Liquid-cooled-type cooling device and manufacturing method for same
09845999 · 2017-12-19
Assignee
Inventors
Cpc classification
F28F3/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/084
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
H01L2924/0002
ELECTRICITY
F28F2275/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F1/40
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y10T29/4935
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01L2924/0002
ELECTRICITY
H01L2924/00
ELECTRICITY
B23P11/00
PERFORMING OPERATIONS; TRANSPORTING
H01L2924/00
ELECTRICITY
F28F2275/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F3/022
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F28F3/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F1/40
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23P11/00
PERFORMING OPERATIONS; TRANSPORTING
F28F21/08
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F3/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A liquid-cooled-type cooling device includes a casing having a top wall, a bottom wall, and a cooling-liquid passage, and a radiating member disposed in the cooling-liquid passage. The radiating member has a substrate and a plurality of pin-shaped fins. Longitudinally intermediate portions of the pin-shaped fins are brazed to the substrate. The substrate has a plurality of fin insertion holes, and the pin-shaped fins are inserted into the fin insertion holes of the substrate. A plurality of convex portions are integrally formed on the longitudinally intermediate portion of each pin-shaped fin. The substrate and the pin-shaped fins are provisionally fixed together by plastically deforming the convex portions such that they are crushed. In this state, the substrate and the pin-shaped fins are brazed together. The upper and lower end portions of the pin-shaped fins are brazed to the top wall and bottom wall, respectively, of the casing.
Claims
1. A liquid-cooled-type cooling device comprising: a casing which has a top wall and a bottom wall opposite to the top wall in a height direction of the liquid-cooled-type cooling device and in which a cooling-liquid passage is provided; and a radiating member disposed in the cooling-liquid passage within the casing, comprising: a substrate provided between the top wall and the bottom wall separately from the top wall and the bottom wall in the casing and having fin insertion holes which pass through the substrate in the height direction and each of which has an inner wall to define each of the fin insertion holes; and pin-shaped fins each of which has an upper end portion and a lower end portion opposite to the upper end portion in the height direction and which are inserted into the fin insertion holes, respectively, to pass through the substrate such that both of the upper end portion and the lower end portion project from the substrate in the height direction, each of the pin-shaped fins having at least one convex portion opposite to each of the fin insertion holes, the at least one convex portion being provided between the upper end portion and the lower end portion on an outer peripheral surface of each of the pin-shaped fins to project from the outer peripheral surface such that at least one of the inner wall and the at least one convex portion deforms to connect the pin-shaped fins to the substrate, the pin-shaped fins and the substrate being brazed together, the upper end portion and the lower end portion which project from the substrate in the height direction being brazed to the top wall and bottom wall, respectively.
2. The liquid-cooled-type cooling device according to claim 1, wherein the substrate has a Vickers hardness that is greater than the pin-shaped fins and the plurality of convex portions; and of the plurality of convex portions and the portions of the substrate around the fin insertion holes, at least the plurality of convex portions have deformed portions.
3. The liquid-cooled-type cooling device according to claim 1, wherein the pin-shaped fins and the plurality of convex portions have a Vickers hardness that is greater than the substrate; and of the plurality of convex portions and the portions of the substrate around the fin insertion holes, at least the portions of the substrate around the fin insertion holes have deformed portions.
4. The liquid-cooled-type cooling device according to claim 2, wherein a portion of each pin-shaped fin where the convex portion is not provided has a circular transverse cross section; and convex portions and concave portions are formed on the longitudinally intermediate portion of each pin-shaped fin alternately and continuously in the circumferential direction such that the convex portions project radially outward from the peripheral surface of the intermediate portion, and the concave portions descend radially inward from the peripheral surface of the intermediate portion.
5. A liquid-cooled-type cooling device according to claim 4, wherein the fin insertion holes of the substrate are circular and have a diameter of 0.5 to 6 mm; a portion of each pin-shaped fin where neither the convex portions nor the concave portions are provided has a diameter of 0.3 to 5.99 mm; and the concave portions have a depth of 0.05 to 0.6 mm.
6. The liquid-cooled-type cooling device according to claim 3, wherein a portion of each pin-shaped fin where the convex portion is not provided has a circular transverse cross section; and convex portions and concave portions are formed on the longitudinally intermediate portion of each pin-shaped fin alternately and continuously in the circumferential direction such that the convex portions project radially outward from the peripheral surface of the intermediate portion, and the concave portions descend radially inward from the peripheral surface of the intermediate portion.
7. The liquid-cooled-type cooling device according to claim 6, wherein the fin insertion holes of the substrate are circular and have a diameter of 0.5 to 6 mm; a portion of each pin-shaped fin where neither the convex portions nor the concave portions are provided has a diameter of 0.3 to 5.99 mm; and the concave portions have a depth of 0.05 to 0.6 mm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DESCRIPTION OF THE PREFERRED EMBODIMENT
(13) An embodiment of the present invention will next be described with reference to the drawings.
(14) In the specification and appended claims, the term “aluminum” encompasses aluminum alloys in addition to pure aluminum.
(15)
(16) As shown in
(17) The casing 2 is formed by brazing together an upper constituent member 5 which is made of aluminum and which constitutes the top wall 2a and the upper half of the peripheral wall 2c, and a lower constituent member 6 which is made of aluminum and which constitutes the bottom wall 2b and the lower half of the peripheral wall 2c. An inlet pipe 7 and an outlet pipe 8, which are made of aluminum, are connected to the top wall 2a of the casing 2. The inlet pipe 7 is used to supply a cooling liquid to the cooling-liquid passage 3 within the casing 2. The outlet pipe 8 is used to discharge the cooling liquid from the cooling-liquid passage 3 within the casing 2. A heat-generating body P is attached to at least one of the outer surface of the top wall 2a of the casing 2 and the outer surface of the bottom wall 2b thereof (in the present embodiment, to the outer surface of the top wall 2a). The heat-generating body P may be a power device such as an IGBT, an IGBT module in which an IGBT is integrated with a control circuit and is accommodated in the same package, or an intelligent power module in which an IGBT module is integrated with a protection circuit and is accommodated in the same package.
(18) The radiating member 4 is composed of a substrate 11 made of aluminum and a plurality of pin-shaped fins 13 made of aluminum. As shown in
(19) Next, a method of manufacturing the liquid-cooled-type cooling device 1 will be described with reference to
(20) First, the upper and lower constituent members 5 and 6 of the casing 2, and the substrate 11 and the plurality of pin-shaped fins 13 of the radiating member 4 are prepared. The plurality of circular fin insertion holes 12 are formed in the substrate 11 such that they extend through the substrate 11. As shown in
(21) In the present embodiment, the aluminum used to form the upper constituent member 5, the lower constituent member 6, the substrate 11, and the pin-shaped fins 13 has a Vickers hardness of 10 to 250, and, preferably, the substrate 11 is made harder than the pin-shaped fins 13. For example, preferably, the Vickers hardness of the substrate 11 is made greater than that of the pin-shaped fins 13 by about 20.
(22) Preferably, an imaginary shape formed by connecting the projecting ends of all the convex portions 14 is a circle whose diameter is greater than the diameter of the fin insertion holes 12 of the substrate 11. Preferably, each of the fin insertion holes 12 has a diameter of 0.5 to 6 mm, and each of the pin-shaped fins 13 has a diameter of 0.3 to 5.99 mm as measured in a region where the convex portions 14 are not provided. Preferably, within these ranges, the diameter A (mm) of each fin insertion hole 12, the diameter B (mm) of each pin-shaped fin 13 at a portion where the convex portions 14 are not provided, and the diameter C (mm) of the imaginary circle connecting the projecting ends of all the convex portions 14 are determined such that relations A−0.2≦B≦A−0.01 and A+0.01≦C≦A+0.2 are satisfied. Also, preferably, the length of the convex portions 14 as measured in the longitudinal direction of the pin-shaped fins 13 is 0.5 to 5 mm.
(23) Subsequently, all the pin-shaped fins 13 are inserted into the fin insertion holes 12 of the substrate 11 such that a portion of each pin-shaped fin 13 extending from one end thereof to the convex portions 14 passes through the corresponding fin insertion hole 12 (see
(24) Alternatively, the pin-shaped fins 13 may be made harder than the substrate 11; for example, the Vickers hardness of the pin-shaped fins 13 may be made greater than that of the substrate 11 by about 20. In this case, when each pin-shaped fin 13 is press-fitted into the corresponding fin insertion hole 12, of the convex portions 14 of each pin-shaped fin 13 and a portion of the substrate 11 around the corresponding fin insertion hole 12, at least the portion of the substrate 11 around the corresponding fin insertion hole 12 is plastically deformed, whereby the pin-shaped fins 13 are provisionally fixed to the substrate 11.
(25) After that, the substrate 11 and the pin-shaped fins 13 provisionally fixed to the substrate 11 are combined with the members constituting the casing 2, and the substrate 11 and the pin-shaped fins 13 are brazed together. Simultaneously with this, the opposite end portions of the pin-shaped fins 13 are brazed to portions of the members constituting the casing 2 which portions are to become the top wall 2a and the bottom wall 2b. Thus, the liquid-cooled-type cooling device 1 is manufactured.
(26) Notably, in the case where the substrate 11 and the pin-shaped fins 13 is brazed together, preferably, the substrate 11 is formed from an aluminum brazing sheet having a brazing material layer on at least one of the opposite sides thereof. In the case where the opposite end portions of the pin-shaped fins 13 are brazed to the upper and lower constituent members 5 and 6 of the casing 2, preferably, each of the upper and lower constituent members 5 and 6 is formed from an aluminum brazing sheet having a brazing material layer on at least one of the opposite sides thereof such that the brazing material layer is located on the inner surface side. Also, the brazing between the opposite end portions of the pin-shaped fins 13 and the upper and lower constituent members 5 and 6 of the casing 2 may be performed through utilization of brazing material films disposed between the pin-shaped fins 13 and the upper and lower constituent members 5 and 6.
(27) The inlet pipe 7 and the outlet pipe 8 may be brazed to the upper constituent member 5 simultaneously with the operation of brazing the substrate 11 and the pin-shaped fins 13 and brazing the pin-shaped fins 13 and the upper and lower constituent member 5 and 6. Alternatively, the inlet pipe 7 and the outlet pipe 8 may be joined to the upper constituent member 5 by a proper method after the operation of brazing the substrate 11 and the pin-shaped fins 13 and brazing the pin-shaped fins 13 and the upper and lower constituent member 5 and 6.
(28) In the above-described embodiment, the upper and lower constituent member 5 and 6, the substrate 11 and the pin-shaped fins 13 are made of aluminum. However, these components may be made of copper (including copper alloy). The copper (including copper alloy) which constitutes the upper and lower constituent member 5 and 6, the substrate 11 and the pin-shaped fins 13 has a Vickers hardness of 50 to 300. In some cases, as in the above-described embodiment, the substrate 11 is made harder than the pin-shaped fins 13; for example, the Vickers hardness of the substrate 11 is made greater than that of the pin-shaped fins 13 by about 20. In some cases, the pin-shaped fins 13 is made harder than the substrate 11; for example, the Vickers hardness of the pin-shaped fins 13 is made greater than that of the substrate 11 by about 20.
(29)
(30) A pin-shaped fin 40 shown in
(31) Preferably, the pin-shaped fin 40, excluding the portion where the convex portions 41 and the concave portions 42 are provided, has a circular transverse cross section having a diameter of 0.3 to 5.99 mm, and an imaginary shape formed by connecting the projecting ends of the plurality of the convex portions 41 is a circle having a diameter greater than the diameter of the fin insertion holes 12 of the substrate 11. Preferably, within these ranges, the diameter A (mm) of each fin insertion hole, the diameter B (mm) of the pin-shaped fin at a portion where the convex portions are not provided, and the diameter C (mm) of the imaginary circle connecting the projecting ends of all the convex portions are determined such that relations A−0.2≦B≦A−0.01 and A+0.01≦C≦A+0.2 are satisfied. Also, preferably, the length of the convex portions 41 as measured in the longitudinal direction of the pin-shaped fin 40 is 0.5 to 5 mm, and the depth of the concave portions 42 is 0.05 to 0.6 mm.
(32) Although not shown in the drawings, the pin-shaped fin 40 is fabricated as follows. A longitudinally intermediate portion of the peripheral surface of a cylindrical columnar fin material is pressed by a single die from the radially outer side at a plurality of locations spaced from each other in the circumferential direction, whereby the plurality of concave portion 42 descending from the peripheral surface are formed at predetermined intervals in the circumferential direction. As a result of formation of the concave portion 42, the material flows whereby a convex portion 41 is formed between the adjacent concave portions 42.
(33) As in the above-described embodiment, the upper and lower constituent member 5 and 6, the substrate 11, and the pin-shaped fin 40 are made of aluminum or copper (including copper alloy). The pin-shaped fin 40 and the substrate 11 have the same relation as in the above-described embodiment in terms of Vickers hardness. That is, the aluminum which constitutes the upper and lower constituent member 5 and 6, the substrate 11, and the pin-shaped fin 40 has a Vickers hardness of 10 to 250, and the copper (including copper alloy) which constitutes the upper and lower constituent member 5 and 6, the substrate 11, and the pin-shaped fin 40 has a Vickers hardness of 50 to 300. There exist a case where the substrate 11 is harder than the pin-shaped fin 40 and a case where the pin-shaped fin 40 is harder than the substrate 11. However, in ether case, preferably, the Vickers hardness of the harder component is made greater than that of the other softer component by about 20.
(34) A method of manufacturing the liquid-cooled-type cooling device 1 using the pin-shaped fin 40 shown in
(35)
(36) A pin-shaped fin 20 shown in
(37) As in the above-described embodiment, the upper and lower constituent member 5 and 6, the substrate 11, and the pin-shaped fin 20 are made of aluminum or copper (including copper alloy). The pin-shaped fin 20 and the substrate 11 have the same relation as in the above-described embodiment in terms of Vickers hardness.
(38) A method of manufacturing the liquid-cooled-type cooling device 1 using the pin-shaped fin 20 shown in
(39)
(40) As shown in
(41) The structure of the remaining portion is the same as that of the radiating member 4 of the liquid-cooled-type cooling device 1 shown in
(42) Next, a method of manufacturing the liquid-cooled-type cooling device 1 including the radiating member 30 shown in
(43) First, the upper and lower constituent members 5 and 6 of the casing 2, and the substrate 32 and the plurality of pin-shaped fins 31 of the radiating member 4 are prepared. Preferably, the diameter D (mm) of the fin insertion holes 33 and the diameter E (mm) of the pin-shaped fins 31 satisfy a relation D−0.2≦E≦D−0.01.
(44) Subsequently, after all the pin-shaped fins 31 have been inserted into the fin insertion holes 33 of the substrate 32 from their lower ends, one surface of the substrate 32 is supported by an unillustrated die having holes for partially receiving the pin-shaped fins 31. The die has upward projecting annular projections provided at positions corresponding to the fin insertion holes 33 of the substrate 32. Subsequently, portions of the other surface of the substrate 32 around the fin insertion holes 33 are pressed toward the die through use of a punch which has annular projections, whereby the opposite surfaces of the substrate 32 are pressed inward around the fin insertion holes 33. As a result, portions of the substrate 32 around the fin insertion holes 33 are elastically deformed, whereby the pin-shaped fins 31 are provisionally fixed to the substrate 32.
(45) After that, the substrate 32 and the pin-shaped fins 31 provisionally fixed to the substrate 32 are combined with the members constituting the casing 2, and the substrate 32 and the pin-shaped fins 31 are brazed together, and, simultaneously, the opposite end portions of the pin-shaped fins 31 are brazed to portions of the members constituting the casing 2 which portions will become the top wall 2a and the bottom wall 2b. Thus, the liquid-cooled-type cooling device 1 is manufactured.
(46) Notably, the brazing between the substrate 32 and the pin-shaped fins 31 and the brazing between the opposite end portions of the pin-shaped fins 31 and the upper and lower constituent members 5 and 6 of the casing 2 are performed in the same manner as that shown in
(47) Although the above-described pin-shaped fins 13, 40, 20, 31 have the shape of a circular column having a circular transverse cross section, the shape of the pin-shaped fins is not limited thereto, and the transverse cross sectional shape of the pin-shaped fins may be a polygon (e.g., triangle, rectangle), an ellipse, or the like. Also, in addition to the fin insertion holes 12, 33, through which the pin-shaped fins 13, 20, 31 are inserted, cooling-liquid flow channels may be formed in the substrate 11, 32 of the radiating member 4, 30 so as to mix the cooling liquid present above the substrate 11, 32 within the casing 2 and the cooling liquid present below the substrate 11, 32, to thereby improve the cooling performance.
(48) The liquid-cooled-type cooling device of the present invention is suitably used to cool a power device such as IGBT, which is used in a power conversion apparatus mounted on an electric vehicle, a hybrid vehicle, an electric railcar, or the like.