Process for forming a planar diode using one mask

Abstract

A planar diode and method of making the same employing only one mask. The diode is formed by coating a substrate with an oxide, removing a central portion of the oxide to define a window through which dopants are diffused. The substrate is given a Ni/Au plating to provide ohmic contact surfaces, and the oxide on the periphery of the window is coated with a polyimide passivating agent overlying the P/N junction.

Claims

1. A diode comprising: (a) a substrate of a first conductivity type and a doped region of a second conductivity type defining a P/N junction therebetween; (b) nickel plating on the underside of the substrate and along a central portion of a top side of the substrate overlying the doped region of the second conductivity type; (c) an oxide coating on the peripheral portion of the top side of the substrate adjacent the central portion; and (d) a coating of a passivating material along the oxide on the top side of the substrate, the passivating material extending partially over the P/N junction, wherein the nickel plating does not overlap with the oxide coating on the peripheral portion of the top side of the substrate.

2. The diode of claim 1, wherein said first conductivity type has N-type conductivity and said second conductivity type has P-type conductivity.

3. The diode of claim 1, wherein said doped region is doped with boron.

4. The diode of claim 1, wherein the passivating material is polyimide.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The present invention will become more readily apparent from the following detailed description taken in conjunction with the accompanying drawings in which:

(2) FIG. 1 is a schematic view of a known process for manufacturing planar diodes.

(3) FIG. 2 is a schematic view of a first embodiment of a process for the manufacture of diodes according to the principles of the invention.

(4) FIG. 3 is a schematic view of a second embodiment of a process for the manufacture of diodes according to the principles of the invention.

DETAILED DESCRIPTION OF THE INVENTION

(5) The present invention is directed both to a process for manufacturing planar diodes and the diodes so manufactured. One advantage associated with the present invention is that it requires the use of only one mask in contrast to other approaches which require more, thereby resulting in a more economical and reliable process for manufacturing planar diodes. Not only does the use of a single mask simplify the process, but it requires less equipment as well, as only a single conventional photolithographic aligner is required by this process. According to one aspect of the invention, a coating is provided of passivating material such as polyimide in order to enhance the resistance of the device to mechanical and environment stresses and moisture. This results in a more economical and reliable process for manufacturing planar diodes.

(6) FIG. 2 illustrates a process for such manufacture in accordance with an embodiment of the present invention. The process begins at step 101 with a wafer 100, typically made of silicone (although the process can be employed with other semiconductive materials).

(7) In step 102, the upper surface is oxidized in a known manner to provide an oxide layer 110 of silicon dioxide. (The lower surface may optionally be oxidized as well.)

(8) Next, in step 103, a photoresist 120 is developed for contact etching. This is the only step in the process in which a mask is employed.

(9) In step 104, contact etching exposes a window 112 in the oxide layer. Through this layer, a P/N junction is formed in step 105 via window diffusion, thus creating P+, N, and N+ type regions 114, 116, and 118 respectively, as is known in the art. Alternatively, different impurities can be employed to create a N/P junction comprising N+, P, and P+ type regions.

(10) Ohmic contacts 132 and 134 are provided in step 106 via nickel plating, as is known in the art. The oxide 110 acts as a mask for the deposition of the metal contact 132 and is self-aligned to the P/N junction without need of an additional mask for metallization along the window 112.

(11) By the end of step 106, a functional diode has been produced. However, in order to passivate the surface and thus provide a more reliable and durable device, a polyimide coating 140 is added in step 107 via the screen printing method (which is less expensive than the use of a mask). The polyimide coating serves to protect the device, and in particular, the P/N junction, against contamination and moisture. Optionally, and to further protect the nickel surface against corrosion, a gold plating may be applied to the exposed nickel surfaces.

(12) By reducing the number of masks that are employed to one, the resulting planar diodes are cheaper to manufacture.

(13) According to one example, the dimensions of the diode may be as follows:

(14) TABLE-US-00001 Layer Thickness (approx., and in microns) Oxide 2.0 photoresist 5.0 P+ 50.0 N+ 100.0 Polyimide 10.0 Nickel/Gold 2.0

(15) FIG. 3 illustrates an alternative embodiment of the invention, in which steps 201-206 are identical to steps 101-106, both in process and in resulting intermediate structures. This process begins at 201 with a wafer. In step 202, the upper surface is oxidized in a known manner to provide an oxidized layer. In step 203, a photoresist 120 is developed for contact etching. This is the only step in the process in which a mask is employed. In step 204, contact etching exposes a window in the oxide layer. Through this layer, a P/N junction is formed in step 205 via window diffusion, thus creating P+, N, and N+ type regions. Ohmic contacts are provided in step 206 via nickel plating.

(16) The process diverges from that shown in FIG. 2 in step 207, in which the remaining oxide layer 110 is stripped off. Removing the layer of oxide at this point has the advantage of enabling the removal of contaminants that my have infiltrated between the oxide and the silicon, thereby providing a cleaner P/N junction. Then, in step 208, a passivating layer of polyimide 240 is applied directly to the exposed silicon, overlapping some with the upper contact 132.

(17) Although various embodiments are specifically illustrated and described herein, it will be appreciated that modifications and variations of the present invention are covered by the above teachings and are within the purview of the appended claims without departing from the spirit and intended scope of the invention. For example, this approach could be applied to the manufacture of different kinds of semiconductor devices such as transient voltage suppressors, thyristors, and transistors.