Method of manufacturing power amplifier package embedded with input-output circuit

Abstract

A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole in which a power amplifier chip is to be disposed on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board.

Claims

1. A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board, attaching the lead frames to the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board, and plating the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board and the lead frames with nickel or gold.

2. The method according to claim 1, wherein at the step of preparing the dielectric circuit board, the dielectric substrate is an alumina (Al.sub.2O.sub.3) ceramic substrate.

3. The method according to claim 1, wherein at the step of preparing the dielectric circuit board, the input matching network metal pattern and the output matching network metal pattern are printed using tungsten (W) or molybdenum manganese alloy (MoMn).

4. The method according to claim 1, wherein at the step of preparing the dielectric circuit board, the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate are sintered in an electric furnace at 1250° C. to 1500° C.

5. The method according to claim 1, wherein at the step of preparing the dielectric circuit board, the input matching network metal pattern and the output matching network metal pattern are surface-treated with nickel, palladium or gold, after the input matching network metal pattern and the output matching network metal pattern are printed.

6. The method according to claim 1, wherein attaching the lead frames to the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board is done such that the dielectric substrate and lead frames are disposed on the same plane.

7. The method according to claim 1, wherein attaching the lead frames to the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board is performed by a brazing process.

8. The method according to claim 7, wherein attaching the heat sink on a bottom surface of the dielectric circuit board is performed by a brazing process.

9. The method according to claim 1, wherein the input matching network metal pattern extends to a left edge of the dielectric circuit board, wherein the output matching network metal pattern extends to a right edge of the dielectric substrate.

10. The method according to claim 9, wherein attaching the lead frames to the input matching network metal pattern and the output matching network metal pattern of the dielectric circuit board is done such that the dielectric substrate and lead frames are disposed on the same plane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a view showing a dielectric substrate of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

(2) FIG. 2 is a view showing a dielectric circuit board of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

(3) FIG. 3 is a view showing a heat sink of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

(4) FIG. 4 is a view showing lead frames of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

(5) FIG. 5 is a view showing a power amplifier package embedded with an input-output circuit, completed in a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(6) The detailed description of the present invention will be described below with reference to the accompanying drawings which show specific embodiments that the present invention can be embodied as an example. The embodiments are described in detail to be sufficient for those skilled in the art to embody the present invention. It should be understood that although the diverse embodiments of the present invention are different from each other, they do not need to be mutually exclusive. For example, specific shapes, structures and features described herein may be implemented as another embodiment without departing from the spirit and scope of the present invention in relation to an embodiment. In addition, it should be understood that the locations or arrangements of individual components in each disclosed embodiment may be changed without departing from the spirit and scope of the present invention.

(7) Therefore, it is not intended to take the detailed description described below in a limited sense, and if appropriately explained, the scope of the present invention is limited only by the attached claims, together with all the scopes equivalent to the claims. Like reference numerals in the drawings denote like or similar functions throughout several aspects, and the length, area, thickness and the like and the shape may be exaggerated for convenience.

(8) FIG. 1 is a view showing a dielectric substrate of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention, FIG. 2 is a view showing a dielectric circuit board of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention, FIG. 3 is a view showing a heat sink of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention, FIG. 4 is a view showing lead frames of a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention, and FIG. 5 is a view showing a power amplifier package embedded with an input-output circuit, completed in a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention.

(9) A power amplifier package embedded with an input-output circuit, which is manufactured in a method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention, may be configured to include, as shown in FIG. 5, a dielectric circuit board 100, a heat sink 200, and lead frames 311, 312, 313, 321, 322 and 323.

(10) First, as shown in FIG. 1, a power amplifier hole 111 in which a power amplifier chip is to be disposed on a dielectric substrate 110 is formed through a laser cutting process. Here, the dielectric substrate 110 may be an alumina (Al.sub.2O.sub.3) ceramic substrate.

(11) Next, as shown in FIG. 2, an input matching network metal pattern 121 is printed on the left side of the power amplifier hole 111 and an output matching network metal pattern 122 is printed on the right side of the power amplifier hole 111 in a screen printing process or a laser printing process. Here, the input matching network metal pattern 121 is for matching input impedance, and the output matching network metal pattern 122 is for matching output impedance.

(12) Meanwhile, the input matching network metal pattern 121 and the output matching network metal pattern 122 may be printed using tungsten (W) or molybdenum manganese alloy (MoMn).

(13) Thereafter, the input matching network metal pattern 121 and the output matching network metal pattern 122 may be surface-treated with nickel, palladium or gold.

(14) Next, the input matching network metal pattern 121 and the output matching network metal pattern 122 printed on the dielectric substrate 110 are sintered. Specifically, the input matching network metal pattern 121 and the output matching network metal pattern 122 printed on the dielectric substrate 110 are sintered in an electric furnace at 1250° C. to 1500° C.

(15) Next, as shown in FIG. 4, the lead frames 311, 312, 313, 321, 322 and 323 are prepared by etching the alloy 42 and plating nickel.

(16) Next, as shown in FIG. 5, the heat sink 200 of FIG. 3 is attached on the bottom surface of the dielectric circuit board 100 through a brazing process.

(17) Next, as shown in FIG. 5, the lead frames 311, 312, 313, 321, 322 and 323 are attached to the input matching network metal pattern 121 and the output matching network metal pattern 122 of the dielectric circuit board 100 through a brazing process.

(18) Next, the input matching network metal pattern 121 and the output matching network metal pattern 122 of the dielectric circuit board 100 and the lead frames 311, 312, 313, 321, 322 and 323 are plated with nickel or gold.

(19) As the method of manufacturing a power amplifier package embedded with an input-output circuit according to an embodiment of the present invention may embed an integrated input-output circuit in a dielectric substrate, and dispose the dielectric substrate and the lead frames on the same plane, the manufacturing process is efficient, and the manufacturing cost can be reduced effectively.

(20) Although the present invention has been described and shown in relation to the preferred embodiments for illustrating the principle of the present invention, the present invention is not limited to the configuration and operation as is shown and described.

(21) Rather, those skilled in the art may fully understand that the present invention can be diversely changed and modified without departing from the spirit and scope of the appended claims.