Pressure sensitive adhesive film

Abstract

The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

Claims

1. A pressure-sensitive adhesive film, comprising a pressure-sensitive adhesive layer which comprises a polymer derived from isobutylene and satisfies the following Expression 4:
2.010.sup.5 PaG.sub.N.sup.05.010.sup.5 Pa[Expression 4] where, in Expression 4, G.sub.N.sup.0 is a complex modulus value when a phase angle is a minimum in a graph (X-axis: complex modulus, Y-axis: phase angle) of a phase angle and complex modulus of a circular sample (diameter: 8 mm, thickness: 500 m) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) while a frequency range is increased from 0.01 to 100 Hz at a temperature of 80 C. and a strain of 1%.

2. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer has a recovery rate R.sub.1 of 55% or more according to the following Expression 3:
R.sub.1=(S.sub.MS.sub.R,30)100/S.sub.M[Expression 3] where, in Expression 3, S.sub.M is a maximum strain (%) of the circular sample (diameter: 8 mm, thickness: 500 m) prepared using the pressure-sensitive adhesive layer, which is measured using a discovery hybrid rheometer (DHR) when a strain is applied at a shear stress of 2,000 Pa and a temperature of 80 C. for 3 minutes, and S.sub.R,30 is a residual strain (%) measured 30 seconds after the stress is removed.

3. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer has a phase angle () in a range of 10 to 18 according to the following Expression 1:
=tan.sup.1(G/G)[Expression 1] where, in Expression 1, G and G respectively represent a storage modulus G and loss modulus G of the circular sample (diameter: 8 mm, thickness: 500 m) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) under conditions of a temperature of 80 C., a strain of 1% and a frequency of 0.1 Hz.

4. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer has a complex viscosity (*=|G*|/) of 2.510.sup.4 Pa.Math.s to 5.010.sup.4 Pa.Math.s according to the following Expression 2:
*=|G*|/={square root over ((G/).sup.2+(G/).sup.2)}[Expression 2] where, in Expression 2, represents a frequency and is 6.28 rad/s, and G and G respectively represent a storage modulus G and loss modulus G of the circular sample (diameter: 8 mm, thickness: 500 m) prepared using the pressure-sensitive adhesive layer, which are measured using a discovery hybrid rheometer (DHR) under conditions of a temperature of 80 C., a strain of 1% and a frequency of 0.1 Hz.

5. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer further comprises an active energy ray-polymerizable compound which is polyfunctional.

6. The pressure-sensitive adhesive film of claim 1, wherein the polymer derived from isobutylene is a copolymer of a diene and an olefin-based compound comprising one carbon-carbon double bond.

7. The pressure-sensitive adhesive film of claim 1, wherein the polymer derived from isobutylene comprises a copolymer having a polymerization unit of the following Formula A and a polymerization unit of the following Formula B: ##STR00004##

8. The pressure-sensitive adhesive film of claim 7, wherein the copolymer comprises the polymerization unit of Formula A at 95 to 99.5 mol % and the polymerization unit of Formula B at 0.5 to 5 mol %.

9. The pressure-sensitive adhesive film of claim 5, wherein the active energy ray-polymerizable compound which is polyfunctional satisfies the following Formula 1: ##STR00005## where, in Formula 1, R.sub.1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, X represents an n-valent residue derived from a linear, branched or cyclic alkyl group having 3 to 30 carbon atoms.

10. The pressure-sensitive adhesive film of claim 5, wherein the active energy ray-polymerizable compound is included at 5 to 30 parts by weight relative to 100 parts by weight of the polymer.

11. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer further comprises a tackifier.

12. The pressure-sensitive adhesive film of claim 11, wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

13. The pressure-sensitive adhesive film of claim 5, wherein the pressure-sensitive adhesive layer further comprises a radical initiator.

14. The pressure-sensitive adhesive film of claim 13, wherein the radical initiator is included at 0.2 to 20 parts by weight relative to 100 parts by weight of the active energy ray-polymerizable compound.

15. The pressure-sensitive adhesive film of claim 1, wherein the pressure-sensitive adhesive layer further comprises a moisture absorbent.

16. The pressure-sensitive adhesive film of claim 1, which has a light transmittance of 85% or more in a visible light region.

17. The pressure-sensitive adhesive film of claim 1, which has a haze of 3% or less.

18. An organic electronic device, comprising: a substrate; an organic electronic element formed on the substrate; and the pressure-sensitive adhesive film according to claim 1 which encapsulates the organic electronic element.

19. A method of manufacturing an organic electronic device, comprising: applying the pressure-sensitive adhesive film according to claim 1 on a substrate on which an organic electronic element is formed, such that the pressure-sensitive adhesive film covers the organic electronic element; and crosslinking the pressure-sensitive adhesive film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1 and 2 are cross-sectional views of a pressure-sensitive adhesive film according to an example of the present application; and

(2) FIG. 3 is a cross-sectional view of an organic electronic device-encapsulation product according to an example of the present application.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(3) Hereinafter, the present application will be described in detail with reference to examples according to the present application and comparative examples not according to the present application, but the scope of the present application is not limited to the following examples.

Example 1

(4) 80 g of butyl rubber (BUTYL 301 manufactured by Lanxess AG) as a polymer, 20 g of a hydrogenated DCPD-based tackifier resin (SU-90 manufactured by Kolon Industries, Inc.) as a tackifier, 10 g of tricyclodecane dimethanol diacrylate (M262 manufactured by Miwon Specialty Chemicals Co., Ltd.) as an active energy ray-polymerizable compound, and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure 651 manufactured by Ciba Specialty Chemicals) as a radical initiator were introduced, and diluted with toluene such that the solid content is 15 wt %, and thereby an a coating solution was prepared.

(5) The prepared solution was applied onto a release surface of a release PET film, dried in an oven at 120 C. for 15 minutes, and thereby a pressure-sensitive adhesive film including a pressure-sensitive adhesive layer with a thickness of 20 m was prepared. The physical properties of a sample prepared by irradiating UV light at intensity of 1 J/cm.sup.2 to the prepared film using a D-bulb were measured.

Comparative Example 1

(6) A pressure-sensitive adhesive film was prepared in the same manner as in Example 1 except that a sample was prepared by irradiating UV light at intensity of 0.1 J/cm.sup.2 to the prepared film using an H-bulb.

(7) The physical properties in the example and comparative example were measured according to the following methods.

(8) 1. Evaluation of Reliability

(9) The films prepared in the example and comparative example were laminated on a barrier film (serving as a cover substrate), laminated on a glass substrate, and pressed with pressure and heat at 5 atm and 80 C. on a substrate to prepare a specimen. Thereafter, the specimen was examined to determine whether or not lifting, an air bubble or haze was generated between the glass substrate and the pressure-sensitive adhesive layer in a constant temperature and constant humidity chamber under conditions of 85 C. and relative humidity of 85% for about 500 hours. When the specimen was observed with the naked eye, the case in which any one of lifting, the air bubble or haze was generated between the glass substrate and the pressure-sensitive adhesive layer was represented by X, and the case in which none of lifting, the air bubble or haze was generated was represented by O.

(10) 2. Measurement of Phase Angle

(11) The storage modulus G and loss modulus G of circular samples (diameter: 8 mm, thickness: 500 m) prepared using the pressure-sensitive adhesive layers of the example and comparative example were measured using a discovery hybrid rheometer (DHR2) manufactured by TA Instrument Inc. under conditions of a temperature of 80 C. and a strain of 1% (strain in the linear region) while a frequency was increased from 0.01 to 100 Hz. A phase angle when a frequency was 0.1 Hz was measured using the following Expression 1.
=tan.sup.1(G/G)[Expression 1]

(12) 3. Measurement of Complex Modulus

(13) The storage modulus and loss modulus were measured in the same manner as the method of measurement of the phase angle, and a complex modulus was calculated according to the following Expression 6.
|G*|={square root over ((G).sup.2+(G).sup.2)}[Expression 6]

(14) 4. Measurement of Plateau Modulus

(15) The storage modulus and loss modulus were measured according to the change in frequency while a frequency was increased from 0.01 to 100 Hz as in the measurement of the phase angle, and a phase angle and complex modulus were calculated according to Expressions 1 and 6 from the measured storage modulus and loss modulus.

(16) The values of the phase angle and complex modulus in the frequency range of 0.01 to 100 Hz were plotted as a graph of the phase angle (Y-axis) with respect to the complex modulus (X-axis). In the plotted graph, the complex modulus at the minimum phase angle, that is, G.sub.N.sup.0(plateau modulus) was measured.

(17) TABLE-US-00001 TABLE 1 Reliability at high temperature and Phase angle Plateau modulus humidity Pa 85 C., 85% RH Example 1 12.61 314,045 Comparative 9.48 168,142 X Example 1

DESCRIPTION OF REFERENCE NUMERALS

(18) 1, 2: pressure-sensitive adhesive film

(19) 11: pressure-sensitive adhesive layer

(20) 12: first film

(21) 21: second film

(22) 3: organic electronic device

(23) 31: substrate

(24) 32: organic electronic element

(25) 33: pressure-sensitive adhesive layer or encapsulation layer

(26) 34: cover substrate