HIGH FREQUENCY ADAPTER FOR CONNECTING A HIGH FREQUENCY ANTENNA WITH AN ANTENNA CONNECTOR

Abstract

A high frequency adapter for connecting a high frequency antenna to an antenna connector. The high frequency adapter comprises a waveguide adapted to transmit high frequency waves to and from the high frequency antenna. Further, it comprises an impedance matching element disposed within the waveguide. Further, the high frequency adapter comprises a conductive inner conductor electrically and mechanically connected to the impedance matching element and a conductive sheath connecting to the waveguide. In addition, the high frequency adapter includes an electrically insulative spacer element disposed between the sheath and the inner conductor, thereby insulating the inner conductor from the sheath and fluidically sealing the waveguide.

Claims

1. A high frequency adapter configured to connect a high frequency antenna to an antenna connector, the high frequency adapter comprising: a waveguide configured to relay high frequency waves to and from the high frequency antenna; an impedance matching element disposed within the waveguide and configured to impedance match the high frequency antenna; a conductive inner conductor electrically and mechanically connected to the impedance matching element, the inner conductor being electrically connectable directly or indirectly to the antenna connector; a conductive sheath connecting to the waveguide; and an electrically insulating spacer element disposed between the conductive sheath and the inner conductor, thereby insulating the inner conductor from the conductive sheath and sealing the waveguide in a fluid-tight manner.

2. The high frequency adapter according to claim 1, wherein a first inner diameter of the conductive sheath is smaller than a second inner diameter of the waveguide so that a step is formed in a region of the connection between the waveguide and the conductive sheath, and wherein the spacer element is at least partially disposed within the waveguide and forms a collar within the waveguide.

3. The high frequency adapter according to claim 1, wherein the spacer element comprises polytetrafluoroethylene, PTFE, polyetheretherketone, PEEK, polyethylene, PE, or polyvinylidene fluoride, PVDF.

4. The high frequency adapter according to claim 1, further comprising: a process separator disposed within the conductive sheath and having a conductive element passing therethrough, the conductive element being electrically connected to the inner conductor.

5. The high frequency adapter according to claim 4, wherein the conductive element is integrally formed with the inner conductor.

6. The high frequency adapter according to claim 4, wherein the conductive element has a similar coefficient of expansion as the process separation.

7. The high frequency adapter according to claim 4, wherein the process separation comprises glass and/or ceramic, and/or the conductive element comprises a nickel alloy.

8. The high frequency adapter according to claim 4, wherein the conductive element is configured for direct connection to the antenna connector.

9. A method of manufacturing a high frequency adapter, comprising: disposing an electrically insulating hollow cylindrical spacer element within a conductive hollow cylindrical sheath;= inserting a conductive inner conductor into the spacer element; and connecting a waveguide with an impedance matching element arranged within the waveguide.

10. The method of claim 9, comprising: arranging a process separator in the conductive hollow cylindrical sheath, through which process separator a conductive element is led, which is configured for an electrical connection with the inner conductor.

11. The high frequency adapter according to claim 1, wherein the spacer element consists of polytetrafluoroethylene, PTFE, polyetheretherketone, PEEK, polyethylene, PE, or polyvinylidene fluoride, PVDF.

12. The high frequency adapter according to claim 2, wherein the spacer element consists of polytetrafluoroethylene, PTFE, polyetheretherketone, PEEK, polyethylene, PE, or polyvinylidene fluoride, PVDF.

13. The high frequency adapter according to claim 2, wherein the spacer element comprises polytetrafluoroethylene, PTFE, polyetheretherketone, PEEK, polyethylene, PE, or polyvinylidene fluoride, PVDF.

14. The high frequency adapter according to claim 4, wherein the process separation consists of glass and/or ceramic, and/or the conductive element consists of a nickel alloy.

15. The high frequency adapter according to claim 5, wherein the process separation consists of glass and/or ceramic, and/or the conductive element consists of a nickel alloy.

16. The high frequency adapter according to claim 6, wherein the process separation consists of glass and/or ceramic, and/or the conductive element consists of a nickel alloy.

17. The high frequency adapter according to claim 4, wherein the process separation comprises glass and/or ceramic, and/or the conductive element comprises a nickel alloy.

18. The high frequency adapter according to claim 5, wherein the process separation comprises glass and/or ceramic, and/or the conductive element comprises a nickel alloy.

19. The high frequency adapter according to claim 2, further comprising: a process separator disposed within the conductive sheath and having a conductive element passing therethrough, the conductive element being electrically connected to the inner conductor.

20. The high frequency adapter according to claim 3, further comprising: a process separator disposed within the conductive sheath and having a conductive element passing therethrough, the conductive element being electrically connected to the inner conductor.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0036] FIG. 1 shows a high frequency adapter in a longitudinal section;

[0037] FIG. 2 shows a high-frequency adapter according to an embodiment in a longitudinal section;

[0038] FIG. 3 shows a high-frequency adapter according to an embodiment in a further longitudinal section;

[0039] FIG. 4 shows a high-frequency adapter according to an embodiment in a perspective external view;

[0040] FIG. 5 shows a high-frequency adapter according to a further embodiment in a longitudinal section; and

[0041] FIG. 6 shows a flowchart according of a method according to an embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

[0042] FIG. 1 schematically shows a high frequency adapter 12 in longitudinal section. The high-frequency adapter 12 has a hollow cylindrical waveguide 20, which is set up to transmit high-frequency waves from and to a high-frequency antenna 80 (not shown). Adjacent to the waveguide 20 is a conductive jacket 50. At least partially disposed within the sheath 50 is a conductive inner conductor 40 that is electrically and mechanically connected to an impedance matching element 30. The inner conductor 40 is separated from the sheath 50 by a cavity 18. The cavity 18 may be shaped as a rotationally symmetrical cavity, e.g., in the case of a round high frequency adapter; in the case of other shapes of high frequency adapter—e.g., rectangular, hexagonal, etc.—correspondingly adapted or likewise cylindrical. In at least some cases, moisture may enter the cavity 18. This can significantly degrade the functionality of the high frequency adapter, up to and including failure of the adapter.

[0043] FIG. 2 schematically shows a high frequency adapter 10 according to an embodiment in a longitudinal section. The high-frequency adapter 10 is arranged for connecting a high-frequency antenna 80 (left side, not shown) to an antenna connector 90 (right side, not shown). The high-frequency adapter 10 has a hollow cylindrical waveguide 20, which is arranged to transmit high-frequency waves from and to the high frequency antenna 80—which is arranged on the left side of the waveguide 20. Within the waveguide 20, a step-shaped impedance matching element 30 is arranged, which is arranged for impedance matching to the high frequency antenna 80. The high frequency adapter 10 further comprises a conductive inner conductor 40 electrically and mechanically connected to the impedance matching element 30, wherein the inner conductor 40 is electrically indirectly connected—namely via a conductive element 45—to the antenna connector 90. A conductive hollow-cylindrical sheath 50 adjoins the waveguide 20. The joint between the waveguide 20 and the cladding 50 may be sealed, but in at least some cases may also allow moisture intrusion due to defects and/or long-term stresses. In at least some embodiments, the joint may be omitted. The high frequency adapter 10 further comprises an electrically insulative hollow cylindrical spacer element 60 disposed between the cladding 50 and the inner conductor 40, thereby isolating the inner conductor 40 from the cladding 50 and providing a fluid-tight seal to the waveguide 20. In at least some embodiments, the spacer element 60 may be configured to be non-fluid-tight. The spacer element 60 may be configured to “occupy” the space where condensate could form, and in this way may displace the condensate or reduce or prevent the formation of condensate. Advantageously, this can also prevent malfunction of the high-frequency adapter 10 in the event that moisture enters. The high-frequency adapter 10 further comprises a process separation 70 to further increase the robustness of the high-frequency adapter. The conductive element 45 is passed through the process separation 70.

[0044] On one side thereof, the conductive element 45 is electrically connected to the inner conductor 40. On the other side, the conductive element 45 is arranged for connection to an antenna connector 90 (right side), via the end protruding on the right side from the process separation 70 and from a sheath 55.

[0045] FIG. 3 schematically shows a high-frequency adapter 10 according to an embodiment in a further longitudinal section. Here, the same reference signs as in FIG. 2 denote the same or similar elements. Here, FIG. 3 shows particularly clearly how the spacer element 60 insulates the inner conductor 40 from the sheath 50 and in particular with the cooperation of a collar 62—also realizes a seal against the wall 50. In this embodiment example, the conductive element 45 is realized with pointed ends to further simplify assembly.

[0046] FIG. 4 schematically shows a high-frequency adapter 10 according to an embodiment in a perspective external view. Here, the same reference signs as in FIG. 2 denote the same or similar elements. In particular, the design of the impedance matching element 30 becomes clear, which in this embodiment is designed to be step-shaped and significantly narrower than an inner diameter of the waveguide. The impedance matching element 30 designed in this manner is sometimes referred to as a fin. This design may be particularly suitable for lower frequency radar bands, such as the K-band. For other frequency bands, the impedance matching element—and/or other components of the high-frequency adapter 10—may be designed at least slightly differently.

[0047] FIG. 5 schematically shows a high-frequency adapter 10 according to a further embodiment in a longitudinal section. The same reference signs as in FIG. 2 denote the same or similar elements. This embodiment does not have a process separation 70. Further, the conductive element 45 is integrally formed with the inner conductor (40) so that an antenna connector 90 (right, not shown) is electrically connected directly to the antenna connector 90. Furthermore, it is clear that a first inner diameter 52 of the sheath 50 (as also shown, for example, in FIG. 2) is smaller than a second inner diameter 22 of the waveguide 20, so that a step 25 is formed in the region of the connection between the waveguide and the sheath.

[0048] FIG. 6 shows a flowchart 100 showing a manufacturing process for a high frequency adapter 10 (see, e.g., FIG. 2 to FIG. 5) according to an embodiment form. In an optional step 102, a process separation 70 is disposed in the shell 50, wherein a conductive element 45 is passed through the process separation 70 and is adapted for electrical connection to the inner conductor 40. In a step 104, an electrically insulating spacer element 60 is disposed in conductive sheath 50. In a step 106, a conductive inner conductor 40 is inserted into the spacer element 60. In a step 108, a waveguide 20 is connected, with an impedance matching element 30 disposed within the waveguide 20.

[0049] List of Reference Signs

[0050] 10 High frequency adapter

[0051] 12 High frequency adapter

[0052] 15 Center axis

[0053] 18 Cavity

[0054] 20 Waveguide

[0055] 22 Internal diameter of the waveguide

[0056] 25 Step

[0057] 30 Impedance matching element

[0058] 40 Inner conductor

[0059] 45 Conductive element

[0060] 50 Sheath

[0061] 52 Inner diameter of the sheath

[0062] 55 Sheath

[0063] 60 Spacer element

[0064] 62 Collar of the spacer element

[0065] 70 Process separation

[0066] 80 Antenna

[0067] 90 Antenna connector

[0068] 100 Flow diagram

[0069] 102-108 steps