APPARATUS AND METHOD FOR ELECTROCHEMICAL QUALITY CONTROL OF ELECTRICALLY CONDUCTING OBJECTS
20170350849 · 2017-12-07
Inventors
Cpc classification
G01N17/00
PHYSICS
H01L22/14
ELECTRICITY
International classification
Abstract
In order to test wafers, microchips and the like, electrical and/or electrochemical properties thereof are periodically measured using electrochemical processes and are stored. The test values are compared with each other in order to determine changes in the properties. The method is carried out using an apparatus designed as a measuring cell and including a test chamber which is located between an upper half-cell and a lower half-cell and through which electrolyte is conducted. The test chamber is closed by a cell cover which simultaneously presses a wafer against an O-seal in the direction of the upper half-cell. The opening forming the test chamber in the lower half-cell is closed by an O-seal, an anode disk and an anode cover.
Claims
1. Method for testing electrically conducting objects, comprising steps of: periodically detecting electrical properties of the objects electrochemically, storing characteristics of the thus detected electrical properties, applying statistical methods in order to compare the thus detected characteristics of electrical properties of various objects to one another, determining a tendency of changes in characteristics of the electrical properties, and evaluating the tendency to detect changes in electrical properties of objects.
2. Method according to claim 1, wherein as electrical properties, current-voltage curves, current-time curves, voltage-time curves, impedance, resistance or capacity are detected.
3. Method according to claim 2, wherein as characteristics of the curves, an increase in the current in the case of a defined voltage or in the voltage in the case of a defined time, various objects can be compared to one another.
4. Method according to claim 1, wherein electrical properties of objects are detected periodically and at specified intervals.
5. Method according to claim 1, wherein a comparison of characteristics of electrical properties of objects produced in succession is made.
6. Method according to claim 1, wherein a comparison of characteristics of electrical properties of objects produced in succession is made using statistical methods.
7. Method according to claim 1, wherein a comparison of characteristics of electrical properties of an object with the mean values of the characteristics of electrical properties of objects produced in advance is made.
8. Method according to claim 1, wherein the properties of electrically conductive layers, surfaces and/or interfaces of objects are detected.
9. Method according to claim 1, wherein characteristics of current-voltage-time curves or current-time curves are detected at selected points thereof, which points are characteristic of the quality of the surface of the object, in particular a cathode surface (wafer surface), cathode layer or cathode interface.
10. Device for testing electrically conducting objects for executing the method according to claim 1, the device comprising: A measuring cell with a test chamber (7) through which the electrolyte flows, A holding device for the object to be tested in the cell, An inlet opening (41) and an outlet opening (43) for the electrolyte into and from the test chamber (7) of the device (1), At least one anode (35), At least one contact pin (17) that is to be placed on the object (19) that is to be tested in order to contact the latter, and At least one reference electrode (31).
11. Device according to claim 10, wherein the anode is designed as an anode plate (25).
12. Device according to claim 10, wherein instead of the anode plate (25), a plate with at least two chemically inert electrodes, which are poled as a cathode and a reference electrode, is used. In this case, the anode plate (25) can be used instead of the object (19).
13. Device according to claim 10, wherein the measuring cell comprises two cover parts (21, 27) and a middle part that is arranged between the latter, and wherein the test chamber (7) is provided in the middle part.
14. Device according to claim 13, wherein the middle part is formed by an upper half cell (5) and a lower half cell (3).
15. Device according to claim 11, wherein the anode plate (25) is arranged between an anode cover (27) and the middle part, in particular the lower half cell (3) thereof.
16. Device according to claim 14, wherein a seal 13 is provided on the side of the middle part that is near to the object to be tested.
17. Device according to claim 16, wherein the seal (13) rests on the object (19) to be tested, in particular the wafer to be tested.
18. Device according to claim 13, wherein the test chamber (7), an opening (41) is provided to let electrolytes into the test chamber (7) and wherein another opening (43) is provided for electrolytes to exit from the test chamber (7).
19. Device according to claim 18, wherein the openings (41 and 43) are provided in the lower half cell (3).
20. Device according to claim 13, wherein the test chamber (7) is formed by recesses in the half cells (3 and 5) and is closed by the cover parts (21 and 27).
21. Device according to claim 13, wherein a cover part is a cell cover (21) and the other cover part is an anode cover (27).
22. Device according to claim 10, wherein the test chamber (7) is inclined horizontally at an acute angle, in particular at 45°.
Description
[0045] Additional details and characteristics of the method according to the invention and the device according to the invention follow from the description below with reference to the attached drawings. Here:
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[0052] In the embodiment shown in
[0053] A ring seal 13 is provided encircling an opening 11 in the upper half cell 5. Outside of the ring seal 13, there is a film 15 with contact pins 17 for contacting the wafer 19. The wafer 19 to be tested is placed with its front side downward on the contact pins 17. Finally, the device 1 according to the invention is closed off above by a cell cover 21.
[0054] On the underside of the lower half cell 3, a ring seal 23 is provided, whereby the ring seal 23, for example in the form of an O-ring, is provided between the lower half cell 3 (underside thereof) and an anode plate 25. Below, i.e., outside of, the anode plate 25, an anode cover 27 is provided. In the area of the anode cover 27, an anode contact 29 is provided. Also, two or more contacts, e.g., on the edge of the anode plate 25, can also be provided.
[0055] In a recess in the lower half cell 3, a reference electrode 31 is arranged, which electrode is electrically contacted using a reference electrode contact 33. The wafer 19, which is oriented with its front side downward, i.e., in the direction toward the upper half cell 5, is contacted via a contact 35 and the film 15. The contact 35 is guided from below until it touches the film 15.
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[0058] In
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[0060] In addition,
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[0064] The cell cover of the device according to the invention can contain a plug that can move normally with respect to the back side of the wafer 19 and that is adapted by gas pressure to the back side of the wafer 19. Thus, the front side of the wafer presses on the ring seal, and the test chamber is therefore sealed. This has the advantage that wafers 19 of various thicknesses can be inserted, e.g., bonded and thus thicker wafers 19, and this also has the advantage that the pressing force can be varied (ring seals of various hardnesses).
[0065] A corresponding arrangement is provided on the underside of the device 1 according to the invention, so that here, too, the anode plate 25 is pressed tightly against the ring seal 23 with a preset path and thus a preset pressing power by the stepped edge design between the middle part (cell frame or frame part) and the underlying anode cover 27 in
[0066] In the case of the device according to the invention, the sealing of the wafer is carried out either, as is usual, on the edge of the wafer or else also directly on the microchips or in general within the wafer surface.
[0067] With a seal directly on the microchips or away from the edge of the wafer 19, it is possible to measure wafers with varying diameters but a constant size of the ring seal (O-ring) with constant cell geometry.
[0068] Thus, the measuring signals, which are obtained from different wafer sizes, can be compared directly to one another. This produces a greater flexibility, since different wafer sizes can be measured, which in addition produces a lower expense in the case of managing measuring data, which is transparent and thus reliable.
[0069] Preferably, the wafer 19 is contacted with two or more than two contact pins 17, which are arranged distributed uniformly on the film 15 over the periphery of the wafer.
[0070] The sealing forces (the extent of the pressing, the O-rings provided as ring seals 13 and 23) are defined by impact of the cell cover 21 and the anode cover 27 on the cell frame, which is formed by the half cells 3 and 5.
[0071] It is preferred when the device 1 according to the invention is obliquely oriented horizontally by an acute angle, e.g., 45°, and the wafer 19 is arranged in such a way that its wafer front side points downward and comes into contact with the electrolyte, which flows through the test chamber 7.
[0072] Since a vertical orientation of the device 1 is not possible (falling out of the ring seal 13) and a horizontal orientation of the device 1 can be disadvantageous, since gas bubbles, which have an electrically insulating effect, can collect and accumulate, the above-mentioned oblique orientation of the device 1 according to the invention is advantageous.
[0073] For each measurement of the properties, a (new) test wafer is required. The test wafer is produced in a normal production process with usual wafers, added to the device 1 according to the invention as a measuring apparatus, whereby test wafers can be reused multiple times (can be recycled), so that for this purpose, there are no high costs.
[0074] Thanks to the arrangement of the device 1 according to the invention at an acute angle to the horizontal and at an advantageous working height, as well as the position of the wafer 19 within the device 1 and the described design of the ring seal 13, a wafer 19 can be inserted quickly and securely (manually or automatically) into the device 1 and can be removed from the latter.
[0075] In the case of the device 1 according to the invention, it is provided that the electrolyte enters through the opening 41 into the test chamber 7 of the device 1, flows in a laminar flow through the test chamber 7, and leaves the latter again through the opening 43 and enters the plant infrastructure.
[0076] The plant infrastructure contains at least one tank for the electrolyte, but preferably multiple electrolyte tanks, and a pump (e.g., a centrifugal pump) for uniform circulation of the electrolyte, a tank for ultrapure water or at least a connection for ultrapure water for flushing the device 1 with water, a connection for inert gas for drying the device 1, and in addition the necessary valves, lines, regulators and measuring instruments.
[0077] The at least one guide 37 that is provided in the test chamber 7 of the device 1 supports the device 1 in the area of the test chamber 7 and is advantageous for a laminar design of the flow through the test chamber 7.
[0078] The at least one guide 37 can also be the point at which a chemically inert reference electrode 31 is inserted in wire or sheet form into the test chamber 7. As an alternative, the reference electrode 31 can also be designed by a reference electrode of the second type according to the state of the art.
[0079] When a centrifugal pump is used for circulating the electrolyte, the flow rate of the electrolyte in the device 1 can be easily adjusted by changing the rotational speed of the impeller.
[0080] The anode plate 25 is, as can be seen from the drawings, contacted on its back side. The anode plate 25, which is used in the device 1 according to the invention, is coated in an electrically conductive and chemically inert manner on both sides. For example, platinum is used as a coating material.
[0081] With the method according to the invention, immediate measurements, i.e., immediately after a production run, can be made of, e.g., a metal layer on a wafer 19. This makes it possible, directly in the device 1 according to the invention, to perform direct measurements (i.e., checking the original process result, e.g., the original nickel layer).
[0082] This namely direct method according to the invention is advantageous compared to indirect methods, such as, e.g., the characterization of the electrolyte using other equipment and with derivation of electrolyte quality from layer quality.
[0083] The device 1 according to the invention is designed in such a way that it can be easily incorporated into a plant infrastructure and that modifications of the device 1 can be easily performed.
[0084] A possible additional function of the device 1 according to the invention is as follows:
[0085] Instead of a chemically inert anode plate 25, a plate that consists of a thermoplastic, such as, e.g., polypropylene, with two chemically inert wires or rods that are welded-in or cast-in at right angles to the plate and that are adjacent to one another, but electrically insulated from one another, can also be used. In this case, the anode plate 25 is used instead of the wafer 19. One of the two wires or rods then functions as a cathode and one as a reference electrode. This configuration of three chemically inert electrodes can be used for characterizing electrolytes.
[0086] In summary, an embodiment of the invention can be described as follows:
[0087] To test wafers, microchips, etc., electrical properties thereof are periodically measured and stored electrochemically. The measured values are compared to one another in order to determine changes in the electrical properties. For executing the method, a device 1 that is designed as a measuring cell is provided, which device has a test chamber 7 between an upper half cell 5 and a lower half cell 3, through which chamber the electrolyte is directed. The test chamber 7 is closed by a cell cover 21, which at the same time presses a wafer 19 against a ring seal 13 toward the upper half cell 5. The opening that forms the test chamber 7 in the lower half cell 3 is closed by a ring seal 23, an anode plate 25, and an anode cover 27.