Abstract
A lighting device with a conversion element is provided. It may be irradiated with excitation radiation from an electromagnetic radiation source. Provision is made of an optical component for the radiation emanating from the conversion element and provision is made of a sensor for detecting radiation emanating from the conversion element and/or for detecting radiation emanating from the radiation source.
Claims
1. A lighting device comprising a conversion element, which may be irradiated with excitation radiation from an electromagnetic radiation source, wherein provision is made of an optical component for the radiation emanating from the conversion element, and wherein provision is made of a sensor for detecting radiation emanating from the conversion element and/or for detecting radiation emanating from the radiation source.
2. The lighting device as claimed in claim 1, wherein the optical component consists essentially of silicone.
3. The lighting device as claimed in claim 1, wherein the optical component is a collimator optics.
4. The lighting device as claimed in claim 1, wherein provision is made of a sensor for radiation converted by the conversion element and wherein provision is made of a further sensor for radiation not converted by the conversion element.
5. The lighting device as claimed in claim 1, wherein the sensor is arranged within the optical component or arranged outside of the optical component.
6. The lighting device as claimed in claim 1, wherein the sensor is arranged in such a way that, substantially, radiation reflected from a TIR surface of the optical component impinges on the sensor or that, substantially, radiation directly emanating from the conversion element impinges on the sensor.
7. The lighting device as claimed in any one of the preceding claims claim 1, wherein the sensor is arranged in an edge region of the optical component.
8. The lighting device as claimed in claim 1, wherein the sensor is arranged adjacent to a mechanical functional region of the optical component.
9. The lighting device as claimed in claim 1, wherein a mirror element or a scattering element is arranged in the optical component in such a way that some of the radiation entering into the optical component radiates directly, or via a TIR surface, to the mirror element or to the scattering element and is guided onward thereover to the sensor.
10. The lighting device as claimed in claim 9, wherein some of the radiation entering into the optical component is deflected via the mirror element or the scattering element toward a TIR surface in such a way that this part of the radiation radiates through the TIR surface to the sensor.
11. The lighting device as claimed in claim 5, wherein the sensor is an SMD component arranged on a printed circuit board, wherein the printed circuit board is provided outside of the optical component.
12. The lighting device as claimed in claim 9, wherein the TIR surface comprises a passage so that radiation from the optical component radiates to the sensor.
13. The lighting device as claimed in claim 9, wherein a cutout, which has a round or polygonal cutout surface or a combination of a round and polygonal cutout surface, is introduced into the region of the TIR surface of the optical component.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0047] In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the disclosed embodiments. In the following description, various embodiments described with reference to the following drawings, in which:
[0048] FIGS. 1 to 27 each show, in a schematic illustration, an embodiment of a remote phosphor lighting device according to the present disclosure.
DETAILED DESCRIPTION
[0049] In accordance with FIG. 1, a remote phosphor lighting device 1 (lighting device) is shown which, for example, is used in the automotive field.
[0050] In the following embodiments, only one sensor is depicted in part for reasons of clarity. In general, it is also possible to arrange a plurality of sensors, should this be required.
[0051] The lighting device 1 has an electromagnetic radiation source (not depicted here) in the form of a laser light source. The latter radiates excitation radiation 2 onto a conversion element 4. The latter includes a phosphor which at least partly converts the excitation radiation. Usually, some of the excitation radiation is not converted. Disposed downstream of the conversion element 4 is an optical component in the form of a collimator optics 6 which has an approximately funnel-shaped configuration. An outer lateral surface 8 of the optical component is configured as a TIR surface. Here, the outer lateral surface 8 broadens in a direction away from the conversion element 4 and has convex curvature when seen from the outside. The component 6 has an input cutout 10 for the entrance of the radiation emerging from the conversion element 4. Said input cutout has a cutout base which serves as inner entrance surface 12 and which is encompassed by a cutout edge which, in turn, serves as a lateral entrance surface 14. Moreover, the optical component 6 has an exit surface 16. A sensor 18 is arranged within the component 6. Said sensor is connected with the electrical connectors 20. The latter extend radially to the outside from the sensor 18 and are guided outside of the optical component 6 approximately in the direction of the conversion element 4. The sensor 18 is arranged in such a way that, during normal operation, radiation emanating from the conversion element 4, which enters into the component 6 through the lateral entrance surface 14 and which is reflected at the TIR surface 8, is detectable. By way of example, should the conversion element 4 fail, the excitation radiation 2 would directly enter into the optical component 6 as non-converted radiation and, in the process, would substantially not impinge on the sensor 18. Hence, the radiation detected by the sensor 18 would be reduced, providing an indication for a malfunction.
[0052] In accordance with FIG. 2, the sensor 18 is arranged closer to a longitudinal axis of the optical component 6 in contrast with FIG. 1. Therefore, in the case of a fault, it could be irradiated directly by non-converted radiation and therefore detect an increase in the non-converted radiation.
[0053] In FIG. 3, the sensor 18 is arranged in such a way that radiation emanating from the conversion element 4 impinges directly on the sensor 18 via the lateral entrance surface 14.
[0054] In accordance with FIG. 4, the sensor 18 is embedded at the edge of the optical component 6. Hence, the connectors 20 lie outside the component 6. Furthermore, the sensor 18 is irradiated directly by radiation emanating from the conversion element 4 via the lateral entrance surface 14.
[0055] In FIG. 5, a section 22, the curvature of which differs from the TIR surface 8, adjoins the funnel-shaped TIR surface 8 of the optical component 6 in a direction away from the conversion element 4. In accordance with FIG. 5, the section 22 has an approximately cylindrical external lateral surface. The optical component 6 may be mechanically affixed by way of this section 22. Two sensors 24 and 26 are arranged diametrically in relation to one another in the outer edge region of the section 22, the connectors 20 of said sensors being arranged outside of the optical component 6 and extending in the direction toward the conversion element 4. The sensors 24 and 26 are irradiated directly by the radiation emanating in the conversion element 4, said radiation entering into the component 6 via the lateral entrance surface 14.
[0056] In FIG. 6, a mirror element 28 is embedded into the optical component 6, said mirror element deflecting the radiation from the conversion element 4 to the sensor 30. Here, in accordance with FIG. 4, the sensor 30 is arranged in the edge region of the optical component 6. The radiation which is deflected by the mirror element 28 emanates from the conversion element 4, enters into the component 6 via the lateral entrance surface 14 and is deflected to the mirror 28 via the TIR surface 8 and, thereupon, deflected to the sensor 30 via said mirror.
[0057] In accordance with FIG. 7, the sensor 30 is arranged within the optical component 6 in contrast to FIG. 6. Here, the sensor 30 is provided between the mirror element 28 and the TIR surface 8 in the radial direction of the optical component 6.
[0058] In FIG. 8, the mirror element 28 is provided approximately centrally in the optical component 6. Some of the radiation emanating from the conversion element 4, which reaches into the optical component 6 via the inner entrance surface 12, is guided from the mirror element 28 to the sensor 30.
[0059] In accordance with FIG. 9, the sensor 30 is arranged approximately centrally in place of the mirror element 28 from FIG. 8, as a result of which some of the radiation entering into the optical component 6 via the inner entrance surface 12 is detectable by the sensor 30.
[0060] In accordance with FIG. 10, the sensor 30 is arranged outside of the optical component 6 in contrast with the embodiment in FIG. 6. Hence, some of the radiation emanating from the conversion element 4 is deflected by the mirror element 28 to the outside, toward the sensor 30. Here, the arrangement of the mirror element 28 and of the sensor 30 is such that at least some of the radiation deflected by the mirror element 28 does not meet a TIR condition of the TIR surface and hence it is able to emerge from the optical component 6.
[0061] In accordance with FIG. 11, the sensor 30 is likewise arranged outside of the optical component 6, in contrast with FIG. 8.
[0062] In FIG. 12, the sensor 32 is configured as an SMD component which is arranged on a printed circuit board 34. Here, the sensor 32, together with the printed circuit board 34, is arranged outside of the optical component 6. Here, the arrangement is effected adjacent to the TIR surface 8, with a maximum distance of the printed circuit board 34, together with the sensor 32, from a central longitudinal axis of the optical component 6 being smaller than half the maximum diameter D of the optical component 6. So that some of the radiation emanating from the conversion element 4 may be guided to the sensor 32, the TIR surface 8 has a passage 36 in the region in which this radiation is intended to emerge.
[0063] In FIG. 13, two sensors 32, 37 embodied as an SMD component are provided, said sensors in each case being arranged on a printed circuit board 34, 38, in contrast with FIG. 12. Here, the sensors 32, 37 with their printed circuit boards 34 and 38, respectively, are arranged diametrically in relation to one another on the optical component 6. Hence, the optical component 6 has a further passage 40 for the sensor 37. Here, in accordance with FIG. 12, the sensors 32 and 37 detect some of the radiation emanating from the conversion element 4, said radiation entering into the optical component 6 via the lateral entrance surface 14.
[0064] In accordance with FIG. 14, the sensors 32, 37 with their printed circuit boards 34, 38 are arranged on the same side of the optical component 6, approximately in a common plane. Here, both sensors 32, 37 detect some of the radiation emanating from the conversion element 4 by way of their passages 36 and 40, respectively, said radiation entering into the optical component 6 via the lateral entrance surface 14.
[0065] In accordance with FIG. 15, a cutout or recess 42 is introduced into the optical component 6 from the direction of the TIR surface 8. Said cutout or recess has an arched configuration in this case. Hence, a cutout surface of the cutout 42 has a different curvature than the TIR surface 8, wherein the TIR condition is at least partly infringed upon and hence some of the radiation emanating from the conversion element 4 is able to emerge from the optical component 6 and is detectable by the sensor 32. Said sensor is advantageously arranged adjacent to the cutout 42.
[0066] In contrast to FIG. 15, provision is made according to FIG. 16 of a cutout 44 with a different cross section. As seen in the cross section, the cutout 44 has an approximately V-shaped configuration. Therefore, it has e.g. two planar cutout surfaces, by means of which the TIR condition is at least partly infringed upon. As a result of this, in accordance with FIG. 15, some of the radiation emanating from the conversion element 4 may reach the sensor element 32 via the lateral entrance surface 14 and via the cutout 44.
[0067] In FIG. 17, provision is made of a cutout 46 which, in contrast to FIGS. 15 and 16, has such a configuration that a sensor 48 may be completely immersed therein. Here, the sensor 48 detects some of the radiation emanating from the conversion element 4, said radiation entering into the optical component 6 via the lateral entrance surface 14 and being reflected at the TIR surface 8. The sensor 48 is contacted by way of connection wires 50 which are guided out of the cutout 46.
[0068] FIG. 18 provides a cutout 52 which, in contrast to the cutout in FIG. 17, is configured in such a way that the sensor 32 may be received therein, together with the printed circuit board 34.
[0069] In accordance with FIG. 19, the sensors 32, 37 are arranged adjacent to the conversion element 4, together with their printed circuit boards 34 and 38, respectively, and in contrast to FIG. 13. Here, they are situated e.g. in a plane with the conversion element 4, with the plane extending approximately perpendicular to a longitudinal axis of the optical component 6. Here, the sensors 32 and 37 detect some of the radiation emanating from the conversion element 4, said radiation being deflected to the sensors 32 and 34 as Fresnel back reflections of the inner entrance surface 12. In accordance with FIG. 19, both the conversion element and the sensors 32 and 37 are arranged in the entrance region of the input cutout 10.
[0070] In contrast to FIG. 7, FIG. 20 does not provide a mirror element but a spatial volume 52 within the optical component 6, said spatial volume having scattering centers 54. These deflect some of the radiation emanating from the conversion element 4 to the sensor 30, said radiation being guided via the lateral entrance surface 14 and the TIR surface 8.
[0071] In contrast to FIG. 20, two sensors 30, 56 are provided in FIG. 21, said sensors being arranged adjacent to the spatial volume 52.
[0072] In FIG. 22, the lighting device 1 has a receiving cutout 60 in the optical component 6. Said receiving cutout is open toward the TIR surface 8. A sensor 62 is arranged in the receiving cutout 60. Here, the receiving cutout 60 is configured in such a way that it engages behind the sensor 62. The electrical connectors are guided from the sensor 62 to the outside through an opening 64 of the receiving cutout 60.
[0073] In accordance with FIG. 23, a further receiving cutout 66 is provided diametrically in relation to the receiving cutout 60, said further receiving cutout having an appropriate configuration. The latter likewise has a sensor 68 arranged therein, the electrical connectors 20 of which are guided to the outside.
[0074] In FIG. 24, the receiving cutouts 60, 66 are arranged adjacent to one another and connected to one another.
[0075] FIG. 25 shows the receiving cutouts 60, 66 with a different geometry in comparison with FIG. 24.
[0076] In accordance with FIG. 26A, an element 70, which is e.g. a mirror element or the sensor, is arranged in the optical component 6. Here, the element 70 is insert molded into the optical component 6. Two webs 72, 74 are provided so that the element is stationary within the injection molding method. Said webs extend approximately in a plane which extends approximately perpendicular to the longitudinal axis of the optical component 6. In accordance with FIG. 26B, a V-shaped arrangement of the webs 72 and 74 is identifiable in a front view of the optical component 6.
[0077] A cavity 76 is provided instead of a mirror in FIG. 27. Said cavity has a surface 78 at an angle to the longitudinal axis of the optical component 6, said surface acting as a TIR surface and guiding some of the radiation emanating from the conversion element 4 to the sensor element 80. In FIG. 27, three preferred positions of the sensor 80 are shown in an exemplary manner, namely in the optical component 6, in the edge region of the optical component 6, and outside of the optical component 6. The cavity 76 is open to the outside by way of a channel 82. Here, proceeding from the cavity 76, the channel 82 extends approximately at a parallel distance from the longitudinal axis of the optical component 6 and opens into the exit surface 16.
[0078] According to the present disclosure, an optical component including a sensor for detecting some of the radiation entering into the optical component is disclosed. Advantageously, a conversion element and an electromagnetic radiation source, in particular a laser light source, are assigned to the optical component.
[0079] While the disclosed embodiments have been particularly shown and described with reference to specific embodiments, it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the disclosed embodiments as defined by the appended claims. The scope of the disclosed embodiments is thus indicated by the appended claims and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced.
