Electrode Assembly and Method for Manufacturing Same

Abstract

A manufacturing method according to the present invention is a method for manufacturing an electrode assembly in which a negative electrode, a separator, and a positive electrode are repeatedly stacked, the method comprising: a unit cell manufacturing step of manufacturing a unit cell having a predetermined stack structure of the negative electrode, the separator, and the positive electrode, wherein ends of the separators are bonded to each other to form a bonding portion; a film inserting step of inserting a film into a die; a unit cell stacking step of stacking the unit cell into the die; and a thermal fusing step of applying heat and a pressure to thermally fuse the film to the bonding portion of the stacked unit cell within the die. An electrode assembly assembled according to the manufacturing method is also disclosed.

Claims

1. An electrode assembly comprising: an electrode stack in which a negative electrode, a separator, and a positive electrode are repeatedly stacked, the electrode stack having two side surfaces at opposite sides of the electrode stack; and a film covering a first one of the side surfaces of the electrode stack, the film being thermally fused to the first one of the side surfaces.

2. The electrode assembly of claim 1, wherein the film is a first film, the electrode assembly further comprising a second film covering a second one of the side surfaces, the second film being thermally fused to the second one of the side surfaces.

3. The electrode assembly of claim 1, wherein the film is made of a thermoplastic material configured to be plastically deformed when subjected to heat and a pressure.

4. The electrode assembly of claim 3, wherein the film is made of a polyethylene terephthalate (PET) material.

5. The electrode assembly of claim 1, wherein two or more sheets of the separators are merged together at an end of each of the two or more sheets of the separators and bonded to each other to form a bonding portion, and the film is thermally fused to the bonding portion.

6. A method for of manufacturing an electrode assembly in which a negative electrode, a separator, and a positive electrode are repeatedly stacked, the method comprising: a unit cell manufacturing step of manufacturing a unit cell having a predetermined stack structure of the negative electrode, two or more of the separators, and the positive electrode, wherein ends of each of the separators are bonded to each other to form a bonding portion; a film inserting step of inserting a first film into a die; a unit cell stacking step of stacking the unit cell into the die; and a thermal fusing step of applying heat and a pressure to thermally fuse the film to the bonding portion of the stacked unit cell within the die.

7. The method of claim 6, wherein, during the film inserting step, the first film and a second film are inserted into the die and brought into contact with first and second opposite side wall surfaces, respectively, the first film and the second film facing each other within the die.

8. The method of claim 7, wherein the unit cell stacking step and the thermal fusing step are repeatedly performed until stacking of a predetermined number of the unit cells is completed after the film inserting step.

9. The method of claim 7, wherein the unit cell stacking step is repeated until stacking of a predetermined number of the unit cells is completed after the film inserting step, and when the unit cell stacking step is completed, the thermal fusing step is repeated to thermally fuse the first film and the second film to each of the stacked unit cells.

10. The method of claim 8, wherein, during the unit cell manufacturing step, the unit cell includes either a first type of mono cell in which the separator/the negative electrode/the separator/the positive electrode are stacked sequentially from the bottom, or a second type of mono cell in which the separator/the positive electrode/the separator/the negative electrode are stacked sequentially from the bottom.

11. The method of claim 10, wherein, during the unit cell manufacturing, the unit cell further includes either a first type of half cell in which the separator/the negative electrode/the separator are stacked sequentially from the bottom, or a second type of half cell in which the separator/the positive electrode/the separator are stacked sequentially from the bottom, while the unit cell stacking step is repeatedly performed, a plurality of the mono cells are stacked, and wherein, when the unit cell stacking step is performed for the final time, the half cell is stacked with the plurality of the mono cells.

12. The method of claim 6, wherein the film is made of a thermoplastic material which is plastically deformed when subjected to heat and a pressure, and during the thermal fusing step, the film is pressed and simultaneously heated by a tip of a soldering tool and thermally fused to the unit cell.

13. The method of claim 12, wherein the die is configured to allow the tip of the soldering tool to enter the die or configured to allow the soldering tool to be embedded in the die, and the thermal fusion of the film is performed within the die.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG. 1A is a view schematically illustrating a manufacturing process of an electrode assembly of the related art.

[0028] FIG. 1B is a view schematically illustrating a state in which a separator is folded and wrinkled in a structure of an electrode assembly of the related art.

[0029] FIG. 2 is a flow chart of a method for manufacturing an electrode assembly of the present invention.

[0030] FIG. 3 is a view illustrating a state in which, during a unit cell manufacturing step, a negative electrode, a separator, and a positive electrode are stacked on each other and manufactured as a unit cell.

[0031] FIG. 4A is a view showing: a cross-section (a) of a die in a method for manufacturing an electrode assembly of the present invention; and a state (b) in which a film is attached to the inside of the die.

[0032] FIG. 4B is a view additionally illustrating a state (c) in which a unit cell is placed between the films inside the die illustrated in FIG. 4A.

[0033] FIG. 4C is a view additionally illustrating states (c, d, and e) in which a film and a bonding portion of a unit cell are bonded to each other by a soldering tool within the die illustrated in FIG. 4B.

[0034] FIG. 5 is a view illustrating a plan view, a front view, and a left side view of an electrode assembly which is manufactured by a method for manufacturing an electrode assembly of the present invention.

MODE FOR CARRYING OUT THE INVENTION

[0035] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings so that the present invention can be easily carried out by a person skill in the art to which the present invention pertains. However, the present invention may be embodied in several different forms, and not be limited to the embodiments set forth herein.

[0036] A part unrelated to the description will be omitted so as to clearly describe the present invention, and the same reference symbols are affixed to identical or similar elements throughout the specification.

[0037] Also, terms or words used in this specification and claims should not be restrictively interpreted as ordinary meanings or dictionary-based meanings, but should be interpreted as meanings and concepts conforming to the scope of the present invention on the basis of the principle that an inventor can properly define the concept of a term to describe and explain his or her invention in the best ways.

[0038] The present invention relates to an electrode assembly in which a negative electrode 3, a separator 1, and a positive electrode 2 are repeatedly stacked on each other, and a method for manufacturing the electrode assembly. Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0039] First Embodiment

[0040] The present invention provides, as a first embodiment, a method for manufacturing an electrode assembly. As illustrated in FIG. 2 showing a sequence of a method for manufacturing an electrode assembly according to the present invention, a manufacturing method according to the embodiment comprises a unit cell manufacturing step (S10), a film inserting step (S20), a unit cell stacking step (S30), and a thermal fusing step (S40).

[0041] During the unit cell manufacturing step (S10), a unit cell 10 having a predetermined stack structure of a negative electrode 3, a separator 1, and a positive electrode 2 is manufactured, and ends of separators 1 are bonded to each other to form a bonding portion 1a.

[0042] That is, as illustrated in FIG. 3 showing a state in which a negative electrode 3, a separator 1, a positive electrode 2 are stacked on each other and manufactured into a unit cell 10, a mono cell and a half cell, each of which has a predetermined stack structure, are manufactured as a unit cell. As illustrated in the drawing, the mono cell may have a structure in which the separator 1/the positive electrode 2/the separator 1/the negative electrode 3 are stacked sequentially from the bottom or a structure in which the separator 1/the negative electrode 3/the separator 1/the positive electrode 2 are stacked sequentially from the bottom. Also, a half cell is additionally provided, in which the uppermost electrode (a positive electrode or a negative electrode) is removed from the mono cell. In order for the separator 1 to be placed on the uppermost layer after the stacking of mono cells is complete, the half cell has a structure in which the separator 1/the negative electrode 3/the separator 1 are stacked sequentially from the bottom or a structure in which the separator 1/the positive electrode 2/the separator 1 are stacked sequentially from the bottom. Thus, the half cell is stacked after stacking of mono cells is complete, and thus, an electrode assembly stacked according to the present invention has a structure in which the separator is placed in each of the lowermost layer and the uppermost layer.

[0043] Here, in the unit cell 10 manufactured with the mono cell and the half cell, the separator 1 has an area larger than each of areas of the positive electrode 2 and the negative electrode 3, and has ends protruding to both sides, respectively, as illustrated in the drawing. During the unit cell manufacturing step (S10), upper and lower surfaces of the ends of the separators 1 are bonded to each other to form the bonding portion 1a. The bonding portion 1a is not necessarily formed at all of the protruding ends of the separators 1, but it is desirable to be formed at the ends that face the film 30 when the unit cells 10 are stacked.

[0044] FIGS. 4A to 4C illustrate, in a method for manufacturing an electrode assembly of the invention: a cross-section (a) of a die M; a state (b) in which films 3 are attached inside the die M; a state (c) in which a unit cell 10 is placed between the films 30 inside the die M; and states (d and e) in which the films 30 and bonding portions 1a of unit cells 10 are bonded to each other by the soldering tool G within the die M.

[0045] Referring to FIGS. 4A to 4C, during the film inserting step (S20), the films 30 are disposed on the both inner circumferential surfaces facing each other inside the die M. The die M is manufactured to have a size enough to stack the unit cells 10 between the films 30 disposed therein and also manufactured to have sufficient strength. The die M may be configured such that the inner space thereof for stacking the unit cells 10 has a hexahedral shape, and one side surface or both side surfaces thereof on which the film 30 is not disposed may be provided in an open state so that an operation of an gripper (not shown) or the like for conveying and stacking the unit cell 10 when the unit cells 10 are stacked is not interfered.

[0046] Also, the film 30 inside the die M may be disposed in a temporarily fixed state on the inner circumferential surface of the die M so that vertically standing state thereof is maintained before thermal fusion is performed. That is, a clip, a holder, or the like for temporarily fixing the film may be installed in the die M. Alternatively, the film 30, having an adhesive with relatively weak adhesion applied on the surface thereof before disposed, may be disposed inside the die M. Such a means for temporarily fixing the film 30 may be embodied using other well-known methods as long as the film 30 may be easily separated from the inner circumferential surface of the die M after the manufacturing of the electrode assembly is completed.

[0047] Also, in order for the soldering tool G to enter when thermally fusing the film 30 and the unit cell 10, the die M may have a slit (not shown) or the like through which the soldering tool G may enter vertically or a structure in which the soldering tool G is mounted inside the die M in a slidable manner.

[0048] Next, the unit cell stacking step (S30) is performed, in a state in which the film 30 is disposed inside the die M, and the soldering tool G is ready to operate. During the unit cell stacking step (S30), the unit cells 10 are stacked at the right position between the two films 30 inside the die M. Here, each of the unit cells 10 is the mono cell as described above, and the stacking is performed such that the separator 1 is placed on a lower side.

[0049] Also, the thermal fusing step (S40) is performed, in which heat and a pressure are applied inside the die M to thermally fuse the film 30 to the bonding portion 1a of the stacked unit cell 10.

[0050] In the embodiment, the two films 30 are inserted to come into contact with both side wall surfaces, respectively, which face each other within the die M. Thus, the thermal fusion is simultaneously performed on the both side wall surfaces of the die M.

[0051] Also, FIG. 4C illustrates that the unit cell stacking step (S30) and the thermal fusing step (S40) are repeatedly performed until the stacking of predetermined unit cells 10 is completed after the film inserting step (S20). So, when one unit cell 10 is stacked, the unit cell 10 is thermally fused, and then, a next unit cell 10 is stacked and thermally fused.

[0052] However, there is no change in position of the unit cell 10 between the films 30 within the die M. Thus, the manufacturing process may be made in a manner in which, after all of the unit cells 10 are stacked without thermal fusion and in a state in which the stacking is complete, the thermal fusion of the unit cells 10 is performed sequentially from a unit cell 10 on the bottom layer (or from a unit cell from the top layer). That is, in the present invention, the order of the unit cell stacking step (S30) and the thermal fusing step (S40) may be changed flexibly.

[0053] Also, as described above, the mono cells are stacked while the unit cell stacking step (S30) is performed repeatedly, and when the unit cell stacking step (S30) is performed finally, the half cell is stacked. Thus, the electrode assembly manufactured by the above manner has a structure in which the separator 1 is disposed on each of the uppermost layer and the lowermost layer.

[0054] Here, the film 30 of the present invention is made of a thermoplastic material which is plastically deformed when subjected to heat and a pressure. For example, the film may be made of a polyethylene terephthalate (PET) material.

[0055] During the thermal fusing step (S40), the film 30 is pressed and simultaneously heated by a tip of the soldering tool G and thermally fused to the bonding portion 1a of the unit cell 10. Also, the temperature and pressure to be applied may be changed according to the thickness and material properties of the film 30 or the relative position and size of the bonding portion. Here, as described above, the die M is configured to allow the tip of the soldering tool G to enter the die or the soldering tool G to be embedded in the die, and the thermal fusion of the film 30 is performed within the die M.

[0056] Second Embodiment

[0057] The present invention provides, as a second embodiment, an electrode assembly which may be manufactured through the manufacturing method according to the first embodiment.

[0058] The electrode assembly provided in the embodiment is an electrode assembly in which a negative electrode 3, a separator 1, and a positive electrode 2 are repeatedly stacked, and the electrode assembly comprises a film 30 disposed to cover one of the side surfaces defined by stacking the negative electrode 3, the separator 1, and the positive electrode 2. The film 30 is thermally fused to the side surface defined by stacking the negative electrode 3, the separator 1, and the positive electrode 2.

[0059] That is, referring to FIG. 5 illustrating a plan view, a front view, and a left side view of the electrode assembly which is manufactured by the method for manufacturing an electrode assembly of the present invention, the negative electrode 3 and the positive electrode 2 according to the present invention have a negative electrode tab 3a and a positive electrode tab 2a protruding to the sides, respectively. The positive electrode tab 2a and the negative electrode tab 3a are configured to protrude in directions opposite to each other, and the film 30 is attached to each of the side surfaces of the electrode assembly having two sides perpendicular to the sides from which the positive electrode tab 2a and the negative electrode tab 3a protrude.

[0060] In the present invention having the configuration described above, the film 30 is thermally fused and fixed to the side surface of the electrode assembly instead of using the fixing tape and is subjected to lower pressure than pressure generated when the fixing tape of the related art is attached. Thus, the folding or wrinkling of the separator 1 occurring in the structure of the related art may be prevent.

[0061] Particularly, in the present invention, two or more sheets of the separators 1 are merged at the end to form the bonding portion 1a, and the film 30 is thermally fused to the bonding portion 1a. Thus, the separator 1 may be prevented from being folded or deformed during the thermal fusion. That is, when the thermal fusion is made, ends of the separators 1 are bonded to each other to restrict movements thereof, and in a region in which the bonding portion 1a is formed, the thickness is increased. Thus, the area of thermal fusion to the film 30 is enlarged, and fixing force may increase.

[0062] Also, in the present invention, the thermal fusion is performed right after the unit cell 10 is stacked, and then, the next unit cell 10 is stacked. Alternatively, in the present invention, the stacking of all the unit cells 10 is complete, and then, the thermal fusion is performed. Thus, the manufacturing process may be flexible according to conditions of the electrode assembly.

[0063] Also, the thermal fusion is performed within the die M by the soldering tool G that enters the die M in which the unit 10 cell is stacked or the soldering tool G that is embedded in the die. Thus, the unit cell 10 is prevented from shaking during the thermal fusing process, and more stable thermal fusion may be achieved.

[0064] Although the present invention is described by specific embodiments and drawings, the present invention is not limited thereto, and various changes and modifications may be made by a person skilled in the art to which the present invention pertains within the technical idea of the present invention and equivalent scope of the appended claims.