SENSOR

Abstract

A sensor includes: a receptacle connectable to an external plug; a second housing accommodating at least part of the receptacle; a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least part of the main substrate and shielding an electromagnetic wave emitted from the main substrate and/or an electromagnetic wave to penetrate the main substrate from the outside; a first housing accommodating at least part of the main substrate and at least part of the shield film; a flexible substrate connecting the main substrate and the receptacle; and a protection member abutting on an end of the shield film from the side opposite to the main substrate, the end of the shield film facing the flexible substrate.

Claims

1. A sensor comprising: a receptacle capable of being connected to an external plug; a second housing in which at least a part of the receptacle is accommodated; a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least a part of the main substrate and shielding at least one of an electromagnetic wave emitted from the main substrate and an electromagnetic wave to penetrate the main substrate from an outside; a first housing in which at least a part of the main substrate and at least a part of the shield film are accommodated; a flexible connection member connecting the main substrate and the receptacle; and a protection member abutting on an end of the shield film from a side opposite to the main substrate, the end of the shield film facing the connection member.

2. The sensor according to claim 1, further comprising a sealing resin that seals the electronic component used for sensing, wherein the protection member has a cantilever structure in which one end of the protection member abuts on the end of the shield film, and another end is buried and fixed in the sealing resin.

3. The sensor according to claim 1, further comprising a cylindrical insulating member fitted inside the second housing, wherein the shield film comprises: a winding part that is wound around the main substrate in a lateral direction intersecting a longitudinal direction of the main substrate, covers a part of a front surface and a part of a back surface of the main substrate, and covers a part of an end surface of the main substrate; and a tongue part that protrudes from the winding part and covers only a part of the front surface and/or a part of the back surface of the main substrate, wherein at least a part of the tongue part configures the end of the shield film facing the connection member, and overlaps the insulating member in a thickness direction of the main substrate.

4. The sensor according to claim 1, wherein the protection member is made of a material having higher rigidity than the connection member.

5. The sensor according to claim 4, wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

6. A sensor comprising: a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least a part of the main substrate and shielding at least one of an electromagnetic wave emitted from the main substrate and an electromagnetic wave to penetrate the main substrate from an outside; and a protection member abutting on an end of the shield film from a side opposite to the main substrate.

7. The sensor according to claim 6, further comprising a sealing resin that seals the electronic component used for sensing, wherein the protection member has a cantilever structure in which one end of the protection member abuts on the end of the shield film, and another end is buried and fixed in the sealing resin.

8. The sensor according to claim 2, further comprising a cylindrical insulating member fitted inside the second housing, wherein the shield film comprises: a winding part that is wound around the main substrate in a lateral direction intersecting a longitudinal direction of the main substrate, covers a part of a front surface and a part of a back surface of the main substrate, and covers a part of an end surface of the main substrate; and a tongue part that protrudes from the winding part and covers only a part of the front surface and/or a part of the back surface of the main substrate, wherein at least a part of the tongue part configures the end of the shield film facing the connection member, and overlaps the insulating member in a thickness direction of the main substrate.

9. The sensor according to claim 2, wherein the protection member is made of a material having higher rigidity than the connection member.

10. The sensor according to claim 3, wherein the protection member is made of a material having higher rigidity than the connection member.

11. The sensor according to claim 8, wherein the protection member is made of a material having higher rigidity than the connection member.

12. The sensor according to claim 9, wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

13. The sensor according to claim 10, wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

14. The sensor according to claim 11, wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1 is a cross-sectional view showing an internal structure of a sensor according to an embodiment of the disclosure.

[0022] FIG. 2 is an exploded perspective view of the sensor shown in FIG. 1.

[0023] FIG. 3 is a cross-sectional view of the shield film and the protection member shown in FIG. 1 as viewed from the back surface side of the main substrate.

[0024] FIG. 4 is a cross-sectional view showing a state before the flexible substrate shown in FIG. 1 is folded.

DESCRIPTION OF THE EMBODIMENTS

[0025] Exemplary embodiments of the disclosure will be described with reference to the accompanying drawings. In each figure, those with the same reference numerals have the same or similar configurations. Hereinafter, each configuration will be described in detail with reference to FIGS. 1 to 4. FIG. 1 is a cross-sectional view showing an internal structure of a sensor 1 according to an embodiment of the disclosure. As shown in FIG. 1, the sensor 1 is a columnar connector-type sensor, and includes a receptacle (socket) 9 configured to be connectable with an external plug P.

[0026] In the illustrated example, the sensor 1 is configured as a proximity sensor including a detection part 4 that detects the presence or position of a metal object using a magnetic field. The sensor 1 is not limited to a proximity sensor, and may be an optical sensor including at least one of a light emitting part that emits light and a light receiving part that receives light as a detection part, or may be another type of sensor.

[0027] A detection part 4 is accommodated at one end (hereinafter referred to as the tip end) of the sensor 1. A receptacle 9 is provided at the other end (hereinafter referred to as the base end) opposite to the one end. The detection part 4 includes, for example, a core 41 such as an iron core, a coil 42 that is a winding wire wound around the core 41, and a coil case 43 that houses the core 41 and the coil 42, and is connected to a main circuit (5, 53, 54, 6, . . . ) that control the detection part 4.

[0028] The main circuit (5, 53, 54, 6, . . . ) includes a substantially rectangular main substrate 5, an electronic component 53 and a mounting part 54 mounted on the main substrate 5, and a shield film 6 made of copper foil or the like. The electronic component 53 is connected with the detection part 4 and used for sensing. The mounting part 54 is a soldering land pattern, a connector, or the like, is located on the side opposite to the detection part 4 on a front surface 5A of the main substrate 5, and is used for connection with a flexible substrate 8, which will be described later.

[0029] Silicone resin or the like is applied to the front surface 5A and the back surface 5B of the main substrate 5 to protect the electronic component 53. The shield film 6 is wound around and fixed to the main substrate 5 with double-sided tape or the like. The shield film 6 may shield electromagnetic waves and static electricity emitted from the main substrate 5 or may shield electromagnetic waves and static electricity that try to penetrate the main substrate 5 from the outside.

[0030] The housing (2, 3) forming the outer shape of the sensor 1 is formed in a substantially cylindrical shape from a material such as metal. The housing (2, 3) is configured to be divisible into a first housing 2 and a second housing 3. At least a part of the first housing 2 is filled with a primary sealing resin 51 such as an epoxy resin. The primary sealing resin 51 fills the gaps between the detection part 4 and the main circuit (5, 53, 54, 6, . . . ) accommodated in the first housing 2 and fixes them to each other.

[0031] The second housing 3 is filled with a secondary sealing resin S2 such as an epoxy resin similar to the primary sealing resin S1. The secondary sealing resin S2 fills the gaps between the components accommodated in the second housing 3 and fixes them to each other. Further, the secondary sealing resin S2 is filled across the first housing 2 and the second housing 3 to fix the first and second housings 2 and 3 to each other.

[0032] The first housing 2 and the second housing 3 are connected by a flexible substrate (flexible printed wiring board) 8. The flexible substrate 8 is an example of a flexible connection member. The connection member is not limited to the flexible substrate 8, and may be a flexible cable or the like. The base film of the flexible substrate 8 is made of polyimide resin or the like and has a thickness of 50 μm or less. The sensor 1 of this embodiment includes a protection member 10 that protects the shield film 6 from the flexible substrate 8. The protection member 10 is preferably made of a material having higher rigidity than the flexible substrate 8. An example of the material for the protection member 10 is an FR-4 grade laminate conforming to the ANSI standard. The material of the protection member 10 may be another type of rigid substrate, or may be a material other than the rigid substrate.

[0033] The protection member 10 is in contact with the shield film 6 from the side opposite to the main substrate 5 on at least one of the front surface 5A and the back surface 5B of the main substrate 5. In the illustrated example, the protection member 10 is disposed on the back surface 5B side and adhered to the shield film 6 with double-sided tape or the like. In the illustrated example, the protection member 10 has a cantilever structure in which one end (rear end) 102 of the protection member 10 abuts on an end 62 of the shield film 6, and the other end (front end) 101 is buried in the primary sealing resin S1. The primary sealing resin Si is an example of a sealing resin that fixes the end 101 of the protection member 10, which will be described later. The shape of the shield film 6 will be described later in detail with reference to FIG. 3.

[0034] FIG. 2 is an exploded perspective view of the sensor 1 shown in FIG. 1. As shown in FIG. 2, the second housing 3 configuring the housing (2, 3) accommodates a part of the main circuit (5, 53, 54, 6, . . . ), a part of the flexible substrate 8, a receptacle 9, and a cylindrical insulating member 7 made of a resin material. The flexible substrate 8 has one end (rear end) 82 to which the receptacle 9 is connected by soldering or the like, and the other end (front end) 81 is provided with a mounting part 84. The mounting part 84 of the flexible substrate 8 is a soldering land pattern, a connector, or the like, similar to the mounting part 54 of the main substrate 5, and is connected to the mounting part 54.

[0035] In addition to the receptacle 9, light emitting elements 83G and 83O may be mounted on the end 102 of the flexible substrate 8. The light emitting element 83G is, for example, a communication indicator lamp and is a green light emitting diode. The light emitting element 83O is, for example, an operation indicator lamp and is an orange light emitting diode. The insulating member 7 is fitted inside the first and second housings 2 and 3. Due to the thickness of the insulating member 7, it is possible to secure a dielectric strength distance for protecting the main circuit (5, 53, 54, 6, . . . ), the flexible substrate 8 and their soldered parts against static electricity from the outside of the housing (2, 3).

[0036] The receptacle 9 has at least one contact terminal 91 and an insulator 90 supporting the contact terminal 91. In the illustrated example, the contact terminal 91 is a bar-shaped connector pin. The shape of the contact terminal 91 is not limited to a bar shape, and may be another shape.

[0037] The insulator 90 is an insulator that is made of a resin material and supports the multiple contact terminals 91 so that they do not come into contact with each other. In the illustrated example, the insulator 90 is formed in a cup shape having a flange part. The contact terminal 91 is disposed deep inside the housing (2, 3) by the length of the insulator 90. An airtight member 39 such as an O-ring is attached to the gap between the insulator 90 and the second housing 3.

[0038] FIG. 3 is a cross-sectional view of the shield film 6 and the protection member 10 shown in FIG. 1 as viewed from the back surface 5B side of the main substrate 5. As shown in FIG. 3, the shield film 6 is trimmed so as not to interfere with the insulating member 7 and has a winding part 63 and a tongue part 64 protruding from the winding part 63. The winding part 63 is wound around the main substrate 5 in a lateral direction Y intersecting the longitudinal direction X of the main substrate 5, and covers not only a part of the front surface 5A (see FIG. 1) and a part of the back surface 5B of the main substrate 5, but also a part of an end surface 5C of the main substrate connecting the front surface 5A and the back surface 5B.

[0039] In addition, the tongue part 64 covers only a part of the front surface 5A and/or a part of the back surface 5B of the main substrate 5. In the example shown in FIGS. 1 to 3, a pair of front and back tongue parts 64 are formed along a part of the main substrate 5A and the back surface 5B. At least a part of the tongue part 64 overlaps the insulating member 7 described above in the thickness direction Z of the main substrate 5.

[0040] The tongue part 64 configures the end of the shield film 6 facing the flexible substrate 8. The one end 102 of the protection member 10 abuts on the tongue part 64. When the tongue part 64 is formed on the front and back sides, the protection member 10 may be disposed on one of the tongue parts 64 (in the illustrated example, the tongue part 64 on the back surface 5B side). The flexible substrate 8 is accommodated in the accommodation space on the side where the protection member 10 is disposed.

[0041] FIG. 4 is a cross-sectional view showing a state before the flexible substrate 8 shown in FIG. 1 is folded. As shown in FIG. 4, in a state after being sealed with the primary sealing resin S1 and before being sealed with the secondary sealing resin S2, the flexible substrate 8 connects the main substrate 5 accommodated in the first housing 2 and the receptacle 9 accommodated in the second housing 3. The first and second housings 2 and 3 may be freely moved within the length of the flexible substrate 8. The receptacle 9 is soldered to the flexible substrate 8.

[0042] In order to assemble the sensor 1 from the half-finished product shown in FIG. 4, in a state where the first housing 2 and the second housing 3 are separated, the resin composition of the secondary sealing resin S2 is injected into the first housing 2 with the detection part 4 facing downward in the vertical direction. The flexible substrate 8 is folded along the insulating member 7, and the second housing 3 is attached to the first housing 2. The housing (2, 3) is turned upside down so that the receptacle 9 faces downward in the vertical direction, and the resin composition of the secondary sealing resin S2 is cured by heating or the like.

[0043] In such an assembly method, in the process of folding the flexible substrate 8 indicated by the two-dot chain line in FIG. 4, if the accommodation space of the flexible substrate overlaps the accommodation space of the main substrate without the protection member 10 being provided, the flexible substrate may interfere with the shield film.

[0044] According to the sensor 1 of this embodiment configured as described above, even if the housing (2, 3) is divided and configured, the end 62 of the shield film 6 is less likely to be turned up by the protection member 10 that abuts on the end 62 of the shield film 6 from the side opposite to the main substrate 5. Even if the end 62 is formed with the tongue part 64 which is likely to be turned up, the deformation of the shield film 6 may be prevented.

[0045] Moreover, since the protection member 10 is fixed to be buried in the primary sealing resin S1, even if a force is applied from the flexible substrate 8, the position of the protection member 10 is unlikely to shift. The protection member 10 is made of a material such as an FR-4 grade laminate having higher rigidity than the flexible substrate 8, and is less likely to be deformed even when it abuts on the flexible substrate 8.

[0046] The embodiments described above are for facilitating the understanding of the disclosure, and are not for limiting the interpretation of the disclosure. Each element included in the embodiments and its disposition, material, condition, shape, size, and the like are not limited to those exemplified, and may be changed as appropriate. Further, it is possible to replace or combine a part of the configurations shown in different embodiments. A part or all of this embodiment may be described as the following appendix descriptions, but is not limited to the following.

[0047] [Appendix]

[0048] A sensor (1) includes:

[0049] a receptacle (9) capable of being connected to an external plug (P);

[0050] a second housing (3) in which at least a part of the receptacle is accommodated; a main substrate (5) on which an electronic component (53) used for sensing is mounted; a shield film (6) covering at least a part of the main substrate and shielding at least one of an electromagnetic wave emitted from the main substrate and an electromagnetic wave to penetrate the main substrate from an outside;

[0051] a first housing (2) in which at least a part of the main substrate and at least a part of the shield film are accommodated;

[0052] a flexible connection member (8) connecting the main substrate and the receptacle; and

[0053] a protection member (10) abutting on an end of the shield film from a side opposite to the main substrate, the end of the shield film facing the connection member.

REFERENCE SIGNS LIST

[0054] 1: Sensor; 2: First housing; 3: Second housing; 39: Airtight member; 4: Detection part; 41: Core; 42: Coil; 43: Coil case; 5: Main substrate; 5A: Front surface; 5B: Back surface; 5C: End surface; 53: Electronic component; 54: Mounting part; 6: Shield film; 62: End facing the flexible substrate; 63: Winding part; 64: Tongue part; 7: Insulating member; 8: Flexible substrate (an example of connection member); 81: Other end; 82: One end; 83G, 83O: Light emitting element; 84: Mounting part; 9: Receptacle; 90: Insulator; 91: Contact terminal; 10: Protection member; 101: Other end; 102: One end; P: External plug; S1: Primary sealing resin (an example of sealing resin); S2: Secondary sealing resin; X: Longitudinal Direction; Y: Lateral direction; Z: Thickness direction.