WIRE SAWING APPARATUS
20170361494 · 2017-12-21
Inventors
Cpc classification
B28D5/0076
PERFORMING OPERATIONS; TRANSPORTING
B28D5/045
PERFORMING OPERATIONS; TRANSPORTING
B28D5/0082
PERFORMING OPERATIONS; TRANSPORTING
Y02P70/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01L21/78
ELECTRICITY
B28D5/007
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.
Claims
1. A wire sawing apparatus, comprising: a wire configured to cut an ingot; an ingot conveyor unit configured to convey the ingot to the wire; a nozzle configured to supply slurry to the wire; and a dispersed slurry blocking unit disposed above and beside the ingot that is sewn by the wire and configured to absorb at least some of the slurry dispersed from a lateral surface of the ingot that is cut by the wire, the dispersed slurry blocking unit including a rnesh structure that absorbs the dispersed slurry.
2. The wire sawing apparatus according to claim 1, wherein the dispersed slurry blocking unit comprises: an upper portion attached to a support surface that supports the ingot conveyor unit; and an integrated portion including at least one mesh plate configured to absorb the dispersed slurry, the integrated portion being shaped so as to be attachable to or detachable from the upper portion.
3. The wire sawing apparatus according to claim 1, wherein the dispersed slurry blocking unit comprises: an upper portion attached to a support surface that supports the ingot conveyor unit; a lower portion including at least one mesh plate configured to absorb the dispersed slurry; and a lateral portion between the upper portion and the lower portion.
4. The wire sawing apparatus according to claim 3, wherein the upper portion and the lateral portion are screwed together, and the lower portion and the lateral portion are integrated.
5. The wire sawing apparatus according to claim 3, wherein the dispersed slurry blocking unit includes a slurry accommodation space defined by the upper portion, the lateral portion, and the lower portion and configured to store the dispersed slurry therein, and wherein the lower portion of the dispersed slurry blocking unit is spaced apart from the ingot with an opening interposed therebetween, the opening being configured to allow introduction of the dispersed slurry into the slurry accommodation space.
6. The wire sawing apparatus according to claim 3, wherein a distance between a bottom of the lower portion and a top of the ingot ranges from 1 cm to 2 cm.
7. The wire sawing apparatus according to claim 5, wherein the dispersed slurry blocking unit further includes an outlet port configured to discharge the slurry stored in the slurry accommodation space in a direction perpendicular to a direction in which the wire moves.
8. The wire sawing apparatus according to claim 3, wherein the at least one mesh plate includes a plurality of mesh plates stacked one above another, and wherein a size of openings in the mesh plates is reduced with increasing distance from the wire.
9. The wire sawing apparatus according to claim 3, wherein the dispersed slurry blocking unit is attachable or detachable.
10. The wire sawing apparatus according to claim 9, wherein the upper portion of the dispersed slurry blocking unit is fixed to the support surface, and wherein at least one of the lateral portion or the lower portion of the dispersed slurry blocking unit is shaped to be attachable to or detachable from the upper portion.
11. The wire sawing apparatus according to claim 3, wherein the lower portion of the dispersed slurry blocking unit is inclined in an inward direction toward the ingot.
12. The wire sawing apparatus according to claim 11, wherein the lower portion has an inclination angle ranging from 7° to 10°.
13. The wire sawing apparatus according to claim 1, wherein a bottom of the dispersed slurry blocking unit is located higher than the wire.
14. The wire sawing apparatus according to claim 1, wherein the dispersed slurry blocking unit is disposed at both a side that the wire enters and a side that the wire exits.
15. The wire sawing apparatus according to claim 1, wherein the dispersed slurry blocking unit is disposed parallel to the ingot in a longitudinal direction of the ingot.
16. The wire sawing apparatus according to claim 1, wherein the ingot conveyor unit includes: a feed table configured to lower the ingot toward the wire; a holder configured to fix the ingot to the feed table; and a beam element configured to connect the holder and the ingot to each other.
17. The wire sawing apparatus according to claim 1, further comprising: a wire roller having a groove configured to wind the wire and guide the wire; a slurry tank configured to accommodate the slurry to be supplied to the nozzle; a slurry bath configured to accommodate the slurry that has been outletted from the nozzle and used to saw the ingot; a first bobbin configured to wind the wire that is used to saw the ingot; a second bobbin configured to wind the wire that has sawn the ingot; and at least one pulley configured to change a movement path of the wire
18. The wire sawing apparatus according to claim 3, wherein the upper portion and the lateral portion are screwed together, and wherein the lower portion and the lateral portion are separated from each other and connected to each other by a connection member.
19. The wire sawing apparatus according to claim 8, where the mesh plates are stacked one above another in a direction in which the ingot conveyer unit conveys the ingot to the wire.
20. The wire sawing apparatus according to claim 8, wherein the number of the opening included in the mesh plates increases with increasing distance from the wire.
Description
DESCRIPTION OF DRAWINGS
[0022]
[0023]
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[0027]
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BEST MODE
[0038] Hereinafter, embodiments will be described in order to concretely describe the disclosure, and will be described in detail with reference to the accompanying drawings in order to assist in understanding of the disclosure. However, the embodiments disclosed here may be altered into various other forms, and the scope of the disclosure should not be construed as being limited to the described embodiments. The embodiments disclosed here are provided in order to more completely describe the disclosure to those of ordinary skill in the art.
[0039] In the description of the embodiments, when an element is referred to as being formed “on” or “under” another element, it can be directly “on” or “under” the other element or be indirectly formed with intervening elements therebetween. It will also be understood that “on” or “under” the element may be described relative to the drawings.
[0040] In addition, relative terms such as, for example, “first”, “second”, “upper” and “lower”, used in the following description may be used to distinguish any one substance or element with another substance or element without requiring or containing any physical or logical relationship or sequence between these substances or elements.
[0041]
[0042] Referring to
[0043] An ingot I may be cut into a wafer form by the wire W. The wire W or 112 and 114 may be formed of carbon steel.
[0044] The ingot conveyor unit 120 serves to convey the ingot I toward the wire W.
[0045]
[0046] Referring to
[0047] The feed table 122 may lower the ingot I toward the wire W. The feed table 122 serves to apply pressure to the holder 124 so as to convey the ingot I toward the wire W. That is, the feed table 122 may lower the ingot I toward the wire W so that the entire diameter R of the ingot I may be wholly sawn.
[0048] The holder 124 serves to fix the ingot I to the feed table 122. For example, with a tong-type fixing manner, the feed table 122 may serve as tongs, and the holder 124 may be a part to be gripped by the tongs. For example, although the material of the holder 124 may be CaCO.sub.3, embodiments are not limited as to the material of the holder 124.
[0049] The beam element 126 serves to connect the holder 124 and the ingot I to each other.
[0050] Referring again to
[0051] For example, the slurry S stored in the slurry tank 160 is supplied to the respective nozzles 132 and 134 through the pipe 136, and the nozzles 132 and 134 serve to spray the supplied slurry S toward the wire W.
[0052] The wire rollers 152 and 154 have grooves, which allow the wire W to be wound therearound and guide the wire W, and serve to rotate the wire W. The wire rollers 152 and 154 may be realized by applying a polyurethane resin around a steel-made cylinder and forming grooves in the surface thereof at a constant pitch.
[0053] The slurry tank 160 serves to accommodate the slurry S to be supplied to the nozzles 132 and 134. The agitator 162 serves to stir the slurry S accommodated in the slurry tank 160 so as to prevent the slurry S from solidifying.
[0054] The slurry bath 170 serves to accommodate the slurry S, which has been outletted from the nozzles 132 and 134 and used when sawing the ingot I. Although the slurry S accommodated in the slurry bath 170 may be recycled by being accommodated in the slurry tank 160 through the pipe 172, embodiments are not limited thereto.
[0055] The first bobbin 182 serves to wind the new wire 112, which is used to saw the ingot I, and the second bobbin 184 serves to wind the old wire 114, which has sawn the ingot I.
[0056] The pulleys 191 to 195 serve to change the path along which the wires 112 and 114 move.
[0057] Meanwhile, the dispersed slurry blocking unit 140 may be disposed on the lateral side of the ingot I to be sawn by the wire W, and may absorb at least some of the slurry dispersed from the lateral surface of the ingot I, which is cut by the wire W. To this end, the dispersed slurry blocking unit 140 may have a mesh structure in order to absorb the dispersed slurry S.
[0058] The dispersed slurry blocking unit 140 may also be applied to a wire sawing apparatus having a structure different from that of the wire sawing apparatus 100 illustrated in
[0059]
[0060] Referring to
[0061] In addition, the dispersed slurry blocking unit 140 or 140A illustrated in
[0062] Referring again to
[0063] The upper portion 142A of the dispersed slurry blocking unit 140A may be attached to a support surface 122A, which supports the ingot conveyor unit 120. In the case of
[0064] The lateral portion 144A of the dispersed slurry blocking unit 140A is located between the upper portion 142A and the lower portion 146A. Here, as illustrated in
[0065] In addition, the dispersed slurry blocking unit 140A may include a slurry accommodation space 143 in which the dispersed slurry S is stored. The slurry accommodation space 143 may be defined by the upper portion 142A, the lateral portion 144A, and the lower portion 146A.
[0066] In addition, the lower portion 146A of the dispersed slurry blocking unit 140A may be spaced apart from the ingot I so that an opening OP is present to allow the dispersed slurry S to be introduced into the slurry accommodation space 143. That is, the opening OP must necessarily be provided in order to allow the dispersed slurry to be introduced into the slurry accommodation space 143.
[0067] In addition, the lower portion 146A of the dispersed slurry blocking unit 140A may include at least one mesh plate, which absorbs the dispersed slurry S. That is, the mesh structure that absorbs the dispersed slurry S may be realized in a plate form.
[0068]
[0069] Although not illustrated in
[0070] The first to third mesh plates 146AA, 146AB and 146AC may be disposed with being stacked one above another in the vertical direction, i.e. in the z-direction, in which the ingot conveyor unit 120 conveys the ingot I to the wire W.
[0071] In the case of
[0072] In addition, in each of the first to third mesh plates 146AA, 146AB, and 146AC, the size of respective openings in the mesh may be reduced with increasing distance from the wire W. For example, when the y-axis length of the opening in the mesh is “a” and the x-axis length of the opening in the mesh is “b”, the size ab of the openings in the mesh may be reduced as the distance between the mesh plates 146AA, 146AB, and 146AC and the wire W increases.
[0073] Comparing
[0074]
[0075] The more the size of the openings is small, the more the number of openings included in a given area increases. That is, referring to
[0076] As described above, the reason why the size of the openings in the mesh plate is reduced with increasing distance from the wire W is to allow the first to third mesh plates 146AA, 146AB, and 146AC to more efficiently absorb the slurry because the force by which the slurry is dispersed becomes stronger with decreasing distance to the wire W and the force by which the slurry is dispersed becomes weaker with increasing distance to the wire W.
[0077] In addition, referring again to
[0078] In addition, the bottom of the dispersed slurry blocking unit 140A, i.e. the lowermost portion thereof, may be located higher than the position of the wire W. This serves to prevent the dispersed slurry blocking unit 140A from coming into contact with and being cut by the wire W when the wire W saws the top IT of the ingot I.
[0079] In addition, the dispersed slurry blocking unit 140 illustrated in
[0080]
[0081] An upper portion 142B of the dispersed slurry blocking unit 140B illustrated in
[0082] According to another embodiment, unlike the illustration of
[0083]
[0084] Referring to
[0085] As described above, the dispersed slurry blocking unit 140B has the same characteristics as the dispersed slurry blocking unit 140A illustrated in
[0086] Accordingly, the features of the dispersed slurry blocking unit 140B illustrated in
[0087]
[0088] Referring to
[0089] As described above, the dispersed slurry blocking unit 140C illustrated in
[0090] Meanwhile, referring to
[0091] Conversely, when the wire W moves in the -x-direction, the right side of the ingot I corresponds to the side that the wire W enters, and the left side of the ingot I corresponds to the side that the wire W exits.
[0092] The wire W may be reciprocally moved by a motor (not illustrated) in the +x-direction and in the −x-direction in order to saw the ingot I. As such, the dispersed slurry blocking unit 140, 140A, 140B or 140C may be disposed on each of the left and right sides of the ingot I. However, embodiments are not limited thereto. That is, according to another embodiment, the dispersed slurry blocking unit 140, 140A, 140B or 140C may be disposed only on the left side or the right side of the ingot I, unlike the illustrations of
[0093]
[0094] Referring to
[0095] Hereinafter, the features of the wire sawing apparatus 100 according to the embodiment having the above-described configuration will be described with reference to the accompanying drawings.
[0096]
[0097]
[0098] The ingot I, the holder 124, the beam element 126, the nozzles 132 and 134, and the wire rollers 152 and 154 illustrated in
[0099] Referring to
[0100] In succession, until the ingot I is sawn in the +z-direction from the point of 3R/5 to the point of 4R/5 by the wire W, the slurry S between the wire W and the ingot I is dispersed in the directions indicated by the arrows due to the circular shape of the ingot I, as illustrated in
[0101] In succession, until the ingot I is sawn beyond 4R/5 position among the entire diameter R of the ingot I to the top IT of the ingot I by the wire W, the slurry S between the wire W and the ingot I is dispersed in the direction indicated by the arrow, as illustrated in
[0102]
[0103] Referring to
[0104] In consideration of this, the inclination angle θ may be set within the range from 7° to 10° in which the slurry storage capability 210 and the slurry absorption capability 220 become equal to each other.
[0105]
[0106] The holder 124, the beam element 126, and the feed rollers 152 and 154 in
[0107] In
[0108] In the case of the wire sawing apparatus according to the first comparative example illustrated in
[0109] In addition, when the wire sawing apparatus according to the second comparative example illustrated in
[0110] However, when the dispersed slurry blocking unit 140 has a mesh structure as in the wire sawing apparatus 100 according to the embodiment illustrated in
[0111] This is because the quantity of movement of the dispersed slurry S is reduced in proportion to the increase in the area over which the dispersed slurry S comes into contact with the dispersed slurry blocking unit 140. This is based on the same principle by which a breakwater is designed to have a block shape, rather than a planar shape. In addition, for example, since the specific gravity of the slurry S is within a high range, from 1.3 to 1.8, and the viscosity of the slurry S is within a high range, from 200 cP to 500 cP, when the contact area between the dispersed slurry and the dispersed slurry blocking unit 140 is increased by the mesh structure, the effect may be greater. In this way, when the lower portion of the dispersed slurry blocking unit 140 has a mesh structure, the dispersed slurry may be absorbed, rather than being reflected, which may effectively reduce the magnitude of shock caused when the slurry collides with the dispersed slurry blocking unit 140.
[0112]
[0113] Referring to
[0114] On the other hand, it can be seen that, in the case of the wire sawing apparatus according to the embodiment illustrated in
[0115] Although the embodiments have been described above, the above description is merely illustrative and is not intended to limit the disclosure, and those skilled in the art will appreciate that various modifications and applications, which are not illustrated above, are possible without departing from the essential characteristics of the embodiments. For example, respective constituent elements, which are concretely illustrated in the embodiments, may be implemented in modified forms. In addition, differences associated with these modifications and applications should be construed as within the scope of the disclosure defined in the accompanying claims.
MODE FOR INVENTION
[0116] Various embodiments have sufficiently been described in the above-described “best mode” to implement the disclosure.
INDUSTRIAL APPLICABILITY
[0117] A wire sawing apparatus according to the embodiment may be used in an apparatus of manufacturing a wafer by sawing an ingot using a wire.