SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE

Abstract

The present disclosure relates to a solid-state imaging element and an electronic device capable of effectively inhibiting occurrence of reflection and diffraction of light on a light incident surface. A fine uneven structure including a recess and a protrusion is formed with a predetermined pitch on a light incident surface of a semiconductor layer in which photoelectric conversion sections are formed for a plurality of pixels; and an antireflective film is laminated on the fine uneven structure, the antireflective film being formed with a film thickness different for each color of light received by each of the pixels. The pitch of one of the recess and protrusion formed in the fine uneven structure is generally identical in all the pixels, and is 100 nm or less. The present technology is applicable, for example, to a solid-state imaging element.

Claims

1. A solid-state imaging element comprising: a fine uneven structure comprising a recess and a protrusion which are formed with a predetermined pitch on a light incident surface of a semiconductor layer in which photoelectric conversion sections are formed for a plurality of pixels; and an antireflective film laminated on the fine uneven structure, the antireflective film being formed with a film thickness different for each color of light received by each of the pixels.

2. The solid-state imaging element according to claim 1, wherein the pitch of one of the recess and the protrusion formed in the fine uneven structure is generally identical in all the pixels.

3. The solid-state imaging element according to claim 1, wherein the pitch of the recess and the protrusion formed in the fine uneven structure is 100 nm or less.

4. The solid-state imaging element according to claim 1, further comprising an inter-pixel light-shielding section having a light-shielding property provided between the adjacent photoelectric conversion sections in the semiconductor substrate.

5. An electronic device comprising a solid-state imaging element comprising: a fine uneven structure comprising a recess and a protrusion which are formed with a predetermined pitch on a light incident surface of a semiconductor layer in which photoelectric conversion sections are formed for a plurality of pixels; and an antireflective film laminated on the fine uneven structure, the antireflective film being formed in film thickness different for each color of light received by each of the pixels.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0020] FIG. 1 is a block diagram illustrating an exemplary configuration of a first embodiment of a solid-state imaging element to which the present technology is applied.

[0021] FIG. 2 is a diagram illustrating an exemplary cross-sectional structure of the solid-state imaging element.

[0022] FIG. 3 is an enlarged view illustrating a light incident surface of a semiconductor substrate for each pixel.

[0023] FIG. 4 is a diagram illustrating transmission diffraction efficiency in an antireflective structure.

[0024] FIG. 5 is a diagram illustrating diffracted light.

[0025] FIG. 6 is a diagram illustrating a relationship between reflectance and wavelength.

[0026] FIG. 7 is a diagram illustrating the relationship between reflectance and wavelength.

[0027] FIG. 8 is a diagram illustrating the relationship between reflectance and wavelength.

[0028] FIG. 9 is a diagram illustrating an exemplary structure of a second embodiment of the solid-state imaging element to which the present technology is applied.

[0029] FIG. 10 is a block diagram illustrating an exemplary configuration of an imaging device mounted in an electronic device.

MODE FOR CARRYING OUT THE INVENTION

[0030] Hereinafter, specific embodiments to which the present technology is applied will be described in detail with reference to the drawings.

[0031] FIG. 1 is a block diagram illustrating an exemplary configuration of a first embodiment of a solid-state imaging element to which the present technology is applied.

[0032] In FIG. 1, a solid-state imaging element 11 includes a pixel region 12, a vertical drive circuit 13, column signal processing circuits 14, a horizontal drive circuit 15, an output circuit 16, and a control circuit 17.

[0033] The pixel region 12 includes a plurality of pixels 18 arranged in an array; each of the pixels 18 is connected to the vertical drive circuit 13 via a horizontal signal line, and connected to each of the column signal processing circuits 14 via a vertical signal line. The plurality of pixels 18 each output a pixel signal in response to light quantity of light applied via an unillustrated optical system, and from these pixel signals, an image of a subject focused on the pixel region 12 is constructed.

[0034] The vertical drive circuit 13 supplies, for each row of the plurality of pixels 18 arranged in the pixel region 12, a drive signal for driving (transferring, selecting, resetting, etc.) each pixel 18 to the pixel 18 via the horizontal signal line. The column signal processing circuit 14 performs analog-to-digital conversion on an image signal and removes reset noise by applying correlated double sampling (CDS) processing to the pixel signal that is output from each of the plurality of pixels 18 via the vertical signal line.

[0035] The horizontal drive circuit 15 supplies, to the column signal processing circuit 14, a drive signal for causing the column signal processing circuit 14 to output the pixel signal for each column of the plurality of pixels 18 arranged in the pixel region 12. The output circuit 16 amplifies the pixel signal supplied from the column signal processing circuit 14 at timing in response to the drive signal from the horizontal drive circuit 15, and then outputs the pixel signal to a downstream image processing circuit.

[0036] The control circuit 17 controls drive of each block within the solid-state imaging element 11. For example, the control circuit 17 generates a clock signal according to a driving cycle of each block, and supplies the clock signal to each block.

[0037] Next, FIG. 2 is a diagram illustrating a cross-sectional exemplary structure of the solid-state imaging element 11.

[0038] As illustrated in FIG. 2, in the solid-state imaging element 11, a semiconductor substrate 21, an insulator film 22, a color filter layer 23, and an on-chip lens layer 24 are laminated, and FIG. 2 illustrates a cross-section of three pixels 18-1 to 18-3.

[0039] The semiconductor substrate 21 is, for example, a silicon wafer (Si) obtained by thinly slicing a single crystal of high purity silicon, and photoelectric conversion sections 31-1 to 31-3 that convert incident light into an electric charge by photoelectric conversion and accumulate the electric charge are formed in the pixels 18-1 to 18-3, respectively.

[0040] The insulator film 22 is formed, for example, by forming a film of a material that transmits light and has insulation properties, for example, silicon dioxide (SiO.sub.2). The insulator film 22 insulates a surface of the semiconductor substrate 21.

[0041] In the color filter layer 23, filters 32 that transmit light of predetermined colors are arranged in respective pixels 18, and for example, the filters 32 that transmit light of three primary colors (red, green, and blue) are arranged according to a so-called Bayer array. For example, as illustrated, the filter 32-1 that transmits light of red (R) is arranged in the pixel 18-1, the filter 32-2 that transmits light of green (G) is arranged in the pixel 18-2, and the filter 32-3 that transmits light of blue (B) is arranged in the pixel 18-3.

[0042] In the on-chip lens layer 24, on-chip lenses 33 that concentrate light in the photoelectric conversion sections 31 are arranged in respective pixels 18, and as illustrated, the on-chip lenses 33-1 to 33-3 are arranged in the pixels 18-1 to 18-3, respectively.

[0043] The solid-state imaging element 11 is structured in this way. Light that enters the solid-state imaging element 11 from an upper side of FIG. 2 is concentrated on the on-chip lens 33 in each pixel 18, and is then separated into each color by the filter 32. Then, in each pixel 18, light that is transmitted through the insulator film 22 and enters the semiconductor substrate 21 undergoes photoelectric conversion in the photoelectric conversion section 31. Here, a surface on a side on which light enters the solid-state imaging element 11 (an upper surface in FIG. 2) is hereinafter referred to as a light incident surface as needed. Also, an antireflective structure for preventing reflection of incident light that enters the semiconductor substrate 21 is formed on the light incident surface of the semiconductor substrate 21.

[0044] With reference to FIG. 3, the antireflective structure formed on the light incident surface of the semiconductor substrate 21 will be described.

[0045] A of FIG. 3 is an enlarged view of the light incident surface of the semiconductor substrate 21 of the pixel 18-1, B of FIG. 3 is an enlarged view of the light incident surface of the semiconductor substrate 21 of the pixel 18-2, and C of FIG. 3 is an enlarged view of the light incident surface of the semiconductor substrate 21 of the pixel 18-3.

[0046] As illustrated in FIG. 3, an antireflective structure 41 of the solid-state imaging element 11 includes a fine uneven structure 42 (so-called moth-eye structure) formed on the light incident surface of the semiconductor substrate 21, and a dielectric multilayer film 43 laminated on the fine uneven structure 41.

[0047] The fine uneven structure 42 has an uneven structure that includes a fine recess and protrusion which are each formed with a generally identical pitch and depth in the pixel 18-1, pixel 18-2, and pixel 18-3. For example, the fine uneven structure 42 is treated so that a recessed quadrangular pyramid shape is formed by using crystal anisotropy of the semiconductor substrate 21, and is formed so that the pitch of the uneven structure is 100 nm or less and a height of the uneven structure is 71 nm or less. Note that the pitch of the uneven structure may be 200 nm or less, for example, and is more preferably 100 nm or less.

[0048] Also, in plan view of the solid-state imaging element 11, the fine uneven structure 42 is formed in the pixel region 12 in which the pixels 18 are formed (FIG. 1). Also, in plan view of each pixel 18, the fine uneven structure 42 is formed in a region including at least a range in which the photoelectric conversion section 31 is provided. Note that by forming the fine uneven structure 42 by using crystal anisotropy of the semiconductor substrate 21, damage of treatment can be inhibited.

[0049] The dielectric multilayer film 43 is an antireflective film formed on the fine uneven structure 42 (light incident surface of the semiconductor substrate 21) so as to have structures each different in the pixel 18-1, the pixel 18-2, and the pixel 18-3, the antireflective film being for preventing reflection of the incident light. For example, a hafnium oxide film 44 and a tantalum oxide film 45, which have negative fixed electric charge, are laminated to form the dielectric multilayer film 43. Then, the dielectric multilayer film 43 is formed so that a film thickness differs for each pixel 18-1, pixel 18-2, and pixel 18-3, that is, for each color of light received by each pixel.

[0050] For example, the film thicknesses of the hafnium oxide film 44-1 and the tantalum oxide film 45-1 are determined so that the dielectric multilayer film 43-1 is structured to best prevent reflection of red light that is transmitted through the filter 32-1. Similarly, the film thicknesses of the hafnium oxide film 44-2 and the tantalum oxide film 45-2 are determined so that the dielectric multilayer film 43-2 is structured to best prevent reflection of green light that is transmitted through the filter 32-2. Also, the film thicknesses of the hafnium oxide film 44-3 and the tantalum oxide film 45-3 are determined so that the dielectric multilayer film 43-3 is structured to best prevent reflection of blue light that is transmitted through the filter 32-3. Note that these structures are determined by calculating an effective refractive-index distribution in a depth direction preferred to reduce reflectance under a constraint of the fine uneven structure 42 by using reflectance according to a desired wavelength band for each of the pixel 18-1, pixel 18-2 and pixel 18-3 as an evaluation function. For example, the film thicknesses of the hafnium oxide film 44 and the tantalum oxide film 45 are determined so that the films are each formed with a thickness of 5 to 100 nm.

[0051] Thus, the antireflective structure 41 is formed in the solid-state imaging element 11 by forming the fine uneven structure 42 on the light incident surface of the semiconductor substrate 21 and by forming the dielectric multilayer film 43 with a film thickness of an appropriate interference condition for each color received by the pixel 18. This enables effective inhibition of occurrence of reflection and diffraction of light on the light incident surface of the semiconductor substrate 21. Therefore, degradation in sensitivity, occurrence of a color mixture, and the like caused by reflection or diffraction of light on the light incident surface of the semiconductor substrate 21 can be avoided, and degradation in image quality of an image captured by the solid-state imaging element 11 can be avoided.

[0052] Also, for example, as compared with a structure in which the dielectric multilayer film is laminated on a flatly formed light incident surface of the semiconductor substrate, the solid-state imaging element 11 allows about single-digit decrease of reflection of light on the light incident surface of the semiconductor substrate 21 (for example, inhibition of reflectance to about 1.16%). Furthermore, since the solid-state imaging element 11 has the fine uneven structure 42 with the pitch generally identical in all the pixels 18, for example, as compared with a structure in which the pitch of the fine uneven structure differs for each pixel (for example, the structure of the aforementioned Patent Literature 1), a process of treatment of the fine uneven structure 42 can be simplified.

[0053] Also, it is not necessary to form a high-aspect-ratio structure in the solid-state imaging element 11, and a feasible structure enables achievement of both diffraction prevention and low reflection. Furthermore, the solid-state imaging element 11 allows setting of the film thickness of the dielectric multilayer film 43 adaptively for the color of light received by the pixel 18, and thus allows achievement of spectrum improvement for each color.

[0054] Note that a shape of the protrusion (projection) that constitutes the fine uneven structure 42 may be, for example, a shape in which a cross-sectional shape in a surface which is orthogonal to the light incident surface of the semiconductor substrate 21 decreases or increases continuously toward inside from an incidence side, or discretely at several nanometers to tens of nanometers. That is, for example, as the shape of protrusion, a forward pyramid shape, an inverse pyramid shape, a bell shape, an inverse bell shape, and the like can be used. Also, for example, either one of a shape in which adjacent protrusions are in contact with each other, and a shape in which adjacent protrusions are not in contact with each other (a shape having a flat surface between the protrusions) may be used. Also, a cross-sectional shape of the protrusion in a surface parallel with the light incident surface of the semiconductor substrate 21 may be a rectangular shape, circular shape, or any other arbitrary shape, which allows effective antireflection.

[0055] Note that in addition to hafnium oxide (HfO.sub.2) and tantalum oxide (Ta.sub.2Os), examples of material that can be used for a material that constitutes the dielectric multilayer film 43 include: silicon nitride (SiN), aluminum oxide (Al.sub.2O.sub.3), zirconium oxide (ZrO.sub.2), titanium oxide (TiO.sub.2), lanthanum oxide (La.sub.2O.sub.3), praseodymium oxide (Pr.sub.2O.sub.3), cerium oxide (CeO.sub.2), neodymium oxide (Nd.sub.2O.sub.3), promethium oxide (Pm.sub.2O.sub.3), samarium oxide (Sm.sub.2O.sub.3), europium oxide (Eu.sub.2O.sub.3), gadolinium oxide (Gd.sub.2O.sub.3), terbium oxide (Tb.sub.2O.sub.3), dysprosium oxide (Dy.sub.2O.sub.3), holmium oxide (Ho.sub.2O.sub.3), thulium oxide (Tm.sub.2O.sub.3), ytterbium oxide (Yb.sub.2O.sub.3), lutetium oxide (Lu.sub.2O.sub.3), and yttrium oxide (Y.sub.2O.sub.3). Also, a single-layer dielectric film may be used if the single-layer dielectric film has a function as an antireflective film in a similar manner to the dielectric multilayer film 43.

[0056] Next, with reference to FIG. 4, transmission diffraction efficiency in the antireflective structure 41 will be described. In FIG. 4, a vertical axis represents the transmission diffraction efficiency whereas a horizontal axis represents a wavelength of incident light.

[0057] FIG. 4 illustrates the transmission diffraction efficiency with respect to the wavelength of incident light when light enters perpendicularly to the solid-state imaging element 11 for each pitch of the antireflective structure 41 (50 nm, 100 nm, 150 nm, 200 nm, and 250 nm). Also, the transmission diffraction efficiency represents a proportion of light which is transmitted while being diffracted by the antireflective structure 41 (light that is transmitted with an angle with respect to the incident light) in all the incident light which perpendicularly enters the light incident surface of the semiconductor substrate 21 and is transmitted through the antireflective structure 41.

[0058] That is, as illustrated in FIG. 5, when the incident light perpendicularly enters the light incident surface of the semiconductor substrate 21, the diffracted light is light that is transmitted while being diffracted by the antireflective structure 41 other than zero-order light that is transmitted through the antireflective structure 41 perpendicularly. Therefore, a total amount of the diffracted light is obtained by subtracting light quantity of the zero-order light that is transmitted through the antireflective structure 41 perpendicularly from the light quantity of all the light that is transmitted through the antireflective structure 41. Note that the light quantity of each order and the light quantity at each angle are different from each other.

[0059] As illustrated in FIG. 4, when the pitch of the antireflective structure 41 is larger than 100 nm, considerable light quantity is transmitted while being diffracted, and when the pitch is 100 nm or less, occurrence of the diffracted light is mostly avoided. Therefore, by making the pitch of the antireflective structure 41 equal to or less than 100 nm, occurrence of diffraction on the light incident surface of the semiconductor substrate 21 can be prevented securely, and a color mixture can be prevented.

[0060] Next, with reference to FIG. 6 to FIG. 8, wavelength dependence of reflectance of the antireflective structure 41 will be described.

[0061] FIG. 6 illustrates reflectance in a flat structure in which the light incident surface of the semiconductor substrate is flatly formed as in the conventional solid-state imaging element, and reflectance in the structure in which the fine uneven structure 42 is formed on the light incident surface of the semiconductor substrate 21 as in the solid-state imaging element 11. Note that comparison is made on an assumption that the structure of the dielectric multilayer film laminated on the light incident surface of the flat structure is identical to the structure of the dielectric multilayer film laminated in the fine uneven structure 42.

[0062] As illustrated in FIG. 6, in the structure in which the fine uneven structure 42 is formed on the light incident surface of the semiconductor substrate 21, reflectance can be reduced in light of all the wavelengths, as compared with the flat structure in which the light incident surface of the semiconductor substrate is formed flatly.

[0063] FIG. 7 illustrates, in the flat structure in which the light incident surface of the semiconductor substrate is flatly formed as in the conventional solid-state imaging element, reflectance in the structure in which the structure of the dielectric multilayer film is different for each pixel color as in the dielectric multilayer films 43-1 to 43-3 of FIG. 3.

[0064] As illustrated in FIG. 7, in the green pixel, the dielectric multilayer film is formed so that reflectance of about 550-nm light becomes lowest. Similarly, in the red pixel, the dielectric multilayer film is formed so that reflectance of about 650-nm light becomes lowest, and in the blue pixel, the dielectric multilayer film is formed so that reflectance of about 450-nm light becomes lowest.

[0065] Also, reflectance of the solid-state imaging element as a whole is a combination of the lowest values of reflectance of green, red, and blue. As illustrated, for example, in a wavelength range of from 400 nm to 700 nm, reflectance has relatively flat values of about 2%, achieving spectrum improvement for each color. Therefore, for example, even for the flat structure in which the light incident surface of the semiconductor substrate is formed flatly, by making the structure of the dielectric multilayer film different for each pixel color, reflectance can be reduced more than in a case where the structure of the dielectric multilayer film is identical in all the pixels. Note that because of the flat structure in which the light incident surface of the semiconductor substrate is formed flatly, occurrence of light diffraction can be inhibited theoretically, and since a process for treatment of the fine uneven structure is unnecessary, the structure can be formed relatively simply.

[0066] FIG. 8 illustrates, in the structure in which the fine uneven structure 42 is formed on the light incident surface of the semiconductor substrate 21 as in the solid-state imaging element 11, reflectance in the structure in which the structure of the dielectric multilayer film 43 is different for each pixel color.

[0067] As illustrated in FIG. 8, in the green pixel, the dielectric multilayer film 43 is formed so that reflectance of about 530-nm light becomes lowest. Similarly, in the red pixel, the dielectric multilayer film 43 is formed so that reflectance of about 650-nm light becomes lowest, and in the blue pixel, the dielectric multilayer film 43 is formed so that reflectance of about 400-nm light becomes lowest.

[0068] Also, reflectance of the solid-state imaging element 11 as a whole is a combination of the lowest values of reflectance of green, red, and blue. As illustrated, for example, in the wavelength range of from 400 nm to 700 nm, reflectance has relatively flat values of about 0.5%, achieving spectrum improvement for each color.

[0069] Thus, by providing the fine uneven structure 42 on the light incident surface of the semiconductor substrate 21 and making the structure of the dielectric multilayer film 43 different for each pixel color, the solid-state imaging element 11 can inhibit reflectance significantly as compared with the flat structure illustrated in FIG. 7.

[0070] Next, FIG. 9 is a diagram illustrating an exemplary structure of a second embodiment of the solid-state imaging element to which the present technology is applied. In a solid-state imaging element 11A illustrated in FIG. 9, detailed description of the structure that is common to the solid-state imaging element 11 of FIG. 2 will be omitted.

[0071] That is, the solid-state imaging element 11A and the solid-state imaging element 11 of FIG. 2 have common structures in which the semiconductor substrate 21, the insulator film 22, the color filter layer 23, and the on-chip lens layer 24 are laminated, and the photoelectric conversion section 31, the filter 32, and the on-chip lens 33 are formed for each pixel 18. Also, although unillustrated in FIG. 9, in the solid-state imaging element 11A, the fine uneven structure 42 is formed on the light incident surface of the semiconductor substrate 21, and the antireflective structure 41 is provided in which the dielectric multilayer film 43 having the structure different for each pixel 18 is formed, as illustrated in FIG. 3.

[0072] Also, in the solid-state imaging element 11A, an inter-pixel light-shielding section 51 having light-shielding properties is formed between the photoelectric conversion sections 31 in the semiconductor substrate 21 so as to separate the adjacent pixels 18. That is, as illustrated in FIG. 9, the inter-pixel light-shielding section 51-1 is formed between the photoelectric conversion section 31-1 and the photoelectric conversion section 31-2, and the inter-pixel light-shielding section 51-2 is formed between the photoelectric conversion section 31-2 and the photoelectric conversion section 31-3.

[0073] The inter-pixel light-shielding section 51 is formed by, for example, embedding a light-shielding metal (for example, tungsten) in a trench dug into the semiconductor substrate 21. Thus, by providing the inter-pixel light-shielding section 51, mixing of light from the adjacent pixel 18 can be prevented securely, and occurrence of a color mixture can be avoided.

[0074] Note that since design flexibility of the antireflective structure 41 increases by providing the inter-pixel light-shielding section 51, for example, even if the pitch of the fine uneven structure 42 is made larger than 100 nm which results in occurrence of diffracted light, mixing of the diffracted light into the adjacent photoelectric conversion section 31 can be prevented. That is, in the solid-state imaging element 11A, the pitch of the fine uneven structure 42 is not limited to 100 nm or less. This allows further inhibition of light reflection by the antireflective structure 41.

[0075] Note that the present technology is applicable to both a front surface irradiation type solid-state imaging element in which a front surface of a semiconductor substrate on which transistor elements or the like are formed is irradiated with incident light, and a back surface irradiation type solid-state imaging element in which a back surface, which is a surface opposite to the front surface, is irradiated with incident light. Also, the present technology is applicable to the solid-state imaging element of both a CMOS image sensor and a CCD.

[0076] Note that the solid-state imaging element 11 of each of the above-described embodiments is applicable to various electronic devices, for example, an imaging system, such as a digital still camera and a digital camcorder, a portable telephone having an imaging function, or other devices having an imaging function.

[0077] FIG. 10 is a block diagram illustrating an exemplary configuration of an imaging device mounted in an electronic device.

[0078] As illustrated in FIG. 10, the imaging device 101 includes an optical system 102, an imaging element 103, a signal processing circuit 104, a monitor 105, and a memory 106, capable of capturing static images and moving images.

[0079] The optical system 102 includes one or more lenses, guides image light (incident light) from a subject to the imaging element 103, and then forms an image in a sensor unit of the imaging element 103.

[0080] The solid-state imaging element 11 of each of the above-described embodiments is applied to the imaging element 103. In the imaging element 103, electrons are accumulated for a certain period of time in response to the image formed on the light incident surface via the optical system 102. Then, a signal in response to the electrons accumulated in the imaging element 103 is supplied to the signal processing circuit 104.

[0081] The signal processing circuit 104 applies various types of signal processing to a pixel signal that is output from the imaging element 103. An image (image data) obtained by the signal processing circuit 104 applying signal processing is supplied to the monitor 105 for display, or is supplied to the memory 106 for storage (recording).

[0082] Application of the solid-state imaging element 11 of each of the above-described embodiments allows the imaging device 101 configured in this way, for example, to prevent degradation in image quality caused by occurrence of diffraction on the light incident surface, to achieve low reflection on the light incident surface, and to capture higher-quality images.

[0083] Note that the present technology can have the following structures as well.

(1)

[0084] A solid-state imaging element including:

[0085] a fine uneven structure including a recess and a protrusion which are formed with a predetermined pitch on a light incident surface of a semiconductor layer in which photoelectric conversion sections are formed for a plurality of pixels; and

[0086] an antireflective film laminated on the fine uneven structure, the antireflective film being formed with a film thickness different for each color of light received by each of the pixels.

(2)

[0087] The solid-state imaging element according to (1), wherein the pitch of one of the recess and the protrusion formed in the fine uneven structure is generally identical in all the pixels.

(3)

[0088] The solid-state imaging element according to (1) or (2), wherein the pitch of the recess and the protrusion formed in the fine uneven structure is 100 nm or less.

(4)

[0089] The solid-state imaging element according to any of (1) to (3), further including an inter-pixel light-shielding section having a light-shielding property provided between the adjacent photoelectric conversion sections in the semiconductor substrate.

(5)

[0090] An electronic device including a solid-state imaging element including:

[0091] a fine uneven structure including a recess and a protrusion which are formed with a predetermined pitch on a light incident surface of a semiconductor layer in which photoelectric conversion sections are formed for a plurality of pixels; and

[0092] an antireflective film laminated on the fine uneven structure, the antireflective film being formed in film thickness different for each color of light received by each of the pixels.

[0093] Note that the present embodiment is not limited to the above-described embodiments, and various changes may be made without departing from the spirit of the present disclosure.

REFERENCE SIGNS LIST

[0094] 11 Solid-state imaging element [0095] 12 Pixel region [0096] 13 Vertical drive circuit [0097] 14 Column signal processing circuit [0098] 15 Horizontal drive circuit [0099] 16 Output circuit [0100] 17 Control circuit [0101] 18 Pixel [0102] 21 Semiconductor substrate [0103] 22 Insulator film [0104] 23 Color filter layer [0105] 24 On-chip lens layer [0106] 31 Photoelectric conversion section [0107] 32 Filter [0108] 33 On-chip lens [0109] 41 Antireflective structure [0110] 42 Fine uneven structure [0111] 43 Dielectric multilayer film [0112] 44 Hafnium oxide film [0113] 45 Tantalum oxide film [0114] 51 Pixel separation section