Method for Manufacturing a Si-Based High-Mobility CMOS Device With Stacked Channel Layers, and Resulting Devices

Abstract

A device and method for manufacturing a Si-based high-mobility CMOS device is provided. The method includes the steps of: (i) providing a silicon substrate having a first insulation layer on top and a trench into the silicon; (ii) manufacturing a III-V semiconductor channel layer above the first insulation layer by depositing a first dummy layer of a sacrificial material, covering the first dummy layer with a first oxide layer, and replacing the first dummy layer with III-V semiconductor material by etching via holes in the first oxide layer followed by selective area growth; (iii) manufacturing a second insulation layer above the III-V semiconductor channel layer and uncovering the trench; (iv) manufacturing a germanium or silicon-germanium channel layer above the second insulation layer by depositing a second dummy layer of a sacrificial material, covering the second dummy layer with a second oxide layer, and replacing the second dummy layer with germanium or silicon-germanium by etching via holes in the second oxide layer followed by selective area growth.

Claims

1. A method for manufacturing a Si-based high-mobility CMOS device, wherein a Ge or Si.sub.xGe.sub.1x channel layer and a III-V semiconductor channel layer are co-integrated on a silicon substrate, the method comprising the steps of: a) providing a silicon substrate having a first insulation layer on top and a trench extending through the insulation layer and into the silicon; b) manufacturing a III-V semiconductor channel layer above the first insulation layer by means of, in sequence, depositing a first dummy layer of a sacrificial material above the first insulation layer and in the trench, covering the first dummy layer with a first oxide layer, and replacing the first dummy layer with III-V semiconductor material by etching the sacrificial material via first holes made in the first oxide layer followed by selective area growth with the III-V semiconductor material; c) manufacturing a second insulation layer above the III-V semiconductor channel layer and uncovering the trench; and d) manufacturing a germanium or silicon-germanium channel layer above the second insulation layer by means of, in sequence, depositing a second dummy layer of a sacrificial material above the second insulation layer and in the trench, covering the second dummy layer with a second oxide layer, and replacing the second dummy layer with germanium or silicon-germanium by etching the sacrificial material via second holes made in the second oxide layer followed by selective area growth with germanium or silicon-germanium.

2. The method according to claim 1, wherein the size and location of the first and second holes are chosen such that the first and second oxide layers have cover parts which force lateral growth during the selective area growth steps.

3. The method according to claim 2, wherein the first holes are made in the first oxide layer at locations offset from the location of the trench by a predetermined distance, such that a cover part of the first oxide layer remains which covers the trench and extends sideways therefrom over the predetermined distance.

4. The method according to claim 2, wherein the second holes comprise offset second holes, which are made in the second oxide layer at locations offset from the location of the trench by a predetermined distance, such that a cover part of the second oxide layer remains which extends from the location of the trench up to the offset second holes.

5. The method according to claim 4, wherein the second holes further comprise at least one non-offset second hole, which is made in the second oxide layer at a location aligned with the location of the trench.

6. The method according to claim 5, wherein the size of the non-offset second hole is smaller than the size of the offset second holes.

7. The method according to claim 1, wherein the trench has slanting side planes in the silicon substrate.

8. The method according to claim 1, further comprising planarization steps immediately following the dummy layer deposition steps and the selective area growth steps.

9. The method according to claim 1, wherein amorphous silicon is used as the sacrificial material for the first and/or second dummy layers.

10. The method according to claim 1, further comprising an oxide liner deposition step immediately following the step of uncovering the trench and a step of etching away the oxide liner at the bottom of the trench before the selective area growth with germanium or silicon-germanium.

11. The method according to claim 1, further comprising steps for removing material up to the first insulation layer except for stacked structures with layers of uniform thickness, each stacked structure comprising a III-V semiconductor channel layer a germanium or silicon-germanium channel layer of above each other.

12. The method according to claim 11, further comprising steps for etching fins from the stacked structures and manufacturing in each fin sources, drains and a common gate for an nMOS device and a pMOS device, such that in each fin a separate nMOS device and pMOS device are formed which are stacked above each other.

13. The method according to claim 1, wherein the III-V semiconductor channel layer and the germanium or silicon-germanium channel layer are switched.

14. A Si-based high-mobility CMOS device, the device comprising a silicon substrate having a first insulation layer on top and a plurality of fins extending upwards from the first insulation layer, each fin comprising a stack of layers of uniform thickness, wherein the stack comprises a III-V semiconductor channel layer above the first insulation layer, a second insulation layer above the III-V semiconductor channel layer and a germanium or silicon-germanium channel layer above the second insulation layer, wherein each fin further comprises sources, drains and a common gate of an nMOS device and a pMOS device which are separate for each fin.

15. The Si-based high-mobility CMOS device of claim 14, wherein the first and second insulation layers have been partly removed, such that the III-V semiconductor channel layer and the germanium or silicon-germanium channel layer are nanowires, and wherein the common gate completely surrounds a middle part of the nanowires.

16. The Si-based high-mobility CMOS device of claim 14, wherein each of the first and second insulation layers is a single layer.

17. The Si-based high-mobility CMOS device of claim 14, wherein each of the first and second insulation layers are composed of multiple layers.

18. A Si-based high-mobility CMOS device, the device comprising a silicon substrate having a first insulation layer on top and a plurality of fins extending upwards from the first insulation layer, each fin comprising a stack of layers of uniform thickness, wherein the stack comprises a germanium or silicon-germanium channel layer above the first insulation layer, a second insulation layer above the germanium or silicon-germanium channel layer and a III-V semiconductor channel layer above the second insulation layer, wherein each fin further comprises sources, drains and a common gate of an nMOS device and a pMOS device which are separate for each fin.

19. The Si-based high-mobility CMOS device of claim 18, wherein the first and second insulation layers have been partly removed, such that the III-V semiconductor channel layer and the germanium or silicon-germanium channel layer are nanowires, and wherein the common gate completely surrounds a middle part of the nanowires.

20. The Si-based high-mobility CMOS device of claim 18, wherein each of the first and second insulation layers is a single layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The disclosure will be further elucidated by means of the following description and the appended figures.

[0023] FIGS. 1-19 show an embodiment according to the present disclosure of a method for manufacturing a Si-based high-mobility CMOS device, wherein a Ge or Si.sub.xGe.sub.1x channel layer and a III-V semiconductor channel layer are co-integrated on the same silicon substrate.

[0024] FIGS. 20 and 21 schematically show embodiments of devices obtainable with a method according to the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

[0025] The present disclosure will be described with respect to particular embodiments and with reference to certain drawings but the disclosure is not limited thereto but only by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated and not drawn on scale for illustrative purposes. The dimensions and the relative dimensions do not necessarily correspond to actual reductions to practice of the disclosure.

[0026] Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. The terms are interchangeable under appropriate circumstances and the embodiments of the disclosure can operate in other sequences than described or illustrated herein.

[0027] Moreover, the terms top, bottom, over, under and the like in the description and the claims are used for descriptive purposes and not necessarily for describing relative positions. The terms so used are interchangeable under appropriate circumstances and the embodiments of the disclosure described herein can operate in other orientations than described or illustrated herein.

[0028] Furthermore, the various embodiments are to be construed as exemplary manners in which the disclosure may be implemented rather than as limiting the scope of the disclosure.

[0029] The term comprising, used in the claims, should not be interpreted as being restricted to the elements or steps listed thereafter; it does not exclude other elements or steps. It needs to be interpreted as specifying the presence of the stated features, integers, steps or components as referred to, but does not preclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Thus, the scope of the expression a device comprising A and B should not be limited to devices consisting only of components A and B, rather with respect to the present disclosure, the only enumerated components of the device are A and B, and further the claim should be interpreted as including equivalents of those components.

[0030] Today, in order to boost electrical performances of CMOs devices at reduced power consumption, there is a desire to co-integrate high mobility channels such as Ge or Si.sub.xGe.sub.1x and III-V semiconductors on the same Silicon substrate. Herein a new integration flow is presented in order to stack Ge or Si.sub.xGe.sub.1x and III-V channels onto a Si substrate. Both n/p channels can be later on etched into different configurations: fins, sheets, wires and separated by oxide layers. The obtainable structures could drastically improve the electrostatic properties of the manufactured devices. Moreover, the stacked configuration of the device may improve the layout efficiency by having both n/p channel aligned in the vertical direction. This can be highly efficient for example for CMOS inverters and SRAM cells.

[0031] FIGS. 1-19 show an embodiment according to the present disclosure of a method for manufacturing a Si-based high-mobility CMOS device, wherein a Ge or Si.sub.xGe.sub.1x channel layer and a III-V semiconductor channel layer are co-integrated on the same silicon substrate. In each of the figures, a top view is shown on the right-hand side and a cross-section, taken along the dashed line drawn on the top view, on the left-hand side. The method comprises the following steps.

[0032] Step (1), shown in FIG. 1, comprises providing a silicon (e.g. Si(001)) substrate 1 having an insulation layer 2 (e.g. STI) on top and a trench 3 extending through the insulation layer 2 and into the silicon 1. The trench may for example be V-shaped and may for example be formed by an etch process with a wet chemical, e.g. tetramethylammonium hydroxide (TMAH).

[0033] Step (2), shown in FIG. 2, comprises depositing a first dummy layer 4 of a sacrificial material (e.g. a-Si, deposition e.g. at 540 C.) on top of the insulation layer and in the trench, planarizing the first dummy layer (e.g. by chemical-mechanical polishing, CMP) and patterning the first dummy layer to restrict it to the area shown using a dry etch (e.g. reactive ion etching, RIE).

[0034] Step (3), shown in FIG. 3, comprises depositing a first oxide layer 5 on the planarized first dummy layer 4 and over the substrate. This can for example be done with Plasma Enhanced Atomic Layer Deposition (PEALD) at 300 C.

[0035] Step (4), shown in FIG. 4, comprises creating first openings 6 in the first oxide layer 5 up to the first dummy layer 4, for example by patterning a resist 7 and oxide etching with a dry etch (e.g. RIE). The first openings 6 are offset from the trench by a predetermined distance, such that a cover part 8 of the first oxide layer remains which covers the trench 3 and extends sideways therefrom over the predetermined distance.

[0036] Step (5), shown in FIG. 5, comprises performing an etch process via the first openings 6 (e.g. removal of a-Si with wet chemical, e.g. TMAH), whereby the first dummy layer 4 is removed and the silicon substrate 1 is again exposed at the bottom of the trench 3. This creates a first cavity for growing the first channel material in the next step, which cavity extends up to the bottom of the trench, i.e. into the substrate 1, and comprises an area indicated with the dashed line on the top view on the right (corresponding to where the first dummy layer was located).

[0037] Step (6), shown in FIG. 6, comprises filling the first cavity with a III-V semiconductor material 9 (e.g. InGaAs or InP) by means of a selective area growth process (e.g. using Metal Organic Chemical Vapor Deposition, MOCVD). The cover part 8 of the first oxide layer 5 forces lateral growth. The crossing lines in the material in the trench indicate material defects, which are confined to this part of the material as a result of the forced lateral growth. Due to some overgrowth, pyramid-shaped parts 10 arise, which may be subsequently be removed by CMP.

[0038] Step (7), shown in FIG. 7, comprises depositing a second oxide layer 11 on the planarized top surface, for example with PEALD at 300 C.

[0039] Step (8), shown in FIG. 8, comprises creating a second opening 12 through the first and second oxide layers 5, 11 by patterning with resist 13 and oxide etching (e.g. RIE), the second opening 12 being located above (and aligned with) the trench 3 and extending up to the III-V semiconductor material 9.

[0040] Step (9), shown in FIG. 9, comprises removing the III-V semiconductor material above and in the trench by means of a dry etching process (e.g. RIE) via the second opening.

[0041] Step (10), shown in FIG. 10, comprises deposition of an oxide liner 14 (e.g. PEALD at 300 C.) all over the substrate. The purpose is to provide isolation at lateral sides of the III-V semiconductor material 9, which are exposed at the trench after step (9). The first oxide layer 5, the second oxide layer 11 and the oxide liner 14 together form a second insulation layer 15 in the resulting devices.

[0042] Step (11), shown in FIG. 11, comprises depositing a second dummy layer 16 of a sacrificial material (e.g. a-Si, deposition e.g. at 540 C.) above the oxide layers/second insulation layer 15 and in the trench 3, planarizing the second dummy layer (e.g. by chemical-mechanical polishing, CMP) and patterning the first dummy layer to restrict it to the area shown using a dry etch (e.g. reactive ion etching, RIE).

[0043] Step (12), shown in FIG. 12, comprises depositing a third oxide layer 17 on the planarized second dummy layer 16 and over the substrate. This can for example be done with Plasma Enhanced Atomic Layer Deposition (PEALD) at 300 C.

[0044] Steps (13)-(14), shown in FIGS. 13-14, comprise creating third openings 18 in the third oxide layer 17 up to the second dummy layer 16, for example by patterning a resist 19 and oxide etching with a dry etch (e.g. RIE). The third openings 18 are located above and offset from the trench such that cover parts 20 of the third oxide layer are left on either side of the trench. Preferably the offset third openings are aligned with the location of the first openings of step (4).

[0045] Step (15), shown in FIG. 15, comprises removing the second dummy layer 16 by etching via the third openings 18 (e.g. removal of a-Si with wet chemical, e.g. TMAH). This creates a second cavity for the second material in a following step. The cavity extends into the trench and comprises an area indicated with the dashed line on the top view on the right (corresponding to where the second dummy layer was located).

[0046] Step (16), shown in FIG. 16, comprises removing part of the oxide liner present at the bottom of the trench 3 by means of a wet etching process (e.g. TMAH) via the hole above the trench, to expose the silicon again.

[0047] Step (17), shown in FIG. 17, comprises filling the second channel space with (silicon-) germanium 21 by means of a selective area growth process, wherein the cover parts 20 of the third oxide layer force lateral growth. The crossing lines in the material in the trench indicate material defects, which are confined to this part of the material as a result of the forced lateral growth. Due to some overgrowth, pyramid-shaped parts 22 arise, which may be subsequently be removed by CMP which is step (18) shown in FIG. 18.

[0048] The structure obtained after step (18) comprises stacks on either side of the trench with III-V semiconductor 9 and (silicon-)germanium 21 channel layers stacked above each other, separated by oxide insulation layers 15, 17. By means of subsequent etching steps, these stacks can be separated and for example made into fins, see FIG. 19, following which source, drain and gate structures can be added using standard CMOS processes known to the person skilled in the art. Because, as has been described above, material defects have been confined to the trench part of the material, which is etched away, the resulting stacks are defect-free and hence can have enhanced electrical performance.

[0049] An example of a resulting device is schematically shown in FIG. 20, which shows a cross-sectional view through one of the fins 23 of the structure obtained in FIG. 19 after the further standard CMOS manufacturing steps for manufacturing source, drain and gate structures. The thus obtained device comprises a silicon substrate 1 having a first insulation layer 2 on top and a plurality of fins 23 extending upwards from the first insulation layer, each fin comprising a stack of layers of uniform thickness, wherein the stack comprises a III-V semiconductor channel layer 9 above the first insulation layer, a second insulation layer 15 above the III-V semiconductor channel layer 9 and a (silicon-) germanium channel layer 21 above the second insulation layer 15, wherein each fin further comprises sources S.sub.24, S.sub.25, drains D.sub.24, D.sub.25 and a common gate G of an nMOS device 24 and a pMOS device 25. Since the fins 23 are separate from each other as shown in FIG. 19, each fin 23 of the thus obtained device comprises an individual nMOS device 24 and an individual pMOS device 25 which are stacked above each other and which are separate from the other fins 23, i.e. separate from the stacked nMOS and pMOS devices of the other fins. This stacked configuration of the structures with individual devices in each fin can strongly improve the layout efficiency, even to such an extent that the critical dimension of the structures becomes vertical rather than horizontal.

[0050] The first and second insulation layers may each consist of a single layer or comprise or be composed of multiple layers. For example, as described above the second insulation layer may be composed of multiple layers of the same oxide, e.g. silicon oxide. However, a combination of different dielectrics may also be used in embodiments according to this disclosure.

[0051] In embodiments according to this disclosure, an example of which is shown in FIG. 21, the first and second insulation layers 2, 15, or at least parts thereof may be removed in a middle section between the end sections of the fins where the sources S.sub.24, S.sub.25 and drains D.sub.24, D.sub.25 of the nMOS and pMOS devices 24, 25 are provided. This means that in this middle section the III-V semiconductor channel layer 9 and the germanium or silicon-germanium channel layer 21 are nanowires 26. In these embodiments, the common gate G can completely surround the nanowires 26, i.e. can be wrapped around the nanowires 26. In particular, like in the embodiment shown in FIG. 21, the common gate G can completely surround a middle part of the nanowires while maintaining a separation between the gate and end sections of the fins where the sources and drains are provided, so that the common gate G can remain isolated from the sources S.sub.24, S.sub.25 and drains D.sub.24, D.sub.25. In this way, the electrostatic properties of the devices can be further enhanced, since by wrapping the gate all around the nanowire, for example, gate leakage of the majority carriers can be prevented.