PROBE PIN CLEANING SHEET WITH CLEANING POWER AND A MANUFACTURING METHOD THEREOF
20230166297 · 2023-06-01
Inventors
- Li-Wen HSU (New Taipei City, TW)
- Chun-Liang CHEN (New Taipei City, TW)
- Chih-Tang LEE (New Taipei City, TW)
Cpc classification
B08B1/00
PERFORMING OPERATIONS; TRANSPORTING
B24D11/001
PERFORMING OPERATIONS; TRANSPORTING
B24D11/02
PERFORMING OPERATIONS; TRANSPORTING
International classification
B08B1/00
PERFORMING OPERATIONS; TRANSPORTING
B24D11/02
PERFORMING OPERATIONS; TRANSPORTING
B24D3/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A probe pin cleaning sheet with cleaning power and a manufacturing method thereof are disclosed, comprising a release layer, a cleaning layer, and a substrate. Thus, in the process that the probe pin pierces the cleaning layer, through the material of cleaning layer, and the cleaning grains of abrasive material contained in the cleaning material in the cleaning layer, the cleaning power is increased to scrape off dirt from the surface of probe pin. In addition, by the negative charges and lipophilic property of the silicone itself, the dirt on the probe pin can be transferred onto the cleaning layer.
Claims
1. A probe pin cleaning sheet with cleaning power comprising: a cleaning layer, which is provided with a cleaning material, with the cleaning material being formed by plural abrasive grains, each abrasive grain being formed by plural cleaning grains, and the cleaning layer being made of silicone resin; a release layer, which is disposed on a surface of the cleaning layer, with the release layer being a release film being attached on a surface of the cleaning layer or a silicone coating being coated on a surface of the cleaning layer; and a substrate, which is disposed on the other surface of cleaning layer, with that the cleaning layer is formed integrally with the cleaning material on the substrate or is bonded with the substrate adhesively after being formed; wherein, in the process that the probe pin pierces the cleaning layer, through the material of cleaning layer, and the cleaning grains of abrasive material contained in the cleaning material in the cleaning layer, the cleaning power is increased to scrape off dirt from the surface of probe pin, in addition to that by the negative charges and lipophilic property of the silicon itself, the dirt on the probe pin is transferred onto the cleaning layer.
2. The probe pin cleaning sheet with cleaning power, according to claim 1, wherein the substrate is a fiberglass board, a plastic board, a synthetic stone board, or a metal plate.
3. The probe pin cleaning sheet with cleaning power, according to claim 1, wherein the plural cleaning grains of abrasive material contained in the cleaning material are processed with surface treatment.
4. The probe pin cleaning sheet with cleaning power, according to claim 3, wherein the cleaning grains of abrasive material contained in the cleaning material are fine abrasive powder in a grain size of 2 .Math.m to 5 .Math.m.
5. The probe pin cleaning sheet with cleaning power, according to claim 4, wherein the cleaning grains of abrasive material contained in the cleaning material is made of aluminum oxide, silicon nitride, boron nitride, silicon carbide, boron carbide or diamond, with at least one of them being inorganic fine powder.
6. The probe pin cleaning sheet with cleaning power, according to claim 1, wherein the silicone of the cleaning layer is epoxy resin, polyurethane resin or acrylic resin.
7. The probe pin cleaning sheet with cleaning power, according to claim 6, wherein the silicone in the cleaning layer is a general type, a high-resilient type, a high-strength type, a mixture of general type and high-lifetime type, or a mixture of general type, high-lifetime type and high-strength type.
8. The probe pin cleaning sheet with cleaning power, according to claim 7, wherein for the silicone of cleaning layer, the mixing ratio of the general type to the high-lifetime type is 0:1 to 1:1.
9. The probe pin cleaning sheet with cleaning power, according to claim 1, wherein the ratio of each abrasive grain in the cleaning layer to the cleaning grain of the abrasive material contained in the cleaning material is 1:2 to 1:4.
10. A manufacturing method of the probe pin cleaning sheet comprising steps of: a) having silicone and fine abrasive powder mixed in a special-purpose machine to form a mixed compound, thereby forming a high-density cleaning layer; b) having the mixed compound formed into a high-density cleaning layer; c) having the high-density cleaning layer being crushed and ground into powder; d) having the silicone and the fine abrasive powder mixed in the special-purpose machine to form the mixed compound, thereby forming a cleaning layer; e) having the mixed compound cut into a proper size and then put on the substrate, followed by placing into a mold for forming, thereby forming the cleaning layer integrally on the substrate; and f) having the release layer coated on the surface of silicone.
11. The manufacturing method of the probe pin cleaning sheet, according to claim 10, wherein the grain size of fine abrasive powder of 0.05~0.2 mm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0010]
[0011]
[0012]
[0013]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0014] Referring to
[0015] The release layer 10 is disposed on a surface of the cleaning layer 20, and can be a release film attached on a surface of the cleaning layer 20 or a silicone coating coated on a surface of the cleaning layer 20. The release layer 10 is used primarily to protect the surface of product in shipping.
[0016] The substrate 30 is disposed on the other surface of the cleaning layer 20. The cleaning layer 20 is provided with a cleaning material. The cleaning material is formed by plural abrasive grains 21, and each abrasive grain 21 is formed by plural cleaning grains 211. The cleaning layer 20 is made of silicone (silicone resin), and is formed integrally with the cleaning material on the substrate 30, so as to save the time in adhering for clients and prevent an adhesive layer from resulting in bubbles and peeling in high temperature. In addition, the cleaning layer 20 can be also bonded with the substrate 30 adhesively after being formed.
[0017] By the abovementioned structures, in the process that the probe pin 40 pierces the cleaning layer 20, through the material of cleaning layer 20, and the cleaning grains 211 of abrasive material contained in the cleaning material in the cleaning layer 20, the cleaning power is increased to scrape off dirt 41 from the surface of probe pin 40. In addition, by the negative charges and lipophilic property of the silicone itself, the dirt 41 on the probe pin 40 can be transferred onto the cleaning layer 20.
[0018] Referring to
[0019] Referring to
[0020] Referring to
[0021] Referring to
[0022] Referring to
[0023] Referring to
[0024] Referring to
[0025] Referring to
[0026] Referring to
[0027] Referring to
[0028] As silicone can be pierced, when the probe pin 40 pierces through the surface of silicone, the silicone containing the abrasive material will wrap the probe pin 40, and the dirt 41 on the surface of probe pin 40 will be separated from the probe pin 40 by the friction between the silicone and the probe pin 40. This friction force results from the complex body of silicone and abrasive material. Then, by using the fact that the silicone itself carries the negative charges and is provided with the lipophilic property, the dirt 41 or oil stain will be transferred onto the contact surface between the silicone and the probe pin 40. In addition, as the abrasive material is filled in the elastic body, the direct abrasive force to the probe pin 40 will be controlled based upon the fill-in ratio of the abrasive material. If the fill-in ratio is high, the hardness of silicone and the abrasive force will be increased, but it will also result in a risk of wearing on the tip of probe pin 40 and powder falling off from the tip of probe pin 40. On the contrary, if the fill-in ratio is low, the cleaning power will be insufficient.
[0029] Referring to
[0032] Referring to
[0039] In comparing with the prior art, the probe pin cleaning sheet with cleaning power and the manufacturing method of the probe pin cleaning sheet, provided by the present invention, are provided with following advantages that: [0040] 1. Most of existing cleaning sheets are based upon a high polymer material added with an abrasive material. The abrasive material needs to be increased to improve the cleaning effect. However, when the filler (abrasive material) in the high polymer material is increased, the aggregation force among the molecules will drop. When the probe pin pierces repeatedly at a same location, the debris may fall off due to molecular scission. The silicone itself carries the negative charges, is provided with the lipophilic property, is compressible, but is not tolerated to piercing. Therefore, these properties are used as a basis for the present invention; in other words, the present invention aims to make the probe pin pierce through the cleaning layer and to transfer the dirt on the surface of probe pin onto the silicone. [0041] 2. The cleaning power is increased. The abrasive grains 21 are wrapped by the pure silicone. When the probe pin 40 pierces through the abrasive grains 21, the abrasive grains 21 will not expand outward further as the peripheries of abrasive grains 21 are limited by the compression of silicone, thereby increasing the wrapping capacity of the probe pin. [0042] 3. The thickness of cleaning layer is decreased. When the fill-in ratio is increased, the existing cleaning sheet will need to use a multi-layered structure design; therefore, a certain thickness is necessary. [0043] 4. The risk of falling-off of powder is reduced. As the abrasive grains 21 are wrapped by the pure silicone, the risk of falling-off of the abrasive grains 21 is reduced.
[0044] It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.