TEXTILE MOTHERBOARD, HAVING A MODULAR AND INTERCHANGEABLE DESIGN, FOR MONITORING, REPORTING AND CONTROLLING

Abstract

The present invention concerns a textile motherboard (TMB) that incorporates at least a central processing unit (CPU) or a peripheral or a combination thereof. The textile of the garment is utilized as substrate to conform the TMB. The TMB may exhibit multiple-layer structures, VIAs, and routings composed of textile material capable of transmitting signals between CPU and a means to register information, or between the CPU and the combination of peripherals, which are incorporated into the TMB by using known textile manipulation techniques. Every component is modular and interchangeable and connects to the TMB utilizing textile connectors.

Claims

1-14. (canceled)

15. A textile motherboard that consists of at least one textile substrate layer, on which at least one textile peripheral and one interchangeable central processing unit are incorporated, wherein the at least one textile peripheral comprises regions of null conductivity and regions of maximum conductivity; the textile motherboard additionally consists of at least one textile peripheral configured as a first logic gate interconnected to another textile peripheral configured as a second logic gate; each of the peripherals is conformed of at least one pole and one throw, and the peripherals are configured such that the central processing unit may determine which peripheral has been activated by a user.

16. Textile motherboard according to claim 15, wherein both the number and interconnections of textile peripherals are based on combinational logic.

17. Textile motherboard according to claim 15, wherein the textile peripherals are textile switches.

18. Textile motherboard according to claim 16, wherein the number of textile switches is selected by employing the expression 2{circumflex over (0)}N1, where N is the number of available inputs, as well as the number of poles and throws.

19. Textile motherboard according to claim 18, wherein the regions of maximum conductivity of the textile switch correspond to the perforations of an isolating substrate.

20. Textile motherboard according to claim 19, wherein the regions of maximum conductivity are arranged following specific patterns.

21. A system to stimulate learning that consists of a textile motherboard according to claim 15, a textile intercommunications module, and an electronic device configured to receive signals coming from the textile motherboard, when the latter is operated by a user.

22. System according to claim 21, wherein the textile motherboard is incorporated into a garment and the switches enable the command of the device.

23. A system to monitor that consists of a textile motherboard according to claim 15, wherein the substrate is configured as a garment or a bedroom textile or a bed linen.

24. A textile switch that consists of at least one conductive textile substrate material and an isolating substrate material, wherein the isolating material incorporates patterns to enable regions of maximum conductivity and regions of null conductivity, incorporates at least one pole and one throw, and may be configured as a logical gate.

25. Textile switch according to claim 24, wherein the conductive substrate and the regions of maximum conductivity of the isolating substrate coincide in number.

26. Textile switch according to claim 25, wherein the textile switch incorporates an additional conductive substrate.

27. Textile switch according to claim 26, wherein the isolating substrate is placed between the conductive substrates.

28. Textile switch according to claim 27, wherein the first substrate incorporates more than one conductive region.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0029] FIG. 1A.Shows a design of a plausible embodiment of a single-layer textile motherboard (TMB);

[0030] FIG. 1B.Depicts the cross section of a plausible embodiment of a multiple-layer textile motherboard wherein the use of VIAs for the interconnection between the multiple layers is highlighted;

[0031] FIG. 2A.Illustrates the utilization of textile materials to conform a TMB, such as the embodiment depicted in FIG. 1A;

[0032] FIG. 2B.Shows the cross section of an embodiment of a multiple-layer textile motherboard wherein the layers are incorporated into the front- and back-parts of the textile, and are isolated in the middle part;

[0033] FIG. 2C.Depicts the implementation of X-Y routing in a textile garment, assuming that the routing is performed on the top layer of the motherboard;

[0034] FIG. 3.Shows a layout embodiment of an intelligent vest with exchangeable input and output devices;

[0035] FIG. 4.Illustrates the employment of conventional textile connectors that facilitate the modular and exchangeable design;

[0036] FIG. 5.Depicts an embodiment in the form of an intelligent tablecloth, which enables the user to manipulate objects of interest, such as the lights of a public establishment, after selecting a (textile) menu of options;

[0037] FIG. 6.Illustrates a 1-pole and 1-throw textile switch, which may function as a peripheral of the TMB;

[0038] FIG. 6A.Depicts an isolating layer with uniform pattern for the exemplary textile switch shown in FIG. 6, the switch exhibits a uniform active area;

[0039] FIG. 7.Illustrates a 1-pole and 2-throws textile switch, which may function as a peripheral of the TMB;

[0040] FIG. 7A.Shows an isolating layer with a divided pattern for the exemplary textile switch depicted in FIG. 7, the switch exhibits two individual active areas;

[0041] FIG. 8.Illustrates a 1-pole and 3-throws textile switch, which may function as a peripheral of the TMB;

[0042] FIG. 8A.Depicts an isolating layer with three sections for the exemplary textile switch shown in FIG. 8, the switch exhibits three active sections;

[0043] FIG. 9.Shows the design of a TMB for a learning stimulation garment for infants, the TMB incorporates textile logic gates to enable combinational logic;

[0044] FIG. 10.Illustrates the implementation of a communications module socket based on the TMB;

[0045] FIG. 11A.Depicts a connector socket or a socket to connect peripherals within a TMB, the shown connectors are snaps, known in the art of textile manipulation;

[0046] FIG. 11B.Shows a connector socket or a socket to connect peripherals within a TMB, the depicted connectors are hooks, known in the art of textile manipulation;

[0047] FIG. 11C.Depicts a connector socket or a socket to connect peripherals within a TMB, the shown connectors are hook and loop systems, such as Velcro, known in the art of textile manipulation;

[0048] FIG. 12.Depicts the implementation of contact zones or pads conformed of textile material, the pads are employed to join components, such as snaps or pins, with the buses or routings of the TMB;

[0049] FIG. 13.Illustrates the TMB design of a temperature monitoring bracelet, the TMB includes a 2-poles and 2-throws switch implemented with hook and loop connectors, such as Velcro;

[0050] FIG. 14.Depicts the design of a TMB for a battery holder, which may function as an individual or embedded TMB peripheral;

[0051] FIG. 15.Illustrates the TMB design for the monitoring of bedroom textiles or linens, such as a bedcover or a bed sheet or a bed mattress, the TMB may incorporate textile logic gates to enable combinational logic for the detection of fluids or presence;

[0052] FIG. 16.Shows the design of a TMB for an infant garment that may monitor humidity or temperature or movement.

DETAILED DESCRIPTION OF THE INVENTION

[0053] The present disclosure relates to an apparatus that may be employed in garments, blankets, towels, tablecloths, gowns, etc., which may consist of a first element (100), a second element (200), a third element (300), a fourth element (400) and a fifth element (500).

[0054] The first element (100) consists of a textile motherboard (100), TMB. The design of the TMB is modular and permits to interchange elements within the TMB. The TMB utilizes connectors to incorporate exemplary components such as central processing units (102) or peripherals (103).

[0055] An exemplary embodiment of the present disclosure of the TMB (100) is depicted in FIG. 1A. According to this exemplary embodiment, the TMB (100) consists of at least one substrate layer, with at least one conductive routing (101), and at least one terminal connected to the at least one conductive routing wherein exemplary components, such as a CPU (102) or a peripheral (103) or a combination thereof, may be installed.

[0056] The TMB (100) defines an electronic or a photonic circuit, which is a function of the arrangement of peripherals (103) and CPU (102) utilized, wherewith information may be monitored, manipulated, as well as emitted with the object of signalizing, or informing, or controlling depending on the intended purpose of the product that incorporates the TMB.

[0057] In FIG. 1B, an exemplary embodiment of the TMB is shown to exhibit a multiple-layer structure (104) in addition to perforations for the interconnection between layers (109, 110, 111); known as Vertical interconnect Accesses or VIAs to those skilled in the art.

[0058] A first exemplary layer (105) may serve as a platform to guide a first digital or analog signal. A second exemplary layer (106) may serve as a platform to guide a second digital or analog signal. A third exemplary layer (107) may serve as a platform to provide a constant electric or photonic signal. A fourth exemplary layer (108) may serve as a platform to provide a reference.

[0059] The foregoing descriptions of the third and fourth exemplary layers could for instance provide +5V and 0V signals, respectively. The aforementioned layers may be employed repetitively, as deemed necessary by a design. This layer structure is illustrative and does not limit the embodiments of a particular TMB.

[0060] According to the exemplary embodiment of the present disclosure shown in FIG. 1B, layer interconnection ensues by utilizing perforations (109, 110, 111) or Vertical Interconnect Accesses, known as VIAs to those skilled in the art. A first exemplary VIA that can be employed is the tag VIA (109). A second exemplary VIA that may be utilized is the thru VIA (110). A third exemplary VIA that can be used is the sequential VIA (111). Additional exemplary VIAs that may be employed include photo-defined, controlled depth, or buried VIAs. This list of VIAs is illustrative and does not limit the embodiments of a particular TMB.

[0061] The second element (200) consists of textile material with the capacity to transmit and isolate digital- and/or analog-electric and/or photonic signals, or a combination thereof. In FIG. 2A an exemplary embodiment of a TMB substrate, which is conformed of textile material, is depicted. In such exemplary substrate (100), routing structures (200) may be incorporated to guide signals to and from components (201)

[0062] The routing structures (200) within the TMB (100) may consist of electric textile conductors, a textile arrangement that incorporates fiber optics or waveguides, as well as printed or stamped textiles with the conductive routing.

[0063] An exemplary TMB may consist of knitted or weaved textiles, such as those known in the art., which define a substrate layer (100), and wherein conductive textiles (200) may be intercalated appropriately, in order to define the intended routings for the circuit. Exemplary conductive textiles (200) may extend from a terminal up to a CPU (201) or may exhibit a desired extension for a specific function, thus defining a determined conductive routing.

[0064] According to the exemplary embodiment of the present disclosure shown in FIG. 2B, a TMB may implement multiple textile structures, such as knitted or weaved textiles, as well as stampings or printings that serve as layers (104), and that define independent conductive routings (202, 203, 204, 205), wherein isolating layers may be superposed in order to avoid interference between routings, and wherein the interconnection between the different conductive routings may be done by means of textile VIAs (206)

[0065] According to one exemplary embodiment of the present disclosure, a TMB may incorporate a substrate layer (100) that simultaneously functions as an isolating layer. Moreover, the configuration of knitted or weaved textiles, stampings, or printings (200), which define the conductive routings, may be placed adjacent one to the other in a single plane, separated by isolating layers. According to still another exemplary embodiment of the TMB, a configuration of knitted or weaved textiles, stampings, or printings (104), which define the conductive routings, may be placed superposed (202, 203, 204, 05) in an alternating manner with isolating layers.

[0066] Exemplary interconnections between knitted or weaved textiles localized in a single layer can be implemented by employing other knitted or weaved textiles, which define the aforementioned exemplary interconnections. Exemplary interconnections between printings localized in a single layer can be implemented by employing other printings, which define the aforementioned exemplary interconnections. Exemplary interconnections between stampings localized in a single layer can be implemented by employing other stampings, which define the aforementioned exemplary interconnections.

[0067] Exemplary interconnections between knitted or weaved textiles localized in multiple layers can be implemented by employing other knitted or weaved textiles, which define the aforementioned exemplary interconnections. Exemplary interconnections between printings localized in multiple layers can be implemented by employing other printings, which define the aforementioned exemplary interconnections. Exemplary interconnections between stampings localized in multiple layers can be implemented by employing other stampings, which define the aforementioned exemplary interconnections.

[0068] The exemplary conductive routings (200), layers (202, 203, 204, 205), and VIAs (206) are conformed of textile material and are implemented by employing textile manipulation techniques. A first layer (202) may be incorporated into the front section of a textile. A second layer (203) and a third layer (204) may be isolated. A fourth layer (205) may be incorporated into the back section of a textile. Moreover, each of the first (202), second (203), third (204), and fourth (205) layers may be conformed by utilizing individual textiles.

[0069] The exemplary conductive routings (200), layers (202, 203, 204, 205), and VIAs (206) of a TMB (100) may be implemented by employing known textile manipulation techniques such as knitting, weaving, stamping, perforating, or may also be printed on the textiles.

[0070] The exemplary embodiment of the present disclosure shown in FIG. 2C depicts the routing of a TMB (100). The routing of a TMB (100) includes at least two different types of routings: maze routing and X-Y routing (207). Both routing types may be implemented in a TMB (100), for instance by utilizing textile printing techniques or by incorporating the routes by following a required pattern using textile manipulation techniques. The routing guides the signals between the CPU (208) and a means to register information (209) or between the CPU and the combination of peripherals (209).

[0071] The third element (300), fourth element (400), and fifth element (500) consist of a CPU (300), input peripherals (400), and output peripherals (500) connected to a TMB (100), which are shown in an exemplary embodiment in FIG. 3. Such exemplary embodiment of a TMB (100) may be characterized by allowing the interchange of CPU (300) or peripheral elements (400, 500), in order to monitor different variables, signalize, inform, or control. In this exemplary embodiment, TMB (100), routing (200), CPU (300), and peripherals (400, 500) are washable.

[0072] Exemplary CPU (300) and peripherals (400, 500) may be mounted on textile boards, as well as rigid or flexible printed circuit boards PCBs. Each exemplary board may incorporate discrete electronic elements (such as resistors, integrated circuits, capacitors, etc.) or discrete photonic elements (such as Bragg gratings, beam dividers, interferometers, etc.)

[0073] An exemplary CPU (300) may consist of a photonic or an electronic device that processes signals sent by the peripheral elements, and sends information by employing appropriate peripheral elements. Exemplary CPUs (300) may include a microcontroller or a microprocessor or a comparable element.

[0074] The CPU (300) connects with the peripherals (400, 500) employing the textile routing (200). The TMB (100) peripherals (400, 500) may be broadly classified as input (400) and output (500) devices.

[0075] Exemplary input peripherals (400) consist of elements such as photonic transducers or electronic transducers or combinations thereof. Therefore, exemplary input peripherals (400) may include capacitive sensors or temperature sensors or accelerometers or respiratory frequency sensors or humidity sensors or magnetometers or chest expansion sensors or gyroscopes or pulse sensors or muscular activity sensors or similar devices.

[0076] Exemplary output peripherals (500) may include elements like textile transducers or a screen or a vibration device or an audible device or an illuminating device or a device capable of emitting information or a memory module or a serial communications module or a radio frequency communications module (using Zigbee technology, Bluetooth, etc.) or a Wi-Fi communications module or similar devices.

[0077] In order to yield flexibility, the TMB (100) incorporates terminals, in the CPU (600) and peripherals (601), which simplify the modular and interchangeable design by employing conventional textile connectors such as snaps, hooks and eyes, hooks and loops (Velcro), or similar elements. This aspect of the invention is illustrated in the exemplary embodiment of FIG. 4.

[0078] Furthermore, the exemplary terminals exhibit appropriate characteristics in order to be able to interchange the CPU (600) or the peripheral elements (601) to monitor different variables, signalize, inform, or control.

[0079] Each terminal is adhered to a determined routing, by using textile manipulation techniques, which enables the conduction of signals between elements of a TMB. For instance, an exemplary terminal in the form of a snap (601) may be sewed to the corresponding routing (602) to facilitate the communication between a peripheral (601) and a CPU (600).

[0080] A final exemplary embodiment of the present disclosure, shown in FIG. 5, depicts a TMB (100), including routing (200), CPU (300), input (400), and output (500) peripherals to enable a user to manipulate objects of interest, such as the lights of a public establishment, after selecting a (textile) menu of options.

[0081] The foregoing merely illustrates the principles of the disclosure. Various modifications and alterations to the described embodiments will be apparent to those skilled in the art in view of the teachings herein.

PREFERRED APPROACHES TO IMPLEMENT THE INVENTION

[0082] By utilizing a textile motherboard (TMB) conformed of specific CPU and peripherals, a garment may be able to monitor, inform, and control. For instance, an intelligent textile in the form of a gown with a peripheral, periodically scanned by a CPU, may be utilized to monitor temperature and inform about the presence/absence of fever, and may control with a button the call for assistance. Moreover, due to the modular and interchangeable design, the input peripheral may, for instance, be changed from a temperature detector to a pulse detector.

[0083] By employing a determined arrangement of TMB, CPU, and peripherals, an intelligent textile may enable the person wearing it to inform her about events. For instance, an intelligent textile may be able to inform about the presence of humidity by means of visual, vibrating, and audible alarms. Furthermore, an intelligent textile may be capable of informing a portable device, such as a tablet or a smartphone, about further events of the person wearing it, for example during sports events.

[0084] Finally, by implementing a specific arrangement of TMB, CPU, and peripherals designed to control, an intelligent textile may serve as a platform to manipulate various objects of interest. For example, an intelligent textile may be able to control the call for assistance to a third person, after selecting a menu of options; as well as enabling the control of lights of a public establishment.

[0085] The TMB is designed on textile substrates; the textile substrate may function as an isolating substrate or as a support to incorporate the required peripherals, as well as additional components.

[0086] The utilization of combinational logic enables this kind of textile technology to be configured in order to enact specific functions, for instance, in an exemplary embodiment 1- , 2- , or 3-throw switches, as depicted in FIGS. 9 and 15c, may be employed to conform a circuit that enables the control of an electronic device, such as a tablet, in order to perform determined functions. This system may be used in different applications, such as in infant learning stimulation, and in monitoring determined parameters like temperature, presence, sleeping conditions, etc.

[0087] The exemplary embodiment of the infant learning stimulation garment consists of at least one switch (1P1T, 1P2T, or 1P3T), in addition to other elements that enable the communication with the electronic device, or tablet, in a detachable or modular configuration, attachable by using the connectors or terminals within the garment wherein the TMB resides.

[0088] One of the 1P1T switches may connect to one of the 1P2T switches, and both of these, in turn, connect to the terminals that will be in contact with the textile signal communications element, or module. If desired, one 1P3T switch me be also utilized.

[0089] The connection between the different switches enables, by using combinational logic, the determination of the switch that the user activated, and therefore the transmission of a specific signal to the communications module, and by means of a computer program the control of the electronic device based on the received signal.

[0090] The arrangement of the switches in one of the layers of a TMB is better depicted in the exemplary embodiments of FIGS. 9 and 15c: the throw of one 1P1T (700) switch may be connected to the throw of one 1P2T (800) switch, and the throws of the latter switch may be connected to the throws of a 1P3(900) switch, in this manner at least three 1P1T (700) switches, three 1P2T (800) switches, and one 1P3T (900) switch may be utilized, thus enabling a TMB with 3 inputs to control up to 7 switches, achieving this performance due to the combinational logic, since the signals may be readily determined because the switches function as logic gates. The number of switches that can be implemented by means of the combinational logic is given by (2{circumflex over (0)}N1), wherein N is the number of inputs available in the TMB design. In the previous example N3, thus giving a total of 7 available switches. The logical gates thus conformed may be associated with a specific signal value, for instance a binary series may be employed, as indicated in the figures (001, 010, 100), thus codifying and clearly determining the switch that was activated by the user. The TMB design may also incorporate connection buses 960 and interconnection sockets to accommodate the intercommunications modules, or control modules for a specific controller, the buses connections may be implemented by using fasteners or snaps or components normally employed in the textile industry, which may enable the communication of signals between the electric or electronic components of the TMB, or a TMB module; the sockets 950 may be like the ones illustrated in FIGS. 11a-11c. Conventional textile snaps or fasteners 951, 952 may be utilized in the interconnection of buses and optionally pads within a TMB.

[0091] The configuration of switches and conductive routings, or buses, that must be utilized to conform a specific arrangement, should become evident to those skilled in the art, in order to determine other optimal arrangements starting from this description.

[0092] As depicted in FIGS. 6 and 8, the exemplary switches disclosed in the present invention are configured by a front or top layer (701, 801, 901), and a back or bottom layer (702, 802, 902), both layers, made of conductive textile material, are superposed and separated by a layer with isolating material (703, 803, 903), which may likewise be textile, such isolating material is configured to enable the communication between the two conductive layers (upper and lower), which is achieved by incorporating perforations (706, 806, 906) following a specific pattern, thus only enabling contact between certain regions of the upper and lower conductive layers.

[0093] The isolating materials (703, 803, 903) are designed with specific perforation patterns (706, 806, 906) in order to permit contact only in determined regions of the switch, as illustrated in the exemplary embodiments of FIGS. 6a, 7a, and 8a. In this fashion, in one 1P1T switch, the perforations 706 may be placed in a circular pattern, which enables contact in most of the conductive regions. In another 1P2T switch, the pattern may be divided in order to generate two separate regions 806. Similarly, in one 1P3T switch, the isolating material may be configured to exhibit three perforation regions 906.

[0094] Even though the switches are shown to have a circular form, the switches may adopt any form that is deemed necessary, and with the number of divisions needed to achieve the poles or throws required, taking into consideration that in both conductive layers, one, either the upper or lower, encompasses the complete area of the switch (indicated with dashed lines) (702, 802, 902) and the other, upper or lower, may encompass as many divisions as throws are required (indicated with solid lines) (701, 801, 901) Therefore in a 1P1T switch both layers are equal, in a 1P2T one of the layers may have two sections 801, thus forming the necessary throws. In a 1P3T, one of the layers may have three sections 901. These features may be seen in FIGS. 6 to 8. Evidently, both layers may be equally divided to generate switches with N poles and N throws, in order to conform an NPNT switch. Similarly, the isolating layer may have the necessary regions, perforations, and number according to the required contact regions of each switch.

[0095] The exemplary embodiment of the present disclosure shown in FIG. 10 illustrates a communications module with an intercommunications socket 950 with communication nodes or connectors or buses 960.

[0096] The exemplary embodiment of the present disclosure illustrated in FIG. 12 depicts contact zones or pads conformed of textile material, the pads are employed to join components, such as snaps, pins, or similar components, with the routings or buses of the TMB.

[0097] According to the exemplary embodiment of the present disclosure shown in FIG. 13, a 2P2T switch may be implemented with the use of a hook and loop coupling element, such as Velcro, conformed of conductive textile material, and functioning as a textile adhesive material, wherein one region functions as throw and the other as pole. This embodiment of the TMB may be utilized by a user as a bracelet, and the type of switch would correspond to one that is active when the hook and loop sections are joined, thus closing the circuit. The TMB depicted in FIG. 13 is configured as a temperature sensing device, which monitors a user by locating the bracelet in a part of the user's body, the bracelet may, in turn, incorporate a module to communicate with a mobile device, such as a telephone or a tablet.

[0098] According to the exemplary embodiments of the present disclosure illustrated in FIGS. 15a through 15d, a TMB structure is shown, which may monitor bedroom textiles or linens, such as bedcovers or bed mattresses, which incorporate a TMB with an arrangement of 7 switches (700, 800, 900), which may be configured as previously described or in an alternating manner in order to monitor the sought after parameters, such as humidity presence. The isolating layer may incorporate perforation patterns 1501 to enable the electric communication between switches and contact pads 1502, 1503.

[0099] The exemplary embodiment of the present disclosure shown in FIG. 9 may be configured as a system for infant learning stimulation, which by incorporating at least one switch, preferably 7 switches, as depicted, enables the infant, by using a garment suited to fit his size, to interact with an electronic device, such as a tablet, in order to wirelessly perform determined interactive tasks by using the device and the controls of the textile garment, for instance following the sequence of a tale. In this manner, instructions required by the electronic device may be commanded by using the TMB within the infant's garment, therefore enabling the infant to interact with the device and the TMB in order to develop cognitive abilities.

[0100] The exemplary embodiment of the present disclosure depicted in FIG. 16 illustrates a TMB pattern in order to configure an infant monitor with humidity, movement, and temperature (textile) transducers, which may be incorporated to a garment, in order to determine if the infant has a fever, a change of diaper is necessary, or the infant, is exhibiting voluntary or involuntary movement. In the same fashion, the embodiment may implement transducer modules to determine cardiac rhythm. The information may be communicated to a mobile device, such that the parents or persons caring for the infant may be able to monitor the infant activity. Appropriate sockets and buses are employed to perform the required monitoring.

[0101] The exemplary devices of the present disclosure may function with batteries and, therefore, a battery holder is depicted in FIG. 14, wherein an emplacement for the batteries is provided, which is configured with a TMB that incorporates contact terminals or pads.