LED PUMPED LASER DEVICE AND METHOD OF USE
20170149197 ยท 2017-05-25
Assignee
Inventors
Cpc classification
H01S3/093
ELECTRICITY
H01S3/0912
ELECTRICITY
International classification
Abstract
The present invention provides an apparatus and method for pumping solid-state lasers and amplifiers. More specifically, to a method and apparatus for pumping solid-state lasers and amplifiers using Light Emitting Diode (LED) arrays. In one embodiment, the apparatus comprises a gain medium, a plurality of LEDs in optical communication with the gain medium to excite the gain medium, the plurality of LEDs arranged in an LED array, a driving circuit to energize the LED array, and a thermoelectric cooler to reduce the temperature of the LED array, wherein the gain medium is pumped by the LED array to emit a laser light.
Claims
1. A solid-state laser device, comprising: a solid state gain medium; a plurality of LEDs in optical communication with the solid state gain medium to excite the solid-state gain medium, the plurality of LEDs arranged in an LED array comprising at least one row of LEDs, the LED array spaced a predetermined distance from the solid state gain medium; a driving circuit to energize the LED array; and a cooler to reduce the temperature of the LED array; wherein the solid state gain medium is pumped by the LED array to emit a laser light.
2. The device of claim 1, wherein the solid-state gain medium comprises active ions selected from the group consisting of Ce.sup.(+3), Nd.sup.(+3), Ce.sup.(+3 ), Yb.sup.(+3), Ce.sup.(+3), Er.sup.(+3), Pr.sup.(+3), Ti.sup.(+3), and Cr.sup.(+3).
3. The device of claim 1, wherein the LED array comprises semi-polar LEDs.
4. The device of claim 1, wherein the LED array further comprises a plurality of columns of LEDs.
5. The device of claim 1, further comprising a cryogenically-cooled amplifier module.
6. The device of claim 1, wherein the driving circuit outputs square electrical current pulses to energize the LED array.
7. The device of claim 1, wherein the cooler is mounted to a back surface of the LED array.
8. The device of claim 1, wherein the cooler is a microchannel cooling device interconnected to a rear surface of the LED array.
9. The device of claim 1, wherein the plurality of LEDs emit linearly polarized light.
10. The device of claim 1, wherein the solid state gain medium is positioned within a prism.
11. The device of claim 10, wherein the LED array is positioned proximate to a first side of the prism.
12. An LED pumped laser system comprising: a solid-state gain medium with active ions which are selected from the group consisting of Ce.sup.(+3), Nd.sup.(+3), Ce.sup.(+3), Yb.sup.(+3), Ce.sup.(+3), Er.sup.(+3), Pr.sup.(+3), Ti.sup.(+3) and Cr.sup.(+3); a plurality of LEDs arranged in a 2-dimensional planar LED array in optical communication with the gain medium to excite the gain medium; a driving circuit devoid of flash lamps to energize the LED array; a cooler to reduce the temperature of the LED array, the cooler comprising at least one of a thermoelectric cooler and a microchannel cooler; wherein the LEDs emit linearly polarized light; and wherein the gain medium is pumped by the LED array to emit a laser light.
13. The system of claim 12, further comprising a cryogenically-cooled amplifier module.
14. The system of claim 12, wherein the driving circuit outputs square electrical current pulses to energize the LED array.
15. The system of claim 14, wherein the cooler is mounted to a back surface of the LED array.
16. The system of claim 12, wherein a front surface of the LED array is positioned proximate to a first side of a prism that contains the gain medium.
17-20. (canceled)
21. The device of claim 1, wherein the solid-state gain medium comprises a glass material doped with Titanium.sup.+3.
22. The device of claim 11, wherein light emitted by the LED array is reflected from a second side and a third side of the prism to illuminate the solid-state gain medium from all sides.
23. The device of claim 12, wherein the gain medium comprises a glass material.
24. The device of claim 16, wherein the gain medium is arranged generally perpendicular to a base of the prism such that light emitted by the LED array is reflected inwardly from a second side and a third side of the prism to illuminate the gain medium.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0054] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the general description of the invention given above, and the detailed description of the drawings given below, serve to explain the principals of this invention.
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[0080] It should be understood that the drawings are not necessarily to scale. In certain instances, details that are not necessary for an understanding of the invention or that render other details difficult to perceive may have been omitted. It should be understood, of course, that the invention is not necessarily limited to the particular embodiments illustrated herein.
DETAILED DESCRIPTION
[0081]
[0082] In one embodiment, the gain medium 140 is Ce.sup.(3+):Nd.sup.(3+):YAG, so as to include cerium.sup.(3+) ions as a sensitizer for pumping the neodymium.sup.(3+) ions, with absorption in the blue. The absorption by the cerium.sup.(3+) can be quite strong, and the non-radiative cooperative energy transfer to the Nd.sup.(3+) ions is fast and efficient. The relatively long (230 us) lifetime of the metastable state in Nd allows for energy accumulation and storage, while the moderate value for the saturation fluence (0.3 J/cm.sup.2) results in reasonable gain without requiring large stored energy density. To demonstrate the feasibility of using LED arrays to transversely pump lasers, a Ce.sup.(3+):Nd.sup.(3+):YAG crystal was pumped with 450 nm LEDs. This arrangement shows that the LEDs can be driven with sufficiently high output to achieve lasing.
[0083] Generally, the rare earths included in the gain medium are in the 3+valance state.
[0084] In one embodiment, the LED arrays 112 used are commercially-available, produced by Shenzhen Hanhua Opto Co. (HH-100WB3HB1010-M) operating at 450 nm and rated for 45% EQE with a 45W output with 3.4 A delivered to the array. The array 112 consists of 1.1 mm square emitters arranged in a 2424 mm array. Electrically, the LED elements 110 are ten (10) columns in parallel, each column consisting of 10 LEDs in series. Therefore the rated operating current density is approximately 30 A/cm.sup.2.
[0085] In one embodiment, the driving circuit 120 was developed to deliver square current pulses to the array 112. Since driving the array 112 at high current leads to a strong thermal load, a thermoelectric (TE) cooler 130 was added to the back of the array 112. The TE module was water-cooled on the warm side. To reduce the thermal load further, the driving circuit 120 pulsed at 200 s and at a low duty cycle, typically 1-10%. An integrating sphere with a calibrated Si photodiode power meter was used to measure the average optical power as the pulse current was varied. The current was measured by recording the voltage across a 0.01 current-limiting resistor in series with the array. The plot shows that the LED array operates at close to the rated 45% EQE but at higher currents the yield droops. See
[0086] For this embodiment of the array 112, increasing the current density by a factor of about 17 drops the efficiency to 62% of its initial value. Even with the drop in EQE at high current density, the useful output energy is increased by over 10 times by using pulsed operation (46 mJ). Extrapolating to a higher current density of 1000 A/cm.sup.2, the EQE for this array would drop to around 14.5%. At this high current density the drop in efficiency would approximately balance the increased current and the total useful energy output would not be significantly higher. Semipolar LEDs have demonstrated EQE up to 50% for current densities of 1000 A/cm.sup.2. This would represent about 162 mJ of useful energy from this array.
[0087] In one embodiment, two arrays 112 are placed at a distance of approximately 4 mm from the 3 mm50 mm rod on opposing sides. A semi-confocal cavity with a high reflector of 500 mm radius and a flat output coupler (5% transmission) are placed on either side of the rod. The rod was supported by holes in an enclosing aluminum chamber, but was uncooled. An alignment laser was used to verify the alignment of the rod and mirrors. Lasing action was observed with a photodiode (See
[0088] These experiments demonstrate the feasibility of using LED arrays to pump solid state lasers. In another embodiment, direct LED pumping of Ti.sup.(3+):sapphire lasers and amplifiers is disclosed.
Pulsed LED Operational Characteristics.
[0089] The majority of the testing of LEDs has been under high-current continuous operation. The transient behavior of the LEDs is particularly important for operation for laser pumping. Because the efficiency drops at high current, driving with an approximately rectangular current pulse allows for a greater output energy than, for example, the critically-damped current pulse that is produced by a pulse forming network that drives a flashlamp. In one embodiment, individual LED emitters are mounted into custom arrays, comprising series and parallel operations.
[0090] Extracting heat from the LEDs is critical for high repetition rate operation. For example, consider an LED with an EQE of 45% operated at a current density of 1000 A/cm.sup.2. With a bandgap of 2.75 eV, and a 40% duty cycle the nominal heat load directly at the LED will be 660 W/cm.sup.2. This is in the range of heat load that may be addressed with microchannel/microfluiding cooling methods. In one embodiment, liquid and 2-phase microchannel cooling techniques are used to manage the heat load. The transient electrical and optical measurements help indicate whether rapid heating during the pulse contributes to the droop in the EQE. A thermal infrared camera may be used to assist in locating local hot spots. A design challenge for laser systems pumped with laser diode bars is that because they use edge emission, the microchannel cooling direction must be oriented perpendicular to the output direction of the pump light. For LEDs, the emission from the surface allows heat extraction around the periphery, which in turn allows for a higher packing density. The current arrays in one embodiment have an element size of 1.1 mm square, and are mounted with a 21% fill factor. In another embodiment, interconnects are modified to increase the fill factor by at least a factor of 2.
[0091] For pumping gain media with a short lifetime, the thermal limitations may be pushed into a different regime. Willert and co-workers explored the operation of LEDs with 1 us duration pulses with a 1% duty cycle. They tested the light output as the peak current was varied up to current densities of 1300 A/cm2. Red LEDs from Philips showed efficiency droop, but there was no sign of damage even at 2200 A/cm2. The maximum peak current was a factor of over 30 times the rated current, indicating that there is substantial room for working with high peak current if the average current is kept to within the rated value. The limits of high peak power operation is a function of the pulse duration and temperature. Operating at high peak current during a 3 us duration is critical for the success of LED pumping of Ti:sapphire.
[0092] Optical design: coupling of LED light to the gain media.
[0093] While LEDs can be efficient for optical emission and can support high current density, the diffuse output of the LEDs presents a challenge for getting this light into the gain medium. The system must not only couple the optical power into the crystal, it also must provide a means for cooling both the crystal and the LEDs.
[0094] Optical configurations for LED pumping.
[0095] The broad angular emission from the LEDs must be managed.
[0096] Two more rod-based pumping schemes that borrow from dye laser amplifier systems are illustrated in
[0097] A third set of pumping schemes is illustrated in
[0098] To analyze these pumping schemes, one may make use of the Zemax ray-tracing package, which can perform sequential and non-sequential tracing with optimization. Existing codes compute the saturated energy extraction for cylindrically symmetric pump and amplified beam distributions. A more general code allows for arbitrary 3D stored energy distributions, and other shapes of input laser beams. The gain modeling may be coupled with the propagation of the seed laser beam in the amplifier or oscillator resonator system, to account for gain guiding and thermal lensing effects on the amplified beam. The Comsol Multiphysics finite-element program may be used to assist in the modeling of the thermal loading of the crystal, as well as for the microchannel cooling designs. See
Estimates for Candidate Gain Media for LED Pumping
[0099] LEDs have a great potential for high energy output considering the cost that will continue to be driven lower by the immense market for efficient lighting. Embodiments of the invention use various gain media, and may be evaluated via the data with respect to LED operation at high current and short pulses. Seed lasers may be used to measure small signal gain, and either simple lasers (for the Ce:Nd:YAG crystal) or amplifiers designed and tested to evaluate the capabilities for energy extraction.
Ce:Nd:YAG
[0100] The co-doped gain material in a valance +3 state has a large absorption coefficient (>3/cm) for pump light at 445 nm, enabling relatively small rod diameters and higher gains. Note that this co-doped combination is not limited to the host crystal YAG; other host media are, including but not limited to, vanadate (YVO4), YLF (yttrium aluminum fluoride), and various formulations of glass. In one embodiment, a single 1.2 mm.sup.2 area LED with 50% EQE at 1000 A/cm.sup.2, the energy that can be emitted during the 230 s lifetime of the Nd excited state is approximately 3.7 mJ. Consider a close-coupling geometry using a rod 3 mm in diameter and an array surrounding the rod on a 5 mm diameter circle, using arrays with an element size of 1.1 mm square mounted with a 21% fill factor. The number of LED elements would be approximately 100, delivering a total energy per pulse of 366 mJ. With an estimated pump transfer efficiency of 50%, 50% efficiency for extracting the stored energy and accounting for the Stokes shift (445/1064=0.42), the estimated output energy would be approximately 38 mJ. The estimated small-signal gain under these conditions would be 44/pass. Since this is likely too large for hold-off by a Q-switch, the same pump energy deposited into a larger diameter may be used. With sufficient cooling (the LEDs can be operated at high duty cycle) and a Q-switched and intracavity- doubled laser built around a pump head of this type would be very competitive with existing commercial lamp- and CW diode-pumped lasers (e.g. Quantronix, Photonics Industries, Coherent).
Ce:Yb:YAG, Ce:Er:YAG
[0101] Cerium 3+ ions can also be co-doped with ytterbium and erbium, in YAG or other host media as noted above. Yb has its primary lasing band at approximately 1030 nm and Er lases near 1550 nm. Both gain media have gain over a sufficient bandwidth to support lasing and amplification of ultrashort pulses in the 100-200 fs duration range. The distinctive advantage of these two gain media is that the excitation of the Ce ions by the blue pump light is sufficiently high to simultaneously excite two neighboring gain atoms (Yb or Er). This process is known as upconversion and has been considered for solar applications. In the context of laser pumping, the capability of obtaining two excited atoms for one pump photon dramatically increases the gain and efficiency of the system. Yb and Er have long fluorescence lifetimes (approximately 2 ms and 9 ms, respectively), so they can effectively store pump energy, increasing the gain along with the output energy. The doping concentrations can be much higher than for Nd systems, which are more affected by quenching of the excited state with concentrations greater than 1%.
Alexandrite
[0102] This crystal, which can support the amplification of broadband pulses has historically been superseded by Ti.sup.(3+):sapphire, which has a broader bandwidth and a lower saturation fluence. Nevertheless, along the b-axis, the crystal can amplify over the 710-800 nm range. The absorption in this biaxial crystal depends strongly on the crystal axis (See
[0103] Alexandrite has a relatively long fluorescence time (270 s), approximately 85 that of Ti:sapphire. The large saturation fluence for the broadband transition (20 J/cm.sup.2) is close to or beyond the damage limit for pulsed operation (especially for stretched pulses <1 ns). Therefore careful amplifier design is necessary to obtain good energy extraction. With a 6.25 mm diameter by 100 mm long rod, a dense array with a 50% fill factor and 50% optical coupling efficiency can store up to 1.1 J of energy. Owing to the large saturation fluence, the small signal single-pass gain would be approximately 1.2 per pass. While this gain is low, it is sufficient for regenerative amplification which would be able to efficiently extract the stored energy. The gain for alexandrite increases when it is operated at elevated temperature. The alexandrite gain module uses seed pulses from a Ti.sup.(3+):sapphire oscillator.
Praseodymium-Doped Materials
[0104] Pr 3+ ions are well-suited to pumping by blue pump sources (see
Ti:Sapphire
[0105] The absorption spectrum of Ti.sup.(3+):sapphire is shown in
[0106] In one embodiment, LEDs are operated at a current density of 5000 A/cm.sup.2 for a 3 s duration and 3 kHz repetition rate. With a 5 mm square rod, 50 mm in length, pumped on 3 sides (a combination of both schemes shown in
[0107] In one embodiment, performance of the LED-pumped laser device is increased by operation at cryogenic temperatures. In one embodiment, Cree Direct-Attach DA1000 LEDs, which use a bondpad-down architecture to mitigate resistance at the metallization attachment to the LED, are used. In another embodiment, new generation nanowire LEDs, such as those made by the Swedish company Glo, are used. Such nanowire LEDs are highly efficient because of the absence of impurities in the nanowires.
[0108] In one embodiment, a cryogenically-cooled amplifier module in which both the LED arrays and Ti.sup.(+3):sapphire crystal are operated near liquid nitrogen temperature is employed. This amplifier uses seed pulses from an existing kHz repetition rate ultrafast Ti:sapphire system.
[0109] In one embodiment, the LED-pumped laser device employs other gain media known to those skilled in the art, comprising Nd:Cr:GSGG, Nd:YVO4, Nd:GdVO4, Nd:KGW, Cr:Sapphire (a.k.a Ruby), Cr:LiSAF, Cr:YAG, Cr:Forsterite, Er:YLF, and Nd:glass, as well as other solid state materials that exhibit a spontaneous emission of photons as a result of a population inversion initiated by gain medium excitement with absorption-matching incoherent monochromatic sources such as arrays of LEDs.
[0110] A purpose of the invention is to replace the conventional flash lamp or flash lamps with LED's and LED arrays. Standard flash lamp drivers use a combination of Resistance (R), Inductance (L), and Capacitance (C) to control the pulse current to the flash lamp. One skilled in the art understands that with flash lamp technology, one has to be careful in applying high current suddenly to the flash lamp. If the impulse current is too large or too fast the flash lamp may explode or reduce the flash lamp life. Because the flash lamp is based on a gaseous plasma, one cannot get a fast rise time of light without special flash lamp designs and circuitry, thereby significantly increasing the system cost.
[0111] In the invention, the high intensity flash lamps are replaced with very high intensity LEDs that are being driven by a programmable pulse current generator.
[0112] In the prior art, such as U.S. Par. No. 7,522,651 to Luo, conventional LEDs and electrical drives are employed. For example, typically linear arrays of 1n LEDs are used, resulting in optical droop increasing as the current is increased (See
[0113] In contrast, the invention provides a superior way of pumping by eliminating the optical droop. This entails making the LED array nm or a 2-dimensional array.
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[0115] The conventional prior art does not address pumping at various vibronic gain crystals; the prior art does not realize that the vibronic gain crystals are polarization sensitive. Therefore, if one pumps with the current flash lamp or current LEDs, the incoherent pump light is unpolarized and 50% of the light is not being used as for pumping. In contrast, the invention utilizes high power LEDs that are linearly polarized, which, by generating linear polarized light from the LED's themselves, all or most of the LED pump light is available to excite the vibronic gain crystals, such as Ti:Sapphire.
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[0117] In one embodiment, a novel glass material is used in the device 100. The glass material eliminates or mitigates polarization issues and also solves the thermo-mechanical issues that have plagued glass lasers from operating at high rep rates. The glass is doped with Ti(III)(+3) ions and has a longer lifetime than Ti(III):Sapphire and almost twice the emission cross section. The lifetime increases from 3.6 microseconds in Sapphire to 170 microseconds in glass at 300K and improves further, at 77K liquid nitrogen temperatures, to 2 milliseconds. This is very important because it reduces the pump energy requirements by almost two orders at room temperature and 3 to 4 orders at liquid nitrogen temperature. The emission wavelength shifts blue-wards by about 190 nm so as to lase at 600 nm-800 nm instead of the 800 nm-1000 nm. Furthermore, the absorption in the blue is near UV, thus improved pumping is achieved. Also, because of the glass containment, no polarization sensitivity is present and thermo-mechanical properties much like sapphire are achieved, thereby allowing running at high energy high rep rates that may be tunable to allow generation of ultra short laser pulses.
[0118] It should, however, be appreciated that the present disclosure may be practiced in a variety of ways beyond the specific detail set forth herein. Furthermore, while the exemplary aspects, embodiments, options, and/or configurations illustrated herein show the various components of the system collocated, certain components of the system can be located remotely, at distant portions of a distributed network, such as a LAN and/or the Internet, or within a dedicated system. Thus, it should be appreciated, that the components of the system can be combined in to one or more devices, such as a Personal Computer (PC), laptop, netbook, smart phone, Personal Digital Assistant (PDA), tablet, etc., or collocated on a particular node of a distributed network, such as an analog and/or digital telecommunications network, a packet-switch network, or a circuit-switched network. It will be appreciated from the preceding description, and for reasons of computational efficiency, that the components of the system can be arranged at any location within a distributed network of components without affecting the operation of the system. For example, the various components can be located in a switch such as a PBX and media server, gateway, in one or more communications devices, at one or more users' premises, or some combination thereof. Similarly, one or more functional portions of the system could be distributed between a telecommunications device(s) and an associated computing device.
[0119] Furthermore, it should be appreciated that the various links connecting the elements can be wired or wireless links, or any combination thereof, or any other known or later developed element(s) that is capable of supplying and/or communicating data to and from the connected elements. These wired or wireless links can also be secure links and may be capable of communicating encrypted information. Transmission media used as links, for example, can be any suitable carrier for electrical signals, including coaxial cables, copper wire and fiber optics, and may take the form of acoustic or light waves, such as those generated during radio-wave and infra-red data communications.
[0120] Optionally, the systems and methods of this disclosure can be implemented in conjunction with a special purpose computer, a programmed microprocessor or microcontroller and peripheral integrated circuit element(s), an ASIC or other integrated circuit, a digital signal processor, a hard-wired electronic or logic circuit such as discrete element circuit, a programmable logic device or gate array such as PLD, PLA, FPGA, PAL, special purpose computer, any comparable means, or the like. In general, any device(s) or means capable of implementing the methodology illustrated herein can be used to implement the various aspects of this disclosure. Exemplary hardware that can be used for the disclosed embodiments, configurations and aspects includes computers, handheld devices, telephones (e.g., cellular, Internet enabled, digital, analog, hybrids, and others), and other hardware known in the art. Some of these devices include processors (e.g., a single or multiple microprocessors), memory, nonvolatile storage, input devices, and output devices. Furthermore, alternative software implementations including, but not limited to, distributed processing or component/object distributed processing, parallel processing, or virtual machine processing can also be constructed to implement the methods described herein.
[0121] In yet another embodiment, the disclosed methods may be readily implemented in conjunction with software using object or object-oriented software development environments that provide portable source code that can be used on a variety of computer or workstation platforms. Alternatively, the disclosed system may be implemented partially or fully in hardware using standard logic circuits or VLSI design. Whether software or hardware is used to implement the systems in accordance with this disclosure is dependent on the speed and/or efficiency requirements of the system, the particular function, and the particular software or hardware systems or microprocessor or microcomputer systems being utilized.
[0122] In yet another embodiment, the disclosed methods may be partially implemented in software that can be stored on a storage medium, executed on programmed general-purpose computer with the cooperation of a controller and memory, a special purpose computer, a microprocessor, or the like. In these instances, the systems and methods of this disclosure can be implemented as program embedded on personal computer such as an applet, JAVA or CGI script, as a resource residing on a server or computer workstation, as a routine embedded in a dedicated measurement system, system component, or the like. The system can also be implemented by physically incorporating the system and/or method into a software and/or hardware system.
[0123] Although the present disclosure describes components and functions implemented in the aspects, embodiments, and/or configurations with reference to particular standards and protocols, the aspects, embodiments, and/or configurations are not limited to such standards and protocols. Other similar standards and protocols not mentioned herein are in existence and are considered to be included in the present disclosure. Moreover, the standards and protocols mentioned herein and other similar standards and protocols not mentioned herein are periodically superseded by faster or more effective equivalents having essentially the same functions. Such replacement standards and protocols having the same functions are considered equivalents included in the present disclosure.
[0124] The present disclosure, in various aspects, embodiments, and/or configurations, includes components, methods, processes, systems and/or apparatus substantially as depicted and described herein, including various aspects, embodiments, configurations embodiments, sub-combinations, and/or subsets thereof. Those of skill in the art will understand how to make and use the disclosed aspects, embodiments, and/or configurations after understanding the present disclosure. The present disclosure, in various aspects, embodiments, and/or configurations, includes providing devices and processes in the absence of items not depicted and/or described herein or in various aspects, embodiments, and/or configurations hereof, including in the absence of such items as may have been used in previous devices or processes, e.g., for improving performance, achieving ease and\or reducing cost of implementation.
[0125] The foregoing discussion has been presented for purposes of illustration and description. The foregoing is not intended to limit the disclosure to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the disclosure are grouped together in one or more aspects, embodiments, and/or configurations for the purpose of streamlining the disclosure. The features of the aspects, embodiments, and/or configurations of the disclosure may be combined in alternate aspects, embodiments, and/or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the claims require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed aspect, embodiment, and/or configuration. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate preferred embodiment of the disclosure.
[0126] Moreover, though the description has included description of one or more aspects, embodiments, and/or configurations and certain variations and modifications, other variations, combinations, and modifications are within the scope of the disclosure, e.g., as may be within the skill and knowledge of those in the art, after understanding the present disclosure. It is intended to obtain rights which include alternative aspects, embodiments, and/or configurations to the extent permitted, including alternate, interchangeable and/or equivalent structures, functions, ranges or steps to those claimed, whether or not such alternate, interchangeable and/or equivalent structures, functions, ranges or steps are disclosed herein, and without intending to publicly dedicate any patentable subject matter. Examples of the processors as described herein may include, but are not limited to, at least one of Qualcomm Snapdragon 800 and 801, Qualcomm Snapdragon 610 and 615 with 4G LTE Integration and 64-bit computing, Apple A7 processor with 64-bit architecture, Apple M7 motion coprocessors, Samsung Exynos series, the Intel Core family of processors, the Intel Xeon family of processors, the Intel Atom family of processors, the Intel Itanium family of processors, Intel Core i5-4670K and i7-4770K 22 nm Haswell, Intel Core i5-3570K 22 nm Ivy Bridge, the AMD FX family of processors, AMD FX-4300, FX-6300, and FX-8350 32 nm Vishera, AMD Kaveri processors, Texas Instruments Jacinto C6000 automotive infotainment processors, Texas Instruments OMAP automotive-grade mobile processors, ARM Cortex-M processors, ARM Cortex-A and ARM926EJ-S processors, other industry-equivalent processors, and may perform computational functions using any known or future-developed standard, instruction set, libraries, and/or architecture.