ANTENNA FOR LIGHTING CONTROL AT MESH NETWORKS NODES
20170317400 · 2017-11-02
Inventors
Cpc classification
H04W84/18
ELECTRICITY
F21S8/085
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
H01Q1/22
ELECTRICITY
H01Q9/42
ELECTRICITY
H01Q9/0421
ELECTRICITY
Y02B20/40
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01Q1/44
ELECTRICITY
International classification
H01Q1/22
ELECTRICITY
H04W84/18
ELECTRICITY
Abstract
One exemplary embodiment provides a node for use in a mesh network. The node includes a set of printed circuit boards and a radiating element coupled to a printed circuit board of the set of printed circuit boards. The radiating element is raised above the plane of the printed circuit board.
Claims
1. A node for use in a mesh network, comprising: a set of printed circuit boards, and a radiating element coupled to a printed circuit board of the set of printed circuit boards; wherein the radiating element is raised above the plane of the printed circuit board.
2. The node of claim 1, wherein the printed circuit board is disposed farthest away from the base of the node.
3. The node of claim 2, wherein the base is adapted to couple to a dorsal portion of a luminaire.
4. The node of claim 1, wherein the radiating element is included in an antenna.
5. The node of claim 4, wherein the antenna is an inverted F/half slot antenna.
6. The node of claim 4, wherein the antenna is configured for mesh networking.
7. The node of claim 4, wherein the antenna includes an FR-4 PCB material.
8. The node of claim 1, wherein the radiating element is configured to provide a vertical polarization of an electromagnetic wave emanating from the radiating element.
9. The node of claim 1, wherein the radiating element is disposed about 18 mm above the printed circuit board.
10. A node assembly for use in a luminaire mesh network, the node assembly comprising: a set of printed circuit boards including at least two stacked printed circuit boards; and an antenna disposed on one of the at least two stacked printed circuit boards, the antenna including at least one element elevated with respect to a plane of the one of the at least two stacked printed circuit boards.
11. The node assembly of claim 10, wherein the one of the at least two stacked printed circuit board is disposed farthest away from a dorsal portion of a luminaire when a node including the node assembly is mounted on the luminaire.
12. The node assembly of claim 10, wherein the antenna includes a radiating element configured to provide a vertical polarization of an electromagnetic wave emanating from the radiating element.
13. The node assembly of claim 10, wherein the antenna is a 1/F half-slot antenna.
14. The node assembly of claim 10, wherein the at least one element is disposed about 18 mm away from the plane.
15. The node assembly of claim 10, wherein the antenna is co-located with at least one other antenna.
16. The node assembly of claim 10, wherein the antenna is co-located with at least one transceiver.
17. The node assembly of claim 10, wherein the antenna is configured for mesh network communications.
18. A node assembly for use in a luminaire mesh network, the node assembly comprising: a set of printed circuit boards including at least two stacked printed circuit boards; and a set of antennas, wherein each antenna in the set of antennas is disposed on one of the at least two stacked printed circuit boards, and wherein each antenna in the set of antennas includes at least one element elevated with respect to a plane of the one of the at least two stacked printed circuit boards.
19. The node assembly of claim 18, wherein each antenna in the set of antennas is a 1/F half-slot antenna.
20. The node assembly of claim 18, wherein each antenna in the set of antennas includes at least one radiating element disposed about 18 mm away from the plane.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Illustrative embodiments may take form in various components and arrangements of components. Illustrative embodiments are shown in the accompanying drawings, throughout which like reference numerals may indicate corresponding or similar parts in the various drawings. The drawings are only for purposes of illustrating the embodiments and are not to be construed as limiting the disclosure. Given the following enabling description of the drawings, the novel aspects of the present disclosure should become evident to a person of ordinary skill in the relevant art(s).
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DETAILED DESCRIPTION
[0018] While the illustrative embodiments are described herein for particular applications, it should be understood that the present disclosure is not limited thereto. Those skilled in the art and with access to the teachings provided herein will recognize additional applications, modifications, and embodiments within the scope thereof and additional fields in which the present disclosure would be of significant utility.
[0019] Typical small surface mount antennas suffer from poor efficiency resulting from distorted and asymmetrical radiation patterns due to their proximity to PCBs and other components. Further, they have narrow bandwidth due to their small “electrical” size. In the embodiments, the antenna's radiating element is raised above the plane of the device's upper PCB allows it to achieve much higher efficiency and field uniformity. The vertical orientation of the antenna allows it to make much better use of available space to provide a larger “electrical” antenna effect (effectively ¼ wavelength) and has been optimized to provide much better (wider) bandwidth as a result.
[0020] Small surface mount (SMT) antennas typically found in lighting control mesh network nodes can suffer from poor efficiency, i.e., they may have a distorted and/or asymmetrical radiation pattern due to the proximity of the antennas to the PCBs located in the node. Additionally, these antennas may narrow bandwidth due to their small “electrical” size. Furthermore, a typical SMT antenna can also suffers from a high susceptibility to EM interference, especially to interference emanating from below its position relative to the PCB. This is partly due to the antenna's requirement of a large non-metalized opening in the PCB.
[0021] In contrast to typical SMT antennas, antennas implemented according to some of the embodiments circumvent the aforementioned shortcomings by being mated to a PCB which provides a solid unbroken ground plane. The PCB thus acts as a counterpoise and augments the antenna's performance while effectively shielding the antenna from EM emissions originating from below.
[0022] Furthermore, according to the embodiments, raising the antenna's radiating element above the plane of the node's upper PCB allows it to achieve much higher efficiency and field uniformity. Such a vertical orientation of the antenna allows it to make much better use of available space to provide a larger “electrical” antenna effect (i.e., effectively providing a ¼ wavelength antenna) and which leads to an improved (i.e., wider) bandwidth with respect typical SMT antennas.
[0023] Antennas implemented according to the embodiments can be inverted F/half-slot antennas, making them ideal for lighting control in mesh networks. Further, the exemplary antennas can be made to fit at a relatively low profile (e.g., ˜18 mm height) while still maintaining the required vertical polarization, along with the aforementioned performance features, in contrast to other vertical polarization antenna designs commonly seen, such as the typically-used vertical ¼-wave monopole or helical antennas.
[0024] Antennas implemented according to the embodiments are extremely low cost compared to typical SMT antennas because they can be made of commodity-grade FR-4 PCB material, which can be sourced from any PCB manufacturer. As such, the embodiments achieve ease of manufacture, consistency, quality, and low cost of assembly in addition to high performance. Furthermore, antennas implemented according to embodiments can be installed via a normal SMD reflow soldering process, simultaneously with other components on the PCB, thereby further providing ease of integration and assembly.
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[0029] The embodiments confer several advantages that are readily appreciable by one of skill in the art. For example, and not by limitation, in some of the embodiments, primary antenna performance parameters are significantly superior to typical antennas for meshed nodes. Therefore, antennas according to the embodiments have greater range and thus provide more robust and reliable communication links. Further, in some of the embodiments, there are no external matching components, a feature which reduces installation cost and improves quality and consistency in manufacturing. In addition, the antennas are resistant to detuning effects that can be caused by the human body and by wet weather. The embodiments also feature antennas that can be mounted via a standard SMD reflow soldering process, thereby providing additional cost savings.
[0030] For contexts different than mesh network node applications, (i.e., in applications where height and other constraints and performance objectives are different than those of mesh network nodes), alternate embodiments can achieve similar or even better performance, using several discrete antennas that are symmetrically embedded or placed around the main horizontal PCB edge. In these embodiments, an “antenna diversity” arrangement is used to recover a more uniform effective total antenna field pattern and directional gain.
[0031] Those skilled in the relevant art(s) will appreciate that various adaptations and modifications of the embodiments described above can be configured without departing from the scope and spirit of the disclosure. Therefore, it is to be understood that, within the scope of the appended claims, the disclosure may be practiced other than as specifically described herein.