ELECTRODE SLURRY DRYING DEVICE FOR SECONDARY BATTERY
20250140788 ยท 2025-05-01
Inventors
- Youngha JOO (Yongin-si, KR)
- Minku KIM (Yongin-si, KR)
- Junghoon Lee (Yongin-si, KR)
- Sangdon CHOI (Yongin-si, KR)
Cpc classification
F26B17/023
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F26B21/004
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F26B21/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
An electrode-slurry-drying device according to one or more embodiments of the present disclosure includes a nozzle configured to spray gas to dry an electrode slurry comprising a solvent applied on a substrate; and a nozzle plate at an outlet of the nozzle, and defining perforations for discharging the gas toward the substrate, wherein a number of the perforations is determined based on an amount of undried solvent on the substrate.
Claims
1. An electrode-slurry-drying device comprising: a nozzle configured to spray gas to dry an electrode slurry comprising a solvent applied on a substrate; and a nozzle plate at an outlet of the nozzle, and defining perforations for discharging the gas toward the substrate, wherein a number of the perforations is determined based on an amount of undried solvent on the substrate.
2. The electrode-slurry-drying device as claimed in claim 1, wherein the nozzle plate comprises a plate region comprising plate sub-regions, and wherein respective numbers of ones of the perforations at the plate sub-regions is proportional to respective amounts of the undried solvent in regions of the substrate respectively corresponding to the plate sub-regions.
3. The electrode-slurry-drying device as claimed in claim 2, wherein the respective numbers of the ones of the perforations are determined by applying respective ratios that are proportional to the respective amounts of the undried solvent to a total number of candidate perforations in the plate sub-regions.
4. The electrode-slurry-drying device as claimed in claim 2, wherein a first number of corresponding ones of the perforations in one of the plate sub-regions corresponding to a central portion of the substrate is greater than a second number of corresponding others of the perforations in one of the plate sub-regions corresponding to an edge portion of the substrate.
5. The electrode-slurry-drying device as claimed in claim 1, wherein positions of the perforations are selected to maintain substantially constant distances between the perforations.
6. The electrode-slurry-drying device as claimed in claim 1, wherein the electrode slurry is applied by a stripe-coating process, and wherein the perforations are omitted from a portion of the nozzle plate corresponding to a region of the substrate omitting the electrode slurry.
7. The electrode-slurry-drying device as claimed in claim 1, wherein positions of the perforations have a line-symmetrical pattern.
8. The electrode-slurry-drying device as claimed in claim 1, further comprising a densimeter configured to calculate the amount of the undried solvent based on a change in density of the electrode slurry on the substrate for respective regions of the substrate.
9. The electrode-slurry-drying device as claimed in claim 8, wherein the densimeter corresponds to a radiation-type sensor.
10. The electrode-slurry-drying device as claimed in claim 1, further comprising a chamber comprising an inlet through which the substrate is configured to be pulled in, and an outlet through which the substrate is configured to be pulled out, and configured to dry the electrode slurry inside the chamber, wherein the nozzle is connected to the chamber, and is configured to spray the gas into the chamber, and wherein the amount of the undried solvent is determined based on the substrate pulled out of the outlet.
11. The electrode-slurry-drying device as claimed in claim 1, wherein the nozzle plate comprises a plate region comprising plate sub-regions, and wherein an area of the perforations defined in the plate sub-regions is proportional to a corresponding amount of the undried solvent in a region of the substrate corresponding to the plate sub-regions.
12. The electrode-slurry-drying device as claimed in claim 1, further comprising supply pipes configured to supply the gas to the nozzle, and configured to supply the gas according to different heat sources.
13. An electrode-slurry-drying method, the method comprising: spraying gas for drying an electrode slurry comprising a solvent applied on a substrate through a nozzle plate provided at an outlet of a nozzle; measuring an amount of undried solvent on the substrate; and determining an arrangement of perforations in the nozzle plate based on the amount of the undried solvent.
14. The electrode-slurry-drying method as claimed in claim 13, wherein the measuring of the amount of the undried solvent comprises measuring, by a densimeter, the amount of the undried solvent based on a change in density of the electrode slurry on the substrate for respective regions of the substrate.
15. The electrode-slurry-drying method as claimed in claim 14, wherein the densimeter corresponds to a radiation-type sensor.
16. The electrode-slurry-drying method as claimed in claim 13, further comprising: replacing the nozzle plate with a new nozzle plate having a determined number of perforations; and drying the electrode slurry by using the nozzle comprising the new nozzle plate.
17. The electrode-slurry-drying method as claimed in claim 13, wherein the nozzle plate comprises a plate region comprising plate sub-regions, and wherein the determining of the arrangement of the perforations comprises determining respective numbers of the perforations at the plate sub-regions to be proportional to respective amounts of the undried solvent in respective regions of the substrate corresponding to the plate sub-regions.
18. The electrode-slurry-drying method as claimed in claim 17, wherein the determining the respective numbers of the perforations comprises applying respective ratios proportional to the respective amounts of the undried solvent to a total number of candidate perforations in the plate sub-regions.
19. The electrode-slurry-drying method as claimed in claim 13, wherein the determining of the arrangement of the perforations comprises selecting positions of the perforations to maintain substantially constant distances between the perforations.
20. The electrode-slurry-drying method as claimed in claim 13, wherein the spraying the gas comprises spraying the gas supplied from at least one of supply pipes for supplying the gas according to different heat sources through the nozzle plate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] The following drawings attached to this specification illustrate embodiments of the present disclosure, and further describe aspects and features of the present disclosure together with the detailed description of the present disclosure. Thus, the present disclosure should not be construed as being limited to the drawings:
[0035]
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[0041]
[0042]
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DETAILED DESCRIPTION
[0046] Hereinafter, embodiments of the present disclosure will be described, in detail, with reference to the accompanying drawings. The terms or words used in the present specification and claims are not to be limitedly interpreted as general or dictionary meanings and should be interpreted as meanings and concepts that are consistent with the technical idea of the present disclosure on the basis of the principle that an inventor can be his/her own lexicographer to appropriately define concepts of terms to describe his/her invention in the best way.
[0047] The embodiments described in this specification and the configurations shown in the drawings are only some of the embodiments of the present disclosure and do not represent all of the technical spirit, aspects, and features of the present disclosure. Accordingly, it should be understood that there may be various equivalents and modifications that can replace or modify the embodiments described herein at the time of filing this application.
[0048] It will be understood that when an element or layer is referred to as being on, connected to, or coupled to another element or layer, it may be directly on, connected, or coupled to the other element or layer or one or more intervening elements or layers may also be present. When an element or layer is referred to as being directly on, directly connected to, or directly coupled to another element or layer, there are no intervening elements or layers present. For example, when a first element is described as being coupled or connected to a second element, the first element may be directly coupled or connected to the second element or the first element may be indirectly coupled or connected to the second element via one or more intervening elements.
[0049] In the figures, dimensions of the various elements, layers, etc. may be exaggerated for clarity of illustration. The same reference numerals designate the same elements. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items. Further, the use of may when describing embodiments of the present disclosure relates to one or more embodiments of the present disclosure. Expressions, such as at least one of and any one of, when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. When phrases such as at least one of A, B and C, at least one of A, B or C, at least one selected from a group of A, B and C, or at least one selected from among A, B and C are used to designate a list of elements A, B and C, the phrase may refer to any and all suitable combinations or a subset of A, B and C, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the terms use, using, and used may be considered synonymous with the terms utilize, utilizing, and utilized, respectively. As used herein, the terms substantially, about, and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent variations in measured or calculated values that would be recognized by those of ordinary skill in the art.
[0050] It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section.
[0051] Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of example embodiments.
[0052] Spatially relative terms, such as beneath, below, lower, above, upper, and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as below or beneath other elements or features would then be oriented above or over the other elements or features. Thus, the term below may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.
[0053] The terminology used herein is for the purpose of describing embodiments of the present disclosure and is not intended to be limiting of the present disclosure. As used herein, the singular forms a and an are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms includes, including, comprises, and/or comprising, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
[0054] Also, any numerical range disclosed and/or recited herein is intended to include all sub-ranges of the same numerical precision subsumed within the recited range. For example, a range of 1.0 to 10.0 is intended to include all subranges between (and including) the recited minimum value of 1.0 and the recited maximum value of 10.0, that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limitation recited herein is intended to include all lower numerical limitations subsumed therein, and any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein. Accordingly, Applicant reserves the right to amend this specification, including the claims, to expressly recite any sub-range subsumed within the ranges expressly recited herein. All such ranges are intended to be inherently described in this specification such that amending to expressly recite any such subranges would comply with the requirements of 35 U.S.C. 112 (a) and 35 U.S.C. 132 (a).
[0055] References to two compared elements, features, etc. as being the same may mean that they are substantially the same. Thus, the phrase substantially the same may include a case having a deviation that is considered low in the art, for example, a deviation of 5% or less. In addition, when a certain parameter is referred to as being uniform in a given region, it may mean that it is uniform in terms of an average.
[0056] Throughout the specification, unless otherwise stated, each element may be singular or plural.
[0057] Arranging an arbitrary element above (or below) or on (under) another element may mean that the arbitrary element may be disposed in contact with the upper (or lower) surface of the element, and another element may also be interposed between the element and the arbitrary element disposed on (or under) the element.
[0058] In addition, it will be understood that when a component is referred to as
[0059] being linked, coupled, or connected to another component, the elements may be directly coupled, linked or connected to each other, or another component may be interposed between the components.
[0060] Throughout the specification, when A and/or B is stated, it means A, B or A and B, unless otherwise stated. That is, and/or includes any or all combinations of a plurality of items enumerated. When C to D is stated, it means C or more and D or less, unless otherwise specified.
[0061] In the present disclosure, density for each region may refer to a mass of a material applied/coated on a substrate per unit area of the substrate. For example, the density for each region may be calculated in mg/cm.sup.2.
[0062]
[0063] A substrate 130 coated with an electrode slurry 142 may be pulled into the dryer 110 through a dryer inlet 110a, may be dried, and then may be pulled out of the dryer 110 through a dryer outlet 110b. The dryer 110 may be made of various materials and in various shapes, such as a rectangular shape, a cylindrical shape, and a multi-layered shape, and is not limited to the shape illustrated in
[0064] The substrate 130 may be pulled into, or pulled out of, the dryer 110 while being moved by the roller 150. A movement direction of the substrate 130 may correspond to a +y direction. The roller 150 may rotate at a substantially constant speed to continuously pull the substrate 130 into and out of the dryer 110. The roller 150 may rotate for a first time to move the substrate 130, and then may stop the substrate 130 for a second time. The substrate may be dried in a movement state for the first time (e.g., first amount of time), and may be dried in a stop state for the second time (e.g., second amount of time). In other embodiments, the roller 150 may rotate continuously without stopping. In a state where the roller 150 continuously rotates without stopping, a rotation speed of the roller 150 may be relatively lower than a case where there is a stop time, and the substrate 130 may be dried while continuously moving.
[0065] Before the substrate 130 is pulled into the dryer 110 through the dryer inlet 110a, the electrode slurry 142 may be applied/coated on the substrate 130 by a coater 140. In this case, the electrode slurry 142 may be applied on the substrate 130 by a stripe-coating process in a direction of movement of the substrate 130.
[0066] The electrode slurry 142 applied on the substrate 130 may be formed by mixing an active material, a binder, and a conductive material by using a solvent. The active material included in the electrode slurry 142 may change depending on the type of an electrode being made. For example, an electrode slurry for making a positive electrode may include a positive electrode active material, such as lithium cobalt oxide (LCO), lithium nickel oxide (LNO), lithium manganese oxide (LMO), lithium iron phosphate (LFP), ternary lithium metal oxide (NCM), or a spinel compound. An electrode slurry for making a negative electrode may include a negative electrode active material, such as graphite or carbon fiber.
[0067] The binder may include various materials, such as polyvinylidene fluoride (PVDF), polymethylmethacrylate, polyacrylonitrile, polyethylene, and/or related polymers or copolymers.
[0068] The solvent may include N-methyl-2-pyrrolidone (NMP) or water. The electrode slurry 142 is not limited to the materials described above, and may include various types of materials. For example, the solvent may correspond to a material that may be dried by a heating gas.
[0069] The dryer 110 may perform a drying process of drying the electrode slurry 142 by removing a solvent in the electrode slurry 142. The dryer 110 may be designed to allow the substrate 130 to slide through the interior of the dryer 110.
[0070] In some embodiments, the dryer 110 may include an inlet 112a through which the substrate 130 is pulled in, and may include an outlet 112b through which the substrate 130 is pulled out. The inside of the dryer 110 may include the chamber 112 in which the electrode slurry 142 is dried, may include the nozzle 114 connected to the chamber 112 for spraying gas into the chamber 112 to dry the electrode slurry 142, may include a nozzle plate provided at an outlet of the nozzle 114 and having a plurality of perforations for discharging the gas sprayed from the nozzle 114 toward the substrate 130 (or the electrode slurry 142), and may include the discharger 116 for discharging the gas used for drying the electrode slurry 142 to the outside of the chamber 112
[0071] The dryer 110 is not limited to illustration of
[0072] In some embodiments, the discharger 116 may face the nozzle 114 about the substrate 130. In some embodiments, the discharger 116 may be separated from the nozzle 114 to face the nozzle 114 with the substrate 130 interposed therebetween.
[0073] For example, in a state where the nozzle 114 is positioned on (e.g., above) an upper side (a +z direction) of the substrate 130, the discharger 116 may be positioned on (e.g., below) a lower side (a z direction) of the substrate 130. In a state where the nozzle 114 is positioned on or below the lower side (the z direction) of the substrate 130, the discharger 116 may be positioned on or above the upper side (the +z direction) of the substrate 130. By arranging the nozzle 114 and the discharger 116 to face each other about the substrate 130 (e.g., with the substrate 130 therebetween), the flow of gas may be more precisely controlled, and the drying amount of the solvent may be precisely controlled.
[0074] In other embodiments, the nozzle 114 and the discharger 116 may be positioned in the same direction (for example, on or above an upper side of the substrate 130) about the substrate 130.
[0075] The supply pipes 122 and 124 may supply gas to the nozzle 114. Although
[0076] The supply pipes 122 and 124 may be connected to a gas-generating device (for example, a hot-air-generating device) for drying an electrode slurry, and the amount of gas transferred to the supply pipes 122 and 124 and/or the amount of gas supplied to the nozzle 114 may be adjusted by using a pump, a fan, a valve, or so on. The supply pipes 122 and 124 may each supply gas (for example, hot air, steam, or so on) according to different heat sources.
[0077] The densimeter 160 may measure the density of slurry for each region on the substrate 130 after the drying process. In some embodiments, the densimeter 160 may be provided in a direction of the dryer outlet 110b, and may be a radiation-type sensor (for example, a B-ray sensor). The density of the slurry for each region may be measured for all or part of the substrate 130. For example, the substrate 130 may be sequentially divided into stripe regions, and the density of the slurry may be measured for each stripe region. For example, in a state where there are six stripe regions (see
[0078] After the drying process, the amount of dried solvent evaporated from the electrode slurry 142, and the amount of undried solvent not evaporated, may be determined by using the densimeter 160. The amount of dried solvent and the amount of undried solvent may be determined based on the density of each region on the substrate of the electrode slurry before and after the drying process. In this case, a region on the substrate where the density is measured may be a region (for example, a stripe-shaped region formed in a transfer direction of the substrate) that is vertically divided in the width direction (the x-axis direction) of the substrate 130 at a substantially constant length.
[0079] For example, the density of the electrode slurry 142 for each region on the substrate before the drying process may be directly measured by using a separate densimeter at the dryer inlet 110a, or may be determined from constituent materials and a mixing ratio of the electrode slurry. Then, after the drying process, the density of the electrode slurry 142 for each region on the substrate may be measured by using the densimeter 160. Thereafter, based on the change in density of the electrode slurry 142 for each region on the substrate measured/determined before and after the drying process, the amount of dried solvent and the amount of undried solvent for each region may be determined based on the substrate 130 extracted from the dryer outlet 110b.
[0080] In other embodiments, the amount of dried solvent or the amount of undried solvent for each region may be measured through thickness measurement, spectroscopic analysis, and so on before and after the drying process.
[0081] Thereafter, as the number of perforations on the nozzle plate is determined based on the amount of undried solvent for each region, the solvent of the electrode slurry 142 may be dried substantially uniformly on the substrate 130. This is described in detail below with reference to
[0082]
[0083] As illustrated in
[0084] As may be seen from the arrows indicated in a width direction (an x-axis direction) of the substrate, the gas discharged from a reference nozzle plate 200 in the width direction (the x-axis direction) may collide with the electrode slurry 142 on the substrate 130, and then may move to the edge portions on both sides of a central portion of the substrate 130 or the electrode slurry 142. In such a process, it can be seen that the flow rate of gas increases at the edge portions in the width direction. In some embodiments, in
[0085] In some embodiments, it may be suitable to substantially uniformly apply the electrode slurry prepared in a mixing process onto a substrate (for example, Cu foil), and to increase solvent-drying uniformity in a process of evaporating the solvent while the substrate passes through a dryer. A difference in the solvent-drying uniformity in the width direction of the substrate may cause quality (peel strength) reduction, and may cause cell performance differences, due to the migration imbalance of a binder. An internal airflow distribution and drying efficiency may change depending on various factors, such as a structure of an internal circulation path of a dryer, a position of an exhaust hole, a coating method, and an overall width of the substrate. This may cause a drying variation in a width direction of a substrate, and may reduce process margins or coating speeds. Even by controlling a solvent-drying variation under production conditions, there may be limitations due to differences in level of folding of the substrate due to heat strain distribution and stress occurring in the width direction of the substrate. According to some embodiments of the present disclosure, by controlling a gas flow in a dryer by an arrangement of perforations (for example, see arrows illustrated in
[0086]
[0087] As illustrated in
[0088]
[0089] edge portion in a width direction of the substrate, and increases toward a central portion in the width direction. It may be seen that the amount of undried solvent is reduced toward the edge portion in the width direction of the substrate, and the amount of undried solvent is increased toward the central portion in the width direction of the substrate.
[0090] For example, density may be measured by a coating weight measurement system. The coating weight measurement system may indirectly measure a quantitative difference before and after coating (e.g., weight=weight after coatingweight before coating). A B-ray sensor capable of measuring both an object and a surrounding air layer may be used to calculate a coating weight, and may perform high-speed scanning in a TD direction with a position resolution of about 1/1000mm of a servo motor.
[0091]
[0092] In some embodiments, a plate region of the nozzle plate 600 may have a plurality of plate sub-regions having boundary lines in a movement direction, or in a longitudinal direction (the y-axis direction), of a substrate (see
[0093] In some embodiments, as illustrated in
[0094] In other embodiments, to solve the problem that the amount of undried solvent in the central portion of the substrate after the drying process is greater than the amount of undried solvent in the edge portion of the substrate, sizes of the perforations formed in a plate region corresponding to the central portion of the substrate in the width direction may be greater than sizes of the perforations formed in a plate region corresponding to the edge portion of the substrate in the width direction.
[0095] In some embodiments, the perforations formed in the nozzle plate 600 may be positioned in a line-symmetrical pattern. For example, perforations may be formed in a line-symmetrical pattern around the x-axis or y-axis center line of the nozzle plate 600.
[0096] The nozzle plate 600 illustrated in
[0097]
[0098] A table 710 of
[0099] In some embodiments, the number of perforations may be determined by applying a ratio proportional to the amount of undried solvent to the total number of candidate perforations in the plate sub-region.
[0100] For example, one plate region may have 12 plate sub-regions (e.g., a first plate sub-region to a twelfth plate sub-region). An undried level of the slurry of a substrate region corresponding to each plate sub-region may be measured. For example, the plate sub-region may correspond to a stripe region of the substrate. For example, combined two plate sub-regions may correspond to one stripe region, and 12 plate sub-regions may correspond to a total of six stripe regions. In other embodiments, one plate sub-region may correspond to one stripe region, and in this case, 12 plate sub-regions may correspond to a total of 12 stripe regions. In one or more other embodiments, 6 plate sub-regions may correspond to 1 stripe region, and in this case, 12 plate sub-regions may correspond to 2 stripe regions. In this way, the plate sub-region and the stripe region may have a 1:1 or N:1 correspondence relationship (N is a natural number).
[0101] As illustrated in
[0102] Thereafter, the number of perforations may be determined in the same manner for sub-regions that are different based on the amounts of undried solvent in the sixth plate sub-region and the seventh plate sub-region.
[0103] For example, the level of undried solvent in the fifth plate sub-region is about 8%, which corresponds to about 80% of the level of dried solvent in the sixth plate sub-region. In some embodiments, the number of perforations in the fifth plate sub-region may be determined to be about 80% (e.g., 24 or 25 perforations corresponding to about 80% of the total number of candidate perforations) of the number of perforations in the sixth plate sub-region.
[0104] Furthermore, the level of undried solvent in the fourth plate sub-region is about 6%, which corresponds to about 60% of the level of dried solvent in the sixth plate sub-region. In some embodiments, the number of perforations in the fourth plate sub-region may be determined to be about 60% (e.g., 19 or 20 perforations corresponding to about 60% of the total number of candidate perforations) of the number of perforations in the sixth plate sub-region. The number of perforations in other plate sub-regions of the nozzle plate 720 may be determined in the same manner as described above.
[0105] In other embodiments, sizes of perforation may be determined by applying a ratio that is proportional to the amount of undried solvent to an area of a candidate perforation in a plate region. For example, the numbers of perforations in respective regions of the nozzle plate 720 may be equal to each other, the total perforation area of the fourth plate sub-region of the nozzle plate 720 may be determined to be about 60% of the total perforation area of the sixth plate sub-region, and positions of the perforations may be the same as each other.
[0106] The number or regions and areas of the regions may be randomly determined. In
[0107] Positions of the perforations may be determined to be positions that are selected to maintain a substantially constant distance between the perforations. In some embodiments, gas may be sprayed evenly over the entire region of the substrate.
[0108] In some embodiments, as the electrode slurry is applied on the substrate by a stripe-coating process, a sub-region of the nozzle plate 720 corresponding to a substrate region (an uncoated region) where there is no electrode slurry is separately generated, and perforations may not be formed in the generated sub-region. In some embodiments, it is possible to reduce or prevent the likelihood of a substrate folding phenomenon worsening due to heat shrinkage caused by a large amount of heat being applied to a section where the electrode slurry is not applied.
[0109] For example, a non-perforated sub-region 722 of the nozzle plate 720 may be a portion corresponding to a region of the substrate where there is no electrode slurry. In some embodiments, the substrate corresponding to the nozzle plate 720 may be coated with electrode slurry with two stripes. In another example, in a state where the electrode slurry is applied to six stripes, as illustrated in
[0110] After the number of perforations in each sub-region is determined, the existing nozzle plate may be repositioned with a new nozzle plate (e.g., the nozzle plate 720). A process of measuring the amount of undried solvent and replacing the nozzle plate based on this may be performed at intervals (e.g., predetermined intervals) or as suitable.
[0111]
[0112] As the number of perforations formed in a plate region corresponding to a central portion of a substrate in a width direction is greater than the number of perforations formed in a plate region corresponding to an edge portion of the substrate in the width direction, more gas may be discharged toward the central portion of the substrate 130 as compared to the edge portion of the substrate 130, with respect to the width direction.
[0113] As illustrated in
[0114] In some embodiments, even in a state where the gas discharged toward the central portion of a reference nozzle plate (with respect to a width direction/the x-axis direction) collides with the central portion of the electrode slurry 142 formed on the substrate 130, and then moves to edge portions on both sides of the central portion, the total flow rate of gas moving to the edge portions may be reduced as compared to the flow rate illustrated in
[0115]
[0116] In the graph 900, a portion where there is no density data, or where the density is 0, may correspond to a slurry-uncoated region caused by a stripe-coating process. In a state where the stripe-coating process is used, the density of slurry for each region may correspond to the density of slurry for each stripe region. Although
[0117] The density of slurry for each region may be measured to correspond to a plate sub-region. For example, in response to a case where there are 12 plate sub-regions, as illustrated in
[0118] In a state where a substrate is dried by using the nozzle 114 including the nozzle plate 200 of
[0119] In some embodiments, in a state where a substrate is dried using the nozzle 114 including the nozzle plate 600 of
[0120]
[0121] It may be seen that, in a first color map 1010 associated with a substrate dried by using the nozzle 114 including the nozzle plate 200 of
[0122] In contrast to this, it may be seen that, in a second color map 1020 associated with a substrate dried by using the nozzle 114 including the nozzle plate 600 of
[0123]
[0124] Thereafter, the amount of undried solvent on the substrate may be measured (S1120). In some embodiments, the amount of undried solvent may be measured by a densimeter based on a change in density of slurry for each region on the substrate. The densimeter used to measure the amount of undried solvent may correspond to a radiation-type sensor.
[0125] Thereafter, the arrangement of perforations formed in the nozzle plate may be determined based on the amount of undried solvent (S1130).
[0126] In some embodiments, the number of perforations formed on a plate sub-region may be determined to be proportional to the amount of undried solvent in a substrate region corresponding to the plate sub-region. For example, the number of perforations may be determined by applying a ratio that is proportional to the amount of undried solvent to the total number of candidate perforations in the plate sub-region.
[0127] In some embodiments, perforations may not be formed on the nozzle plate corresponding to substrate region in which the electrode slurry, which is otherwise applied on the substrate by a stripe-coating process, is not formed.
[0128] In some embodiments, positions of the perforations may be determined as positions selected to maintain a substantially constant distance between the perforations.
[0129] Thereafter, the nozzle plate may be repositioned with a new nozzle plate having the number and/or positions of the perforations adjusted according to the determined number and/or position of the perforations. Electrode slurry including a solvent applied on a substrate may be dried by a nozzle including a new nozzle plate.
[0130] Although the present disclosure has been described with reference to embodiments and drawings illustrating aspects thereof, the present disclosure is not limited thereto. Various modifications and variations may be made by a person skilled in the art to which the present disclosure belongs within the scope of the technical spirit of the present disclosure and the claims and their equivalents, below.