SPECIALLY PACKAGED RELAY AND PACKAGING METHOD THEREOF
20230187154 · 2023-06-15
Assignee
Inventors
Cpc classification
B29L2031/3406
PERFORMING OPERATIONS; TRANSPORTING
B29C45/14639
PERFORMING OPERATIONS; TRANSPORTING
Y02D10/00
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01H50/04
ELECTRICITY
H01H50/023
ELECTRICITY
International classification
Abstract
The present disclosure discloses a specially packaged relay and a packaging method thereof. The relay includes an electromagnetic relay and an injection molded body. The injection molded body is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein. A plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed. The electromagnetic relay of the present disclosure is completely wrapped and sealed by the injection molded body, and is completely isolated from external liquid, which can effectively prevent the external liquid from flowing into the electromagnetic relay and ensure the electromagnetic relay to work stably for a long time in a liquid environment.
Claims
1. A specially packaged relay, comprising an electromagnetic relay, wherein the relay further comprises an injection molded body which is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein, a plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the plurality of conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed.
2. The specially packaged relay according to claim 1, wherein a portion of the external terminal that is exposed and the conventional terminal are located on opposite sides of the electromagnetic relay.
3. The specially packaged relay according to claim 1, wherein the conventional terminal is located at an inner top of the injection molded body, and the external terminal is partially exposed from a bottom surface of the injection molded body.
4. The specially packaged relay according to claim 1, wherein the electromagnetic relay is provided with a vent hole, and the vent hole and the portion of the external terminal that is exposed are located on adjacent sides or opposite sides of the electromagnetic relay.
5. The specially packaged relay according to claim 1, wherein a plurality of heat dissipation grooves are respectively and circumferentially arranged on outer side surfaces of the injection molded body.
6. The specially packaged relay according to claim 2, wherein the conventional terminal is located at an inner top of the injection molded body, and the external terminal is partially exposed from a bottom surface of the injection molded body.
7. The specially packaged relay according to claim 2, wherein the electromagnetic relay is provided with a vent hole, and the vent hole and the portion of the external terminal that is exposed are located on adjacent sides or opposite sides of the electromagnetic relay.
8. The specially packaged relay according to claim 2, wherein a plurality of heat dissipation grooves are respectively and circumferentially arranged on outer side surfaces of the injection molded body.
9. The specially packaged relay according to claim 5, wherein an upper end of the heat dissipation groove protrudes upwardly, and a lower end of the heat dissipation groove does not penetrate through a bottom surface of the injection molded body.
10. The specially packaged relay according to claim 8, wherein an upper end of the heat dissipation groove protrudes upwardly, and a lower end of the heat dissipation groove does not penetrate through a bottom surface of the injection molded body.
11. The specially packaged relay according to claim 1, wherein each of corners of the injection molded body is respectively provided with a chamfer; an upper end of the chamfer penetrates through a top surface of the injection molded body, and a lower end of the chamfer does not penetrate through a bottom surface of the injection molded body.
12. The specially packaged relay according to claim 1, wherein a material of the injection molded body is different from that of a cover of the electromagnetic relay, and the cover is more temperature resistant than the injection molded body.
13. The specially packaged relay according to claim 1, wherein a plurality of limiting grooves is arranged on a bottom surface of the injection molded body, for positioning the electromagnetic relay during an injection molding process of the injection molded body.
14. A packaging method for a relay, wherein an injection molded body is injection molded outside an electromagnetic relay and wraps the electromagnetic relay therein, a plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
[0032] Reference numbers in the drawings are as follows: [0033] 1 electromagnetic relay [0034] 11 conventional terminal [0035] 12 cover [0036] bobbin [0037] 131 vent hole [0038] 14 base [0039] 2 injection molded body [0040] 21 heat dissipation groove [0041] 22 chamfer [0042] 23 limiting groove [0043] 3 external terminal
DETAILED DESCRIPTION
[0044] Referring to
[0045] In this embodiment, a portion of the external terminal 3 that is exposed (i.e., the exposed portion of the external terminal) and the conventional terminal 11 are located on opposite sides of the electromagnetic relay 1. That is, the external terminal 3 is extended in an opposite direction with respect to the conventional terminal 11, so that a distance between the exposed portion of the external terminal 3 and the conventional terminal 11 is far enough, to ensure that a welding thermal stress generated when the exposed portion of the external terminal 3 is welded with the corresponding element (such as a PCB board, etc.) cannot affect a poor sealing part of the electromagnetic relay 1 at the conventional terminal 11. Specifically, the conventional terminals 11 are located at an inner top of the injection molded body 2, that is, the electromagnetic relay 1 is in an inverted state in the injection molded body 2, and the external terminals 3 are partially exposed from a bottom surface of the injection molded body 2.
[0046] In this embodiment, the electromagnetic relay 1 is provided with a vent hole 131 that is used to discharge an internal gas in a process of sealing inside the electromagnetic relay 1, and the vent hole 131 and the exposed portion of the external terminal 3 are located on the adjacent or opposite sides of the electromagnetic relay 1, wherein it is a preferable way to locate the vent hole 131 and the exposed portion of the external terminal 3 on the opposite sides of the electromagnetic relay 1. In this way, the distance between the exposed portion of the external terminal and a position where the vent hole 131 is located may be as far as possible, to ensure that the welding thermal stress generated when the exposed portion of the external terminal 3 is welded with the corresponding element (such as PCB board, etc.) cannot affect the poor sealing part of the electromagnetic relay 1 at the vent hole 131. Since the external terminal 3 is partially exposed from the bottom surface of the injection molded body 2, and the electromagnetic relay 1 is in the inverted state in the injection molded body 2, that is, the exposed portion of the external terminals 3 is located at a lower side of the electromagnetic relay 1, the vent hole 131 may be located at an upper side of the electromagnetic relay 1 or at either side (i.e., left, right, front or rear side) of the electromagnetic relay 1. Specifically, the vent hole 131 may be provided on a side wall of a cover 12 of the electromagnetic relay 1 or a member of the electromagnetic relay 1 that blocks an opening of the cover 12, wherein the member may be a base 14 or a bobbin 13 or a combination of the base 14 and the bobbin 13, as shown in
[0047] In this embodiment, the injection molded body 2 has a square shape, and a plurality of heat dissipation grooves 21 are respectively arranged on outer side surfaces of the injection molded body 2. The heat dissipation groove 21 is elongated and located in a vertical direction. An upper end of the heat dissipation groove 21 upwardly penetrates out, and a lower end of the heat dissipation groove 21 does not penetrate through the bottom surface of the injection molded body 2. Each of corners of the injection molded body 2 is provided with a chamfer 22, and the chamfer 22 has an upper end that penetrates through a top surface of the injection molded body 2, and a lower end that does not penetrate through the bottom surface of the injection molded body 2. The arrangement of the heat dissipation grooves 21 and the chamfers 22 can reduce the accumulation of plastics and enhance the heat dissipation effect of the electromagnetic relay 1 located inside the injection molded body 2 on the basis of that the injection molded body 2 having a certain wall thickness and strength can be ensured. The heat dissipation groove 21 and the chamfer 22 do not penetrate through the bottom surface of the injection molded body 2, which can ensure the integrity and thickness of the bottom of the injection molded body 2, and also make a room for the limiting groove as described below.
[0048] In this embodiment, a plurality of limiting grooves 23 are provided on the bottom surface of the injection molded body 2, for positioning the electromagnetic relay 1 during the injection molding process of the injection molded body 2, to ensure the overall appearance of the injection molded relay and the size of the terminals thereof.
[0049] The present disclosure relates to a specially packaged relay having an injection molded body 2 and an electromagnetic relay 1 that are integrally formed in an injection molding manner, and the electromagnetic relay 1 is completely wrapped by the injection molded body 2, and only secondary connection terminals (i.e., the external terminals 3) of the electromagnetic relay 1 are exposed. Therefore, the relay of the present disclosure may be regarded as an independent part entity, rather than an assembly, and the liquid cannot be infiltrated into the inside of the relay from any possible “gap” like the previous assembly. The gaps between the conventional terminals 11, the bobbin 13, the cover 12 and other parts of the electromagnetic relay 1 are fixed by an epoxy resin, and have few amount of glue therein, which is generally a poor sealing portion of the electromagnetic relay 1. For the traditional electromagnetic relay, the welding process of the conventional terminals is easily affected by the thermal stress, and the liquid is easy to flow into the interior after these poor sealing portions are broken by the thermal stress. According to the present disclosure, after the electromagnetic relay 1 is inverted, the poor sealing portions of the electromagnetic relay 1 face upwards and are wrapped by the thick top of the injection molded body 2, so that the liquid cannot contact these portions. Specifically, the conventional terminal 11 of the electromagnetic relay 1 of the present disclosure is connected to the external terminal 3, and the external terminal 3 is extended in the opposite direction with respect to the conventional terminal 11, so that the distance between the exposed portion of the external terminal 3 and the conventional terminal 11 is far enough to ensure that the welding thermal stress generated when the exposed portion of the external terminal 3 is welded with the corresponding element (such as PCB board, etc.) cannot affect the poor sealing portion of the electromagnetic relay 1 at the conventional terminal 11. In practical use, only the exposed portion of the external terminal 3 needs to be welded. Even if the welding process is affected by thermal stress, the poor sealing portion of the conventional terminal 11 of the electromagnetic relay 1 may not be broken, and the liquid cannot be infiltrated into the inside of the electromagnetic relay 1. The vent hole 131 of the electromagnetic relay 1 is also arranged close to the top surface of the injection molded body 2, and is wrapped by the thick top of the injection molded body 2, so that liquid cannot contact the vent hole 131.
[0050] According to the specially packaged relay of the present disclosure, the electromagnetic relay 1 after being specially packaged by the injection molded body 2 may be immersed in the liquid for a long time during the working process, to ensure the normal operation of the immersed liquid-cooled server, reduce the overall loss of the server device of the electric data center and improve its operation efficiency. If the injection molded body is injection molded as a plastic cover in advance, and then the electromagnetic relay is installed in the plastic cover and an opening end of the plastic cover is sealed with a sealant, a demand for the sealing process of the sealant is very high; otherwise, once bubbles appear in the sealant during the sealing process, the overall sealing performance will be seriously affected, and the sealant is easy to be aging and fall off in comparison with the plastic cover. Therefore, compared to a method in which the plastic cover and the sealant are combined to perform a second sealing for the electromagnetic relay, the packaging method of the present disclosure in which the electromagnetic relay and the injection molded body are integrally injection-molded obviously allows the sealing performance of the present disclosure more reliable and more suitable for long-term stable work in the liquid.
[0051] In the packaging method of the present disclosure, an injection molded body is injection molded outside an electromagnetic relay and wraps the electromagnetic relay therein, a plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed.
[0052] In this embodiment, the electromagnetic relay is in an inverted state in the injection molded body, and the external terminals are extended in the opposite direction with respect to the conventional terminals.
[0053] In this embodiment, the vent hole of the electromagnetic relay and the portion of the external terminal that is exposed are located on adjacent sides or opposite sides of the electromagnetic relay.
[0054] In this embodiment, the material of the injection molded body is different from that of the cover of the electromagnetic relay, and the cover is more temperature resistant than the injection molded body, to ensure that the overall performance of the electromagnetic relay cannot be damaged during the injection molding.
[0055] According to the packaging method of the relay of the present disclosure, a structure of the formed injection molded body 2 is shown in
[0056] According to the packaging method of the relay provided by the present disclosure, the electromagnetic relay may be a novel packaged relay, which is completely wrapped and closed by the injection molded body, and completely insulated from the external liquid, effectively blocking the external liquid from flowing into the electromagnetic relay, and ensures the electromagnetic relay to work stably in the liquid environment for a long time.
[0057] The above embodiments are merely used to further illustrate a specially packaged relay and a packaging method of the present disclosure, but the present disclosure is not limited thereto. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present disclosure fall within the protection scope of the technical solution of the present disclosure.