PREPARATION METHOD FOR PIEZOELECTRIC COMPOSITE MATERIAL, AND APPLICATION THEREOF

Abstract

Provided are a preparation method of a piezoelectric composite material, and the application thereof. The preparation method includes: step 1, designing a curved-surface 3D printed mesh mold and forming the curved-surface 3D printed mesh mold by printing; step 2, cutting a blocky piezoelectric phase into a plurality of small piezoelectric columns; step 3, inserting the small piezoelectric columns into empty cells of the 3D printed mold; step 4, filling gaps between the piezoelectric columns and the 3D printed mold with a non-piezoelectric phase such as an epoxy resin, and curing and forming the non-piezoelectric phase; and step 5, grinding, polishing, and ultrasonically cleaning a prepared sample, and then performing an electrode coating operation on the sample to obtain a curved-surface piezoelectric composite material.

Claims

1. A preparation method of a piezoelectric composite material, comprising: step S1, obtaining a piezoelectric material block, and cutting the piezoelectric material block in a first direction, wherein the piezoelectric material block is made of a piezoelectric single crystal material or a piezoelectric ceramic material; step S2, cutting the piezoelectric material block that has been cut in the step S1 in a second direction to obtain a plurality of piezoelectric material columns independent from each other, wherein the second direction is perpendicular to the first direction; step S3, preparing a 3D printed resin mold; step S4, inserting the plurality of piezoelectric material columns obtained by the cutting in the step S2 into empty cells of the 3D printed resin mold obtained in the step S3, respectively, to obtain a combinant of the 3D printed resin mold and the plurality of piezoelectric material columns, wherein when the piezoelectric material block in the step S2 is made of the piezoelectric single crystal material, the plurality of piezoelectric material columns obtained by the cutting is screened before being inserted into the 3D printed resin mold obtained in the step S4; and step S5, pouring a resin material into the combinant of the resin mold and the plurality of piezoelectric material columns, curing the resin material, and performing surface grinding and polishing, to form a curved-surface piezoelectric composite material.

2. The preparation method of the piezoelectric composite material according to claim 1, wherein each of the plurality of piezoelectric material columns obtained in the step S2 has a square cross section.

3. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S3, the resin mold is of a type with a flat surface or of a type with a curved surface, wherein the curved surface is an arc surface, a spherical surface, an ellipsoidal surface, or any irregular curved surface.

4. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S3, a resin used for preparing the 3D printed resin mold is a photosensitive resin or a thermosensitive resin.

5. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S3, the resin mold has a printing precision smaller than or equal to 0.25 mm.

6. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S4, crack-free single crystal piezoelectric material columns are retained during screening of single crystal piezoelectric material columns, and single crystal piezoelectric material columns having a piezoelectric coefficient falling within a designed range are loaded into a same mold.

7. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S5, the resin material to be poured is stirred in vacuum before being poured.

8. The preparation method of the piezoelectric composite material according to claim 1, wherein in the step S5, the resin material, when being poured, is poured from a same position into the combinant formed by the mold and the plurality of piezoelectric material columns.

9. Use of the piezoelectric composite material prepared by the method according to claim 1 in obtaining a curved-surface piezoelectric composite material electrode, comprising: cleaning the curved-surface piezoelectric composite material, and then preparing a conductive layer on a surface of the curved-surface piezoelectric composite material.

10. The use of the piezoelectric composite material according to claim 9, wherein the conductive layer is prepared on the surface of the curved-surface piezoelectric composite material by a low-temperature silver paste coating or rotating magnetron sputtering method.

11. The use according to claim 9, wherein each of the plurality of piezoelectric material columns obtained in the step S2 has a square cross section.

12. The use according to claim 9, wherein in the step S3, the resin mold is of a type with a flat surface or of a type with a curved surface, wherein the curved surface is an arc surface, a spherical surface, an ellipsoidal surface, or any irregular curved surface.

13. The use according to claim 9, wherein in the step S3, a resin used for preparing the 3D printed resin mold is a photosensitive resin or a thermosensitive resin.

14. The use according to claim 9, wherein in the step S3, the resin mold has a printing precision smaller than or equal to 0.25 mm.

15. The use according to claim 9, wherein in the step S4, crack-free single crystal piezoelectric material columns are retained during screening of single crystal piezoelectric material columns, and single crystal piezoelectric material columns having a piezoelectric coefficient falling within a designed range are loaded into a same mold.

16. The use according to claim 9, wherein in the step S5, the resin material to be poured is stirred in vacuum before being poured.

17. The use according to claim 9, wherein in the step S5, the resin material, when being poured, is poured from a same position into the combinant formed by the mold and the plurality of piezoelectric material columns.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1 is a schematic diagram of a preparation process of a curved-surface type piezoelectric single crystal composite material.

[0021] FIG. 2 is a schematic diagram of a preparation process of a flat-surface type piezoelectric single crystal composite material.

[0022] FIG. 3 is a schematic diagram of a preparation process of a curved-surface type piezoelectric ceramic composite material.

[0023] FIG. 4 is a schematic diagram of a preparation process of a flat-surface type piezoelectric ceramic composite material.

DETAILED DESCRIPTION

[0024] The present disclosure will be described in further detail below with reference to specific examples and accompanying drawings. The following examples are merely intended to illustrate, rather than limit, the present disclosure.

Example 1

[0025] With reference to FIG. 1, this example adopted a preparation process with the following process flow: cutting to form piezoelectric single crystal columns, screening the piezoelectric single crystal columns, obtaining a curved-surface 3D printed frame resin mold by printing, inserting the piezoelectric single crystal columns into the mold, pouring a resin, and preparing an electrode.

[0026] In step S1, a piezoelectric single crystal block was obtained and cut in a first direction.

[0027] In step S2, the piezoelectric single crystal block that had been cut in the step S1 was cut in a second direction to obtain a plurality of piezoelectric single crystal columns independent from each other. The second direction is perpendicular to the first direction.

[0028] In step S3, the piezoelectric single crystal columns were screened.

[0029] In step S4, a curved-surface 3D printed frame resin mold having a bending angle of 140 degrees, a thickness of 5 mm, an area of 400 mm.sup.2, and an empty cell size of 1 mm*1 mm*5 mm was prepared.

[0030] In step S5, the piezoelectric single crystal columns obtained by the screening in the step S3 were inserted into empty cells of the mold obtained in the step S4, respectively.

[0031] In step S6, a resin material was poured into a combinant of the curved-surface resin mold and the piezoelectric single crystal columns, and the resin was cured, to form a curved-surface piezoelectric single crystal composite material.

[0032] 1) In the steps S1 and S2, the piezoelectric single crystal block was cut by a precise cutting machine to ensure integrity of the piezoelectric single crystal columns obtained by the cutting.

[0033] 2) In the step S3, the piezoelectric single crystal columns were screened based on performance parameters such as a piezoelectric constant and a dielectric constant. For example, piezoelectric single crystal columns having d33 ranging from 1,800 pC/N to 2,000 pC/N were selected.

[0034] 2) In the step S4, a 3D printer adopted to prepare the curved-surface 3D printed mold had an actual printing precision smaller than and equal to 0.25 mm.

[0035] 3) In the step S5, when the piezoelectric single crystal columns were inserted into the empty cells, a gap was reserved between each of the piezoelectric single crystal columns and the mold. A soft adhesive paper having strong adsorbability was attached to a surface of the mold, or a cleaned support body was disposed on a lower surface of the mold, by which the piezoelectric single crystal columns were fixed in the empty cells of the mold without slipping off during insertion.

[0036] 4) In the step S6, an epoxy resin was adopted as the resin to be poured. The resin was stirred evenly and then vacuumed in a vacuum box to remove air bubbles generated during stirring. In the pouring process, pouring the resin from a same position of the mold and slowing down the pouring can effectively reduce air bubbles generated in the pouring process to enable the resin to completely invade the gaps between the piezoelectric single crystal columns and the mold, allowing sufficient filtration of contact surfaces between the resin and the piezoelectric single crystal columns. When the epoxy resin was adopted as the resin to be poured, the epoxy resin was cured by standing still in vacuum for 24 hours.

[0037] For the curved-surface type piezoelectric single crystal composite material, an abrasive device having a corresponding curvature was preferably prepared to complete the grinding and polishing to avoid damages to an original design of curvature and bending angle of the composite material.

[0038] The composite material was cleaned with ethanol under ultrasonic vibration for 3 to 5 minutes before being prepared into an electrode. Since the prepared composite material had a curved surface, a uniform electrode layer cannot be obtained by a common flat-surface magnetron sputtering method. Instead, a curved-surface composite material electrode can be prepared by a low-temperature silver paste coating or rotating magnetron sputtering method.

[0039] In the preparation method of the curved-surface piezoelectric single crystal composite material provided by the present disclosure, the curved surface includes an arc surface, a spherical surface, an ellipsoidal surface, and any irregular curved surface.

[0040] Example 2, preparation of a flat-surface type piezoelectric single crystal composite material

[0041] With reference to FIG. 2, this example adopted a preparation process with the following process flow: cutting to form piezoelectric single crystal columns, screening the piezoelectric single crystal columns, obtaining a flat-surface 3D printed frame resin mold by printing, inserting the piezoelectric single crystal columns into the mold, pouring a resin, and preparing an electrode.

[0042] In step S1, a piezoelectric single crystal block was obtained and cut in a first direction.

[0043] In step S2, the piezoelectric single crystal block that had been cut in the step S1 was cut in a second direction to obtain a plurality of piezoelectric single crystal columns independent from each other. The second direction was perpendicular to the first direction.

[0044] In step S3, the piezoelectric single crystal columns were screened. The piezoelectric single crystal columns might be screened based on performance parameters such as a piezoelectric constant and a dielectric constant. For example, piezoelectric single crystal columns having d33 ranging from 1,800 pC/N to 2,000 pC/N were selected.

[0045] In step S4, a flat-surface 3D printed frame resin mold having a size of 100 mm*100 mm*5 mm (length*width*height) and an empty cell size of 1 mm*1 mm*5 mm was prepared. A 3D printer adopted to prepare the flat-surface 3D printed mold had an actual printing precision smaller than and equal to 0.25 mm.

[0046] In step S5, the piezoelectric single crystal columns obtained by the screening in the step S3 were inserted into empty cells of the mold obtained in the step S4, respectively. When the piezoelectric single crystal columns were inserted into the empty cells, a gap was reserved between each of the piezoelectric single crystal columns and the mold. Therefore, a soft adhesive paper having strong adsorbability was attached to a surface of the mold, or a cleaned support body was disposed on a lower surface of the mold, by which the piezoelectric single crystal columns were fixed in the empty cells of the mold without slipping off during insertion.

[0047] In step S6, a resin material was poured into a combinant of the flat-surface resin mold and the piezoelectric single crystal columns, and the resin was cured, to form a flat-surface piezoelectric single crystal composite material. An epoxy resin was adopted as the resin to be poured. The resin was stirred evenly and then vacuumed in a vacuum box to remove air bubbles generated during stirring. In the pouring process, pouring the resin from a same position of the mold and slowing down the pouring can effectively reduce air bubbles generated in the pouring process to enable the resin to completely invade the gaps between the piezoelectric single crystal columns and the mold, allowing sufficient infiltration of contact surfaces between the resin and the piezoelectric single crystal columns. When the epoxy resin was adopted as the resin to be poured, the epoxy resin was cured by standing still in vacuum for 24 hours.

[0048] In the steps S1 and S2, a piezoelectric ceramic block was cut by a precise cutting machine to ensure integrity of the piezoelectric single crystal columns obtained by the cutting.

[0049] The composite material was cleaned with ethanol under ultrasonic vibration for 3 to 5 minutes before being prepared into an electrode. A flat-surface composite material electrode was prepared by a magnetron sputtering or low-temperature silver paste coating or rotating magnetron sputtering method.

[0050] Example 3, preparation of a curved-surface type piezoelectric ceramic composite material

[0051] With reference to FIG. 3, this example adopted a preparation process with the following process flow: cutting to form piezoelectric ceramic columns, obtaining a curved-surface 3D printed frame resin mold by printing, inserting the piezoelectric ceramic columns into the mold, pouring a resin, and preparing an electrode.

[0052] In step S1, a piezoelectric ceramic block was obtained and cut in a first direction.

[0053] In step S2, the piezoelectric ceramic block that had been cut in the step S1 was cut in a second direction to obtain a plurality of piezoelectric ceramic columns independent from each other. The second direction was perpendicular to the first direction.

[0054] In step S3, a curved-surface 3D printed frame resin mold having a bending angle of 140 degrees, a thickness of 5 mm, an area of 400 mm.sup.2, and an empty cell size of 1 mm*1 mm*5 mm was prepared. A 3D printer adopted to prepare the curved-surface 3D printed mold had an actual printing precision smaller than and equal to 0.25 mm.

[0055] In step S4, the piezoelectric ceramic columns obtained by the cutting in the step S2 were inserted into empty cells of the mold obtained in the step S3, respectively. When the piezoelectric ceramic columns were inserted into the empty cells, a gap was reserved between each of the piezoelectric ceramic columns and the mold. Therefore, a soft adhesive paper having strong adsorbability was attached to a surface of the mold, or a cleaned support body was disposed on a lower surface of the mold, by which the piezoelectric material columns were fixed in the empty cells of the mold without slipping off during an insertion.

[0056] In the step S5, a resin material was poured or filled in a combinant of the curved-surface resin mold and the piezoelectric ceramic columns, and the resin was cured, to form a curved-surface piezoelectric ceramic composite material. When the resin to be poured was prepared in a formulation ratio (e.g., EPOK 301, 4:1), the resin was stirred evenly and then vacuumed in a vacuum box to remove air bubbles generated during stirring. In the pouring process, pouring the resin from a same position of the mold and slowing down the pouring can effectively reduce air bubbles generated in the pouring process to enable the resin to completely invade the gaps between the piezoelectric ceramic columns and the mold, allowing sufficient infiltration of contact surfaces between the resin and the piezoelectric ceramic columns. When an epoxy resin was adopted as the resin to be poured, the epoxy resin was cured by standing still for 24 hours.

[0057] In the steps S1 and S2, the piezoelectric ceramic block was cut by a precise cutting machine to ensure integrity of the piezoelectric ceramic columns obtained by the cutting.

[0058] Since the curved-surface type ceramic composite material was prepared in this example, an abrasive device having a corresponding curvature was preferably prepared to complete grinding and polishing to avoid damages to an original design of curvature and bending angle of the composite material.

[0059] The composite material was cleaned with ethanol under ultrasonic vibration for 3 to 5 minutes before being prepared into an electrode. Since the prepared composite material had a curved surface, a uniform electrode layer cannot be obtained by a common flat-surface magnetron sputtering method. Instead, a curved-surface composite material electrode can be prepared by a low-temperature silver paste coating or rotating magnetron sputtering method.

[0060] Example 4, preparation of a flat-surface type piezoelectric ceramic composite material

[0061] With reference to FIG. 4, this example adopted a preparation process with the following process flow: cutting to form piezoelectric ceramic columns, obtaining a flat-surface 3D printed frame resin mold by printing, inserting the piezoelectric ceramic columns into the mold, pouring a resin, and preparing an electrode.

[0062] In step S1, a piezoelectric ceramic block was obtained and cut in a first direction.

[0063] In step S2, the piezoelectric ceramic block that had been cut in the step S1 was cut in a second direction to obtain a plurality of piezoelectric ceramic columns independent from each other. The second direction was perpendicular to the first direction.

[0064] In step S3, a flat-surface 3D printed frame resin mold having a size of 100 mm*100 mm*5 mm (length*width*height) and an empty cell size of 1 mm*1 mm*5 mm was prepared. A 3D printer adopted to prepare the flat-surface 3D printed mold had an actual printing precision smaller than and equal to 0.25 mm.

[0065] In step S4, the piezoelectric material columns obtained by the cutting in the step S2 were inserted into empty cells of the mold obtained in the step S3, respectively. When the piezoelectric ceramic columns were inserted into the empty cells, a gap was reserved between each of the piezoelectric ceramic columns and the mold. A soft adhesive paper having strong adsorbability was attached to a surface of the mold, or a cleaned support body was disposed on a lower surface of the mold, by which the piezoelectric material columns were fixed in the empty cells of the mold without slipping off during insertion.

[0066] In step S5, a resin material was poured or filled into a combinant of the flat-surface resin mold and the piezoelectric ceramic columns, and the resin was cured, to form a flat-surface piezoelectric ceramic composite material. An epoxy resin was adopted as the resin to be poured. The resin was stirred evenly and vacuumed in a vacuum box to remove air bubbles generated during stirring. In the pouring process, pouring the resin from a same position of the mold and slowing down the pouring can effectively reduce air bubbles generated in the pouring process to enable the resin to completely invade the gaps between the piezoelectric ceramic columns and the mold, allowing sufficient infiltration of contact surfaces between the resin and the piezoelectric ceramic columns. When the epoxy resin was adopted as the resin to be poured, the epoxy resin was cured by standing still in vacuum for 24 hours.

[0067] In the steps S1 and S2, the piezoelectric ceramic block was cut by a precise cutting machine to ensure integrity of the piezoelectric ceramic columns obtained by the cutting.

[0068] The composite material was cleaned with ethanol under ultrasonic vibration for 3 to 5 minutes before being prepared into an electrode. A flat-surface composite material electrode was prepared by a magnetron sputtering or low-temperature silver paste coating or rotating magnetron sputtering method.

[0069] Performance testing results of the curved-surface type piezoelectric single crystal composite material, the flat-surface type piezoelectric single crystal composite material, the curved-surface type piezoelectric ceramic composite material, and the flat-surface type piezoelectric ceramic composite material are shown in Table 1.

TABLE-US-00001 TABLE 1 ε.sub.33.sup.T d.sub.33 ρ v.sup.D Z Performance (ε.sub.0) (pC/N) k.sub.t (kg/m.sup.3) (m/s) (Mrayls) Curved-surface 720 600 0.67 2970 3200 9.3 piezoelectric single crystal composite material Flat-surface 611 591 0.74 2870 3100 8.9 piezoelectric single crystal composite material Curved-surface 298 230 0.58 2695 3660 9.86 piezoelectric ceramic composite material Flat-surface 428 326 0.62 2795 3500 9.8 piezoelectric ceramic composite material

[0070] The above examples are merely used to explain rather than to limit the technical solutions of the present disclosure. Various modifications and equivalent alternatives of the technical solutions of the present disclosure can be made by those skilled in the art without departing from the ideas and scope of the present disclosure. The protection scope of the present disclosure shall be defined by the claims.