Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment

Abstract

A system and method for shaping a flexible circuit (FC) having a set of conductive traces disposed within a set of insulation layers and a shaped FC, each involve using a non-conductive tool defining complimentary first and second tool portions and a shape therebetween, the tool being configured to receive a portion of the FC therebetween the first and second tool portions, a set of conductive heating elements arranged substantially in parallel with each other and disposed within the first and second tool portions, and a power source configured to provide power to the conductive heating elements causing the conductive heating elements to generate heat energy to shape the FC portion without removing any of the FC portion.

Claims

1. A flexible circuit (FC) comprising: a set of insulation layers; and a set of conductive circuit traces connected to the set of insulation layers, the set of insulation layers and the set of conductive circuit traces collectively defining a waveform cross-sectional shape of the FC, the waveform cross-sectional shape providing a desired alteration in the flexibility/rigidity of the FC along an axis of the FC.

2. The FC of claim 1, wherein the waveform cross-sectional shape is a triangular waveform shape, and wherein the triangular waveform shape increases flexibility or bendability of the FC perpendicular to a length of the FC.

3. The FC of claim 1, wherein the waveform cross-sectional shape is a sinusoidal waveform shape, and wherein the sinusoidal waveform shape increases rigidity or stiffness of the FC along a length of the FC.

4. The FC of claim 1, wherein the waveform cross-sectional shape defines a plurality of peaks and valleys.

5. The FC of claim 1, wherein a portion of a first insulation layer of the set of insulation layers is removed defining a slit therethrough.

6. The FC of claim 5, wherein a portion of a second insulation layer of the set of insulation layers is removed, the removed portion of the first insulation layer and the removed portion of the second insulation layer defining the slit.

7. The FC of claim 6, wherein the slit does not extend through an entire thickness of the second insulation layer.

8. The FC of claim 1, wherein the set of insulation layers includes a first insulation layer, a second insulation layer, and a third insulation layer, and wherein the second insulation layer is disposed between the first insulation layer and the second insulation layer.

9. The FC of claim 8, wherein the set of conductive circuit traces is disposed within the second insulation layer.

10. The FC of claim 1, wherein: the set of insulation layers includes a first layer and a second layer; the first layer comprises a first material; and the second layer comprises a second material that is different than the first material.

11. The FC of claim 1, wherein: the set of insulation layers includes a first layer and a second layer; the first layer includes a first material property; and the second layer includes a second material property that is different than the first material property.

12. The FC of claim 1, wherein the set of conductive circuit traces is disposed within the set of insulation layers.

13. The FC of claim 1, wherein the set of conductive circuit traces is disposed between the set of insulation layers.

14. The FC of claim 1, wherein: the set of insulation layers and the set of conductive circuit traces collectively define an additional cross-sectional shape of the FC; and the additional cross-sectional shape is different than the waveform cross-sectional shape.

15. The PC of claim 14, wherein: the set of insulation layers and the set of conductive circuit traces collectively define a third cross-sectional shape of the PC disposed between the additional cross-sectional shape and the waveform cross-sectional shape.

16. The PC of claim 1, wherein a portion of the set of insulation layers is removed defining a slit extending partially through the set of insulation layers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0016] FIGS. 1A-1B are an end or cross-sectional view of an example flexible circuit (FC) and a functional block diagram of an example shaping system for an unshaped FC according to some implementations of the present disclosure;

[0017] FIGS. 2A-2B are cross-sectional or end views of a pre-processed FC having a portion of the insulation layer(s) removed to further promote shaping according to some implementations of the present disclosure;

[0018] FIGS. 3A-3B are perspective and end or cross-sectional views of a tool having heating elements therein and configured for triangular waveform shaping of a portion of an FC according to some implementations of the present disclosure;

[0019] FIGS. 4A-4B are views of example FCs having triangular waveform shaped portions using the tool of FIG. 3 and routing/attachment thereof around a pole-type object according to some implementations of the present disclosure;

[0020] FIGS. 5A-5B are views of example FCs having sinusoidal waveform shaped portions according to some implementations of the present disclosure; and

[0021] FIG. 6 is a flow diagram of an example method of shaping a portion of an FC, such as by providing and using the above-mentioned shaping system and tool/heating element(s), according to some implementations of the present disclosure.

DETAILED DESCRIPTION

[0022] As previously discussed, slits in insulation material(s) between conductive circuit trace(s) of a flexible circuit (FC) can be formed to increase flexibility for routing and attachment. More specifically, FCs are often slit, cut, singulated, or otherwise separated, typically through their full or entire thickness and longitudinally, to allow FC assemblies to be easily bent, gathered, or twisted in a specific area of the FC. These conventional FC separation methods increases risk of FC damage by producing individual FC catch points and reducing the FC assembly tensile strength to a tensile strength of a single conductive circuit (plus insulation). Such slits, therefore, tend to tear further than intended over time. In addition, full singulation or separation often results in damage over time, especially after repetitive routing (e.g., during or after electrified vehicle electrical system maintenance). Thus, while these conventional FC processing systems do work well for their intended purpose, there exists an opportunity for improvement in the relevant art.

[0023] Accordingly, improved systems and methods for shaping portions of FCs are presented herein. As opposed to fully singulating or separating (e.g., cutting) the FC portion into a plurality of distinct portions each having a conductive circuit trace within insulation, the systems and methods herein utilize a unique tool having conductive heating elements therein that generate heat energy to shape the FC portion (i.e., to temporarily make the insulation layer(s) of the FC portion pliable or shapable). The resulting shaped FC does not suffer from the permanent slits/cuts of conventional techniques, which could result in further tearing and/or damage to the conductive circuit traces. The shaped FC is easily routable and attachable (e.g., bendable around a pole-type object) in a tight/crowded environment, such as an electrical system of an electrified vehicle (EV).

[0024] Referring now to FIGS. 1A-1B, an end or cross-sectional view of an example FC 100 and a functional block diagram of an example system 150 for shaping a portion of the FC 100 according to some implementations of the present disclosure are illustrated. In FIG. 1A, the FC 100 comprises a set of one or more conductive traces 108 formed of a conductive material (copper, aluminum, etc.) and arranged substantially parallel to each other lengthwise and within one or more dielectric or insulation layers 104. As shown, the FC 100 comprises two insulation layers 104a and 104b, which could be formed of different materials having different properties (flexibility, melting temperature, etc.). For example only, specific insulation materials could be chosen and subsequently laser-etched or otherwise removed as part of a pre-processing step as described more fully below. It will also be appreciated that the FC 100 could also include only a single dielectric or insulation layer 104. Each insulation layer is formed of a non-conductive laminate or thermoplastic material (e.g., a thermoplastic polymer resin), such as, but not limited to, polyethylene naphthalate (PEN) and polyethylene terephthalate (PET).

[0025] Referring now to FIG. 1B and with continued reference to FIG. 1A, the shaping process, as performed by example shaping system 150 and described more fully described below, generally involves mechanically folding or forming and materially resetting (via heat) the insulation layer(s) 104 incorporating a longitudinal or angular shape (e.g., a triangular or sinusoidal waveform) that allows the FC 100 to be collapsed or pinched in specific areas or sections without damage. The heat is applied at the bend or crease point along the length of the fold area to set the plastic and maintain the bend position during the cycle of folding or bending the FC 100. The temperature is dependent on the material(s) utilized for the insulation layer(s) 104. Thickness of material in the bend or crease may increase or decrease retention of the fold. Optionally, a cover or base film and/or an adhesive in the bend or crease could be removed without causing a cut edge in the insulation layer(s) 104 (retaining at least one layer of cover or base film to maintain FC stability). Depending on the amplitude, frequency, and angle of the fold pattern, the FC 100 can be shaped to meet in electrified vehicle routing and attachment requirements while maintaining the full strength of the FC 100.

[0026] Referring now to FIGS. 3A-3B and with continued reference to FIG. 1B, the shaping system 150 comprises a non-conductive tool 154, 300 defining complimentary first and second tool portions 304a, 304b and a shape therebetween (e.g., a triangular waveform shape 312). Again, while a triangular waveform is shown and described herein, it will be appreciated that the shaped FC could define any suitable repeating or non-repeating shape profile, such as a sinusoidal waveform. The tool 154, 300 is configured to receive a portion of the unshaped or pre-processed FC therebetween the first and second tool portions. In one exemplary implementation, a clamp configuration is provided where the first and second tool portions 304a, 304b are connected by a living hinge 316 to provide clearance in a vertical direction 320 for insertion of the FC 100 therebetween. It will be appreciated that the tool 154, 300 could provide another suitable means for receiving the FC 100, such as insertion via an end and pressure/rolling the FC 100 therebetween the first and second tool portions 304a, 304b.

[0027] The tool 154 also comprises a set of conductive heating elements 158, 308a, 308b arranged substantially in parallel with each other and disposed within the first and second tool portions 304a, 304b. The heating elements 158, 304a, 304b are selectively powered by current from a power source 162, such as a battery or battery system. In some implementations, the power source 162 is a battery/battery system such that the shaping system 150 is mobile (e.g., a handheld unit), which could be preferable due to increased flexibility for installation. It will be appreciated that the power source 162 could also be a stationary power source, such as a traditional wall outlet. In some implementations, the shaping system 150 further comprises an output device 170 configured to generate an output (audio, visual, tactile, or some combination thereof) indicative of a status. For example, the output device 170 could illuminate a light and/or produce an audible noise when the shaping process is complete (e.g., when the conductive heating elements 158, 304a, 304b have received power for a sufficiently long period).

[0028] Referring now to FIGS. 2A-2B and with continued reference to the FIGS. discussed above, the shaping system 150 could optionally include or be associated with a laser processing or pre-processing system 166. This laser processing system 166 could be optionally used for laser processing of the unshaped FC prior to its insertion/shaping by the shaping system 150. For example, a top portion 204a (e.g., a slit) of both first and second insulation layers 104a, 104b could be removed by the laser processing system 166 and the shaped or pre-processed FC 200a could then be fed to the shaping system 150. Alternatively, for example, a bottom portion 204b (e.g., a slit) of both the first and second insulation layers 104a, 104b could be removed by laser processing system 166 and the shaped or pre-processed FC 200b could then be fed to the shaping system 150. This optional pre-processing could further assist in the formation/shaping of the FC 100, such as, for example only, FCs 100 having thicker or multiple insulation layers 104.

[0029] Referring now to FIGS. 4A-4B and with continued reference to FIGS. 3A-3B, views of an example FC 400 having triangular waveform shaped portions using the tool of FIGS. 3A-3B according to some implementations of the present disclosure are illustrated. As previously discussed, one potential shape is a triangular waveform shape defining a series of peaks and valleys relative to the first and second tool portions 304a, 304b. As shown in FIG. 3A, each conductive heating element 308a, 308b is substantially aligned with a respective peak-valley pair in one of the first and second tool portions 304a, 304b corresponding to a peak side of the respective peak-valley pair. In some implementations, some conductive heating elements 304a, 304b of the set of conductive heating elements 158 have different lengths such that the shaping achieves different widths of bends/folds in at least some of the set of insulation layers. In addition, only a portion of the length of the FC could be shaped/processed as shown in FIGS. 4A-4B. Of the entire FC 400, a first portion 404 is not processed/shaped and a second portion 408 is processed/shaped, with a transitional or bunched portion 412 therebetween. For example, only a portion of the FC 400 could be processed/shaped at a desired length point relative to an installation or routing feature, such as a pole-shaped object 420 as shown in FIG. 4B. As can be seen, the processed/shaped portion 408 easily bends around the pole-shaped object 420 at length point 416 to mitigate or prevent damage to the FC 400 (e.g., increased flexibility or bendability in the x-direction).

[0030] Referring now to FIGS. 5A-5B and with continued reference to the previous FIGS., views of another example FC 500 having sinusoidal waveform shaped portions 504 using a different (but similar) tool as shown in FIGS. 3A-3B according to some implementations of the present disclosure are illustrated. The tool (not shown) to form/shape the sinusoidal waveform shape 504 as shown would be similar to FIGS. 3A-3B but would be sinusoidal rather than triangular, with, for example, conductive heating elements arranged in similar locations along the waveform shape 504 (e.g., peaks/valleys). As shown in FIG. 5A, multiple insulation layers 508a, 508b are formed/shaped based on this waveform shape 504. One primary benefit or purpose of the configuration of FC 500 (longitudinally extending sinusoidal or wavy undulations) is the stiffening of the FC 500, 520 along its length (e.g., z-direction) or in specific sections 524 along its length (see FIG. 5B, with intermediate/transitionary bunched portion 528). While a regular/repeating sinusoidal waveform shape is illustrated, it will be appreciated that any suitable wavy undulating shape could be utilized to achieve the desired stiffening.

[0031] Referring now to FIG. 6, a flow diagram of an example method 600 of shaping a portion of an FC using a system or tool/heating element(s) according to some implementations of the present disclosure is illustrated. At 604, an FC is provided with conductive trace(s) disposed between dielectric or insulation layer(s). At 608, optional laser preprocessing is performed to remove portion(s) of the insulation layer(s) to further promote or assist with the subsequent processing/shaping. At 612, a non-conductive tool defining a shape (triangular, sinusoidal, etc.) is provided. At 616, conductive heating element(s) are provided, such as within portions of the tool. At 620, a power source (stationary or mobile, such as a battery pack/system) is provided to selectively power the heating element(s). At 624, the FC is positioned within or relative to the tool and subsequently shaped by temporarily powering the heating element(s) using the powers source (e.g., until an end/complete indication is output or generated by an output device). At 628, the final processed/shaped FC is removed from the tool and then routed/attached in a desired environment, such as bending around a pole-type object in a vehicle electrical system. The method 600 then ends or returns to 604 for one or more additional cycles.

[0032] Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known procedures, well-known device structures, and well-known technologies are not described in detail.

[0033] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms a, an, and the may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The term and/or includes any and all combinations of one or more of the associated listed items. The terms comprises, comprising, including, and having, are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

[0034] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as first, second, and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0035] Some portions of the above description present the techniques described herein in terms of algorithms and symbolic representations of operations on information. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. These operations, while described functionally or logically, are understood to be implemented by computer programs. Furthermore, it has also proven convenient at times to refer to these arrangements of operations as modules or by functional names, without loss of generality.

[0036] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

[0037] The term non-transitory computer-readable medium does not encompass transitory electrical or electromagnetic signals propagating through a medium (such as on a carrier wave). Non-limiting examples of a non-transitory computer-readable medium are nonvolatile memory circuits (such as a flash memory circuit, an erasable programmable read-only memory circuit, or a mask read-only memory circuit), volatile memory circuits (such as a static random access memory circuit or a dynamic random access memory circuit), magnetic storage media (such as an analog or digital magnetic tape or a hard disk drive), and optical storage media (such as a CD, a DVD, or a Blu-ray Disc).

[0038] The term set generally means a grouping of one or more elements. The elements of a set do not necessarily need to have any characteristics in common or otherwise belong together. The phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean at least one of A, at least one of B, and at least one of C. The phrase at least one of A, B, or C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR.