NANOPARTICLE THERMAL INTERFACE AGENTS FOR REDUCING THERMAL CONDUCTANCE RESISTANCE

Abstract

A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.

Claims

1. A thermal interface material (TIM) comprising: a vertically aligned metal nanowire array (VAMNW) for providing heat transfer between two surfaces in an electronic device; and a plurality of high thermal conductivity nanoparticles distributed on the surface of the VAMNW such that they are co-planar and lie flat in an interface region between the VACNT and one of the surfaces in the electronic device.

2. The TIM of claim 1 wherein the nanoparticles comprise nanorods or nanowires.

3. The TIM of claim 1 wherein the nanoparticles comprise nanorods or nanowires with aspect ratios between approximately 5 and over 1,000.

4. The TIM of claim 4 wherein the nanoparticles further comprise silver nanowires having an aspect ratio of approximately 1000.

5. The TIM of claim 4 wherein the nanoparticles further comprise copper nanowires or nanorods.

6. The TIM of claim 4 wherein the nanoparticles further comprise gold nanowires or nanorods.

7. The TIM of claim 4 wherein the nanoparticles further comprise nanodiamonds.

8. The TIM of claim 4 wherein the nanoparticles further comprise nanotubes made of boron nitride.

9. The TIM of claim 1 wherein the nanoparticles further comprise acicular nanorods or nanowires.

10. A thermal interface material (TIM) for use in an integrated circuit (IC) electronic device, comprising: a vertically aligned metal nanowire array (VANMW) for providing heat transfer between two surfaces in the electronic device; and a plurality of high thermal conductivity nanoparticles distributed on the surface of the VANMW such that they are co-planar and lie flat in an interface region between the VACNT and one of the surfaces in the electronic device, said nanoparticles having aspect ratios between approximately 5 and over 1,000.

11. The TIM of claim 10 wherein the nanoparticles further comprise silver nanowires having an aspect ratio of approximately 1000.

12. The TIM of claim 10 wherein the nanoparticles further comprise copper nanowires or nanorods.

13. The TIM of claim 10 wherein the nanoparticles further comprise gold nanowires or nanorods.

14. The TIM of claim 10 wherein the nanoparticles further comprise nanodiamonds.

15. The TIM of claim 10 wherein the nanoparticles further comprise nanotubes made of boron nitride.

Description

DESCRIPTION OF THE DRAWINGS

[0016] Features of example implementations of the invention will become apparent from the description, the claims, and the accompanying drawings in which:

[0017] FIG. 1A depicts an interface between two surfaces in an IC electronic device.

[0018] FIG. 1B depicts a prior art VACNT thermal interface.

[0019] FIG. 2 depicts a thermal interface material (TIM) of the present invention with a vertically aligned carbon nanotube array (VACNT).

[0020] FIG. 3 depicts a chart comparing the contact resistance of several TIMs.

[0021] FIG. 4A depicts a cross-sectional view of a TIM according to the present invention with a vertically aligned metal nanowire array (VAMNW).

[0022] FIG. 4B depicts a top view of the TIM of FIG. 4A.

DETAILED DESCRIPTION

[0023] The real areal contact area available for heat exchange between prior art surfaces at a microscopic level is illustrated in FIG. 1A. Although surfaces 10 and 12 may appear flat to the naked eye, real contact areas 14 are very much less than the apparent contact area leading to restricted heat flow and high thermal resistance.

[0024] FIG. 1B depicts surfaces 16 and 18 with a prior art thermal interface material (TIM) to provide improved heat flow. The TIM is a vertically aligned carbon nanotube array (VACNT). The nanometer-scale thermal transport agents are able to promote expanded physical/thermal contact between mating surfaces beyond their bridging asperities but have several disadvantages as explained above, such as expensive manufacturing facilities, high synthesis temperatures that can damage electronic components and the presence of impurities.

[0025] The invention concept entails a thermal interface material where high thermal conductivity, nanometer-dimension agents have been deposited in the junction or boundary regions between mating part surfaces in order to reduce their thermal contact resistance. Due to their nanometer-dimension size these agents can fit within and fill millimeter-to-nanometer size voids that exist with all practical material surfaces regardless of their state, type surface finish or roughness.

[0026] High thermal conductivity nanoparticles, particularly ones with large aspect ratios, are used for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces. The aspect ratio of a nanoparticle is defined as the ratio of the particle's largest linear dimension to its smallest dimension. Nanoparticles can have aspect ratios as low as approximately 5:1 up to 10,000:1 and higher. In other forms, nanoparticles can be equiaxed such as, nanodiamonds, for example. Many terms are commonly used to describe nanoparticles of various shapes and dimensions, including nanorod, nanotube, nanofilament, nanowire and nanodiamond.

[0027] According to an embodiment, the nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state distributed in the boundary region. The nanoparticle agents may be used with bulk materials having micrometer or larger asperities or roughness figures as well as with low density nano-based thermal interface materials such as VACNT arrays or VAMNW arrays to substantially reduce thermal contact resistance. Used in conjunction with high conductivity VACNT or VAMNW arrays, they offer a compliant interface with stable thermal transport properties that is compressible and conformable to both VACNT or VAMNW arrays or other heat exchange surfaces. FIG. 2 depicts an embodiment of the invention where silver nanowires (AgNW) have been deposited on a VACNT or VAMNW arrays. The 1000:1 aspect ratio of AgNW shown in FIG. 2 illustrates the space spanning and co-planar character of these interface agents.

[0028] In alternative embodiments, the nanoparticles may be equiaxed or acicular in shape with more moderate aspect ratios. The high thermal conductive particles may be electrically insulating like nanodiamonds, nano-boron nitride particles or electrically conductive and consist of silver, copper or gold nanowires/rods (NW, NR). Particularly effective are acicular NW with aspect ratios of 5 to 10,000. They lie flat in the interface region easily spanning large gaps/troughs and accommodating mating surfaces with high roughness figures.

[0029] The performance and scale of reduction in contact resistance achievable with NW interface agents are shown in FIG. 3. Several alternative thermal interface agents and their contact resistance in units of (m.sup.2K)/W are identified and compared. These include viscous thermal greases, for example Arctic Silver 5 shown at 30 and Shin-Etsu MicroSi G751 shown at 32, and filled epoxy adhesives such as Ablebond 965 shown at 34 or Diemat SK70 shown at 36. FIG. 3 also shows the achievable contact resistance of polyurethane (PU) VACNT arrays (Si substrate) at 38 and PU VACNT (Quartz substrate) at 40.

[0030] Finally, 42 of FIG. 3 depicts the contact resistance of a PU VACNT with AgNW. As shown, this TIM reduces contact resistance by a factor of 100. AgNW interface agents are also seen to meet and beat DARPA's ambitious Nanotechnology Interface (NTI) program's 1 mm.sup.2K/W goal.

[0031] FIG. 4A depicts another embodiment of the invention where high aspect ratio nanoparticles 50 similar to those described above in connection with FIG. 2 have been deposited on a vertically aligned metal nanowire array (VAMNW) 52. Nanoparticles 50 do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state distributed in the boundary region on one surface of VAMNW array 52. The depiction of the invention in FIG. 4A is not intended to show specific dimensions of high aspect ratio nanoparticles 50 or VAMNW 52, nor is it intended to show relative dimensions between the components of layers 50 and 52.

[0032] FIG. 4B depicts a magnified top view of layer 50 of FIG. 4A. The homogeneous and isotropic distribution of particles is clearly shown. Although FIGS. 4A and 4B depict an embodiment of the invention using nanowires or nanorods, a variety of nanoparticles of various shapes and dimensions, including nanorod, nanotube, nanofilament, nanowire and nanodiamond can be used in layer 50 as described above.

[0033] The steps or operations described herein are just for example. There may be many variations to these steps or operations without departing from the spirit of the invention. For instance, the steps may be performed in a differing order, or steps may be added, deleted, or modified.

[0034] Although example implementations of the invention have been depicted and described in detail herein, it will be apparent to those skilled in the relevant art that various modifications, additions, substitutions, and the like can be made without departing from the spirit of the invention and these are therefore considered to be within the scope of the invention as defined in the following claims.