air inlet 404b flows between the heat radiating pins 404a which are divided into two groups to be cooled. That is, a flow channel through which air flowing from the air inlet 404b flows is formed between the heat radiating pins 404a. Further, an outer end (an end opposite to the air inlet 404b) of each heat radiating pin 404a forms an air outlet 404c through which air flowing from the air inlet 404b is discharged, between the outer end of the heat radiating pin 404a and an outer end of adjacent heat radiating pin 404a. As described above, the heat radiating member 400 of the embodiment of the exemplary embodiment is configured to radiate heat generated in each LED module 200 by the water cooling heat sink 402 and cool air flowing from the air inlet 404b using a rear surface of the water cooling heat sink 402. Further, the cooled air which is discharged from the air outlet 404c flows in a space between the case 100 and the reflective mirror 300 to cool the reflective mirror 300 and passes through a circulation port 301 (see
[0034]
[0035] As described above, four reflective mirrors 300 of the exemplary embodiment are members for mixing ultraviolet ray emitted from each LED element 210 and are slantly provided to be gradually broader from each side of the heat radiating frame 404 to the window 105. When the ultraviolet ray from each LED element 210 is mixed by the reflective mirror 300, a uniform light intensity distribution is obtained on the object to be irradiated.
[0036] However, when the ultraviolet ray from each LED element 210 touches the reflective mirror 300, some of the light which is absorbed by the reflective mirror 300 is converted into heat. Therefore, the temperature of the reflective mirror 300 is increased to be high, so that the reflective mirror 300 is deformed. Further, in the exemplary embodiment, the reflective mirror 300 is covered by the window 105, so that the reflective mirror 300 has a high temperature and thus air of the light passage area (an area enclosed by the reflective mirrors 300) is heated. Further, a temperature in the light irradiating device 1 is increased, which may adversely affect the LED elements 210 or other electric components. Therefore, in order to solve the above-mentioned problem, in the exemplary embodiment, the air inlet 404b is provided in the heat radiating frame 404 to cool not only each LED module 200, but also air received from the air inlet 404b, thereby cooling the air of the light passage area (the area enclosed by the reflective mirrors 300) and the reflective mirrors 300.
[0037] An arrow of
[0038] Further, as described above, in the exemplary embodiment, a small gap and a circulation port 301 are formed between a leading edge 300a of the reflective mirror 300 and the window 105. Further, the cooled air between the case 100 and the reflective mirror 300 passes through the circulation port 301 port to flow in the light passage area (see an arrow D). Therefore, according to the configuration of the exemplary embodiment, the air in the light passage area is also cooled.
[0039] As described above, in the exemplary embodiment, the air inlet 404b is provided in the heat radiating frame 404 and the air is naturally convected between the light passage area and the space between the case 100 and the reflective mirror 300 using a rear surface of the water cooling heat sink 402, thereby cooling the reflective mirror 300 and the air in the light passage area.
[0040] Therefore, even though the ultraviolet ray from each LED element 210 touches the reflective mirror 300, the temperature of the reflective mirror 300 is not increased and the reflective mirror 300 is not deformed. Further, the temperature in the light irradiating device 1 is suppressed from being increased, which does not adversely affect the LED element 210 or other electric components.
(Effect Confirmation Experiment)
[0041] Table 1 is a table which explains a result of an effect confirmation experiment of the present invention. In a state where the air inlet 404b is not provided (that is, the air inlet 404b is closed by a switching plate) and a state where the air inlet 404b is open (that is, the configuration of the exemplary embodiment), temperatures in measurement positions illustrated in
TABLE-US-00001 TABLE 1 Measurement position a b c Heat sink Reflective Inner space Air inlet 402 minor 300 of case 100 close 28.2 100.9 76.8 open 27.4 86.6 72.0 Temperature 0.8 14.3 4.8 difference
[0042] Further, as illustrated in
Consideration)
[0043] As represented in Table 1, according to data of the measurement position a, it is understood that since the coolant passes through the water cooling heat sink 402 regardless of presence of the air inlet 404b, the temperature difference is rarely caused. Further, according to data of the measurement position b, it is understood that when the air inlet 404b is provided, the temperature of the reflective mirror 300 is lowered by approximately 14.3 C. Furthermore, according to data of the measurement position c, it is understood that an air temperature in the space between the case 100 and the reflective mirror 300 is lowered by approximately 4.8 C.
[0044] Even though the exemplary embodiment has been described above, the present invention is not limited to the above-described configuration and may be modified in various forms within a scope of a technical spirit of the present invention.
[0045] For example, it is described that the light irradiating device 1 of the exemplary embodiment is disposed above the object to be irradiated to irradiate a downward ultraviolet ray onto the object to be irradiated. However, the air in the light passage area may flow in the air inlet 404b. For example, the light irradiating device 1 is laterally disposed to irradiate a lateral ultraviolet ray onto the object to be irradiated. Further, even though the exemplary embodiment employs a configuration in which the air in the light passage area is naturally convected, the present invention is not limited to this configuration. For example, a fan may be provided in a convection path of the air (that is, an area other than the light passage area) to forcibly convect the air in the light passage area.
[0046] Further, even though the exemplary embodiment employs a configuration in which the air inlet 404b is provided at the center of the heat radiating frame 404 in the Y-axis direction (that is, between 16 LED modules 200 which are arranged in two columns), the present invention is not limited to this configuration. If the air in the light passage area flows in the air inlet 404b, the air inlet 404b may be provided in any positions. Further, even though the exemplary embodiment employs a configuration in which the reflective mirrors 300 which enclose the LED modules 200 are provided to cool the reflective mirrors 300 by naturally convecting the air in the air passage area, the reflective mirrors 300 may not necessarily provided. For example, instead of the reflective mirrors 300, an inner wall which encloses the LED modules 200 may be provided. In this case, the air in the light passage area is naturally convected to lower a temperature of the inner wall.
[0047] Further, in the exemplary embodiment, the air temperature in the space between the case 100 and the reflective mirror 300 can be lowered, so that a driver circuit which supplies a driving current to each LED element 210 may be disposed between the case 100 and the reflective mirror 300.
[0048] Further, in the exemplary embodiment, the window 105 is disposed at the leading edge 300a of the reflective mirror 300, but the window 105 may not be necessarily provided. When the window 105 is removed, outside air flows in the light passage area and the air in the light passage area convects, so that the light passage area is maintained at a low temperature.
[0049] In the LED modules 200 of the exemplary embodiment, 200 LED elements 210 which are disposed on the substrate 205 in a matrix of 20 columns (Y-axis direction) by 10 LED elements (X-axis direction) are provided. However, the present invention is not limited to this configuration, but the LED elements 210 may be disposed in one line or may be alternately disposed. Further, even though the optical axes of all the LED elements 210 are aligned to the Z-axis, for example, optical axes of some LED elements 210 may be directed to a direction other than the Z-axis direction.
Further, even though the heat radiating member 400 of the exemplary embodiment has the water cooling heat sink 402, liquid cooling may be employed instead of water. Further, instead of the water cooling heat sink 402, a heat pipe, a Peltier cooler (Peltier element), or a cooling fan may be applied.
Second Exemplary Embodiment
[0050]
[0051] As illustrated in
[0052] Further, the circulation port 301M is not limited to a slit shaped opening, but may be a plurality of openings formed along the X-axis direction. Further, similarly to the first exemplary embodiment, also in the exemplary embodiment, the window 105 may be removed. When the window 105 is removed, the outside air flows in the light passage area to convect the air in the light passage area. Therefore, the light passage area is maintained at a low temperature.
[0053] The disclosed exemplary embodiments are illustrative at every aspect but are not restrictive. The scope of the present invention is represented not by the above description, but by claims and it is intended that all changes are included within an equivalent meaning and range to a scope of the claims.
EXPLANATION OF REFERENCE NUMERALS AND SYMBOLS
[0054] 1, 2 Light irradiating device [0055] 100 Case [0056] 105 Window [0057] 110 Partition panel [0058] 200 LED module [0059] 205 Substrate [0060] 207 Anode pattern [0061] 209 Cathode pattern [0062] 210 LED element [0063] 300, 300M Reflective mirror [0064] 300a Leading edge [0065] 301, 301M Circulation port [0066] 400 Heat radiating member [0067] 402 Water cooling heat sink [0068] 402a Water channel [0069] 404 Heat radiating frame [0070] 404a Heat radiating pin [0071] 404b Air inlet [0072] 404c Air outlet