Method for coating a substrate

Abstract

A method for coating substrates provided with vias uses a first step in which the substrate is conditioned and a second step in which the substrate is coated with an electrically insulating material such that the vias are filled up completely.

Claims

1. A method for coating a substrate provided with vias, wherein the following steps are carried out: the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias; the substrate is coated with the electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface, wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate.

2. The method of claim 1 wherein said conditioning step takes place at atmospheric pressure.

3. The method of claim 1 wherein said substrate is plasma-treated to condition it.

4. The method of claim 1 wherein said substrate is oxidised to condition it.

5. The method of claim 1 wherein a solvent is applied to the substrate to condition it.

6. The method of claim 5 wherein said substrate is subjected to a combination of a plasma-treatment and an application of a solvent.

7. The method of claim 5 wherein said substrate is subjected to a combination of an oxidation-treatment and an application of a solvent.

8. The method of claim 5 wherein said solvent is applied by spin-coating.

9. The method of claim 5 wherein said substrate provided with said solvent is introduced into a vacuum chamber, a pressure in said vacuum chamber being reduced, and said vacuum chamber being ventilated again after a holding time.

10. The method of claim 9 wherein said pressure in the vacuum chamber is reduced by 0.1 to 0.9 bar from an atmospheric pressure.

11. The method of claim 9 wherein said holding time is approximately 10 s to 60 s.

12. The method of claim 9 wherein said substrate is heated in said vacuum chamber.

13. The method of claim 12 wherein said substrate is heated to a temperature of >30° C.

14. The method of claim 5 wherein after said solvent has been applied, said substrate is transported into a different chamber, said substrate being coated within said different chamber with said electrically insulating material.

15. The method of claim 1 wherein said electrically insulating material is applied by spin-coating.

16. The method of claim 1 wherein said electrically insulating material is at least one of a dielectric, a resist and an epoxy resin.

17. The method of claim 1 wherein said electrically insulating material is cured after being applied.

18. A method for coating a substrate provided with vias, wherein the following steps are carried out: the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias by applying a solvent to the substrate; the substrate is coated with an electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface, wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate.

19. A method for coating a substrate provided with vias, wherein the following steps are carried out: the substrate is conditioned to improve flowability of an electrically insulating material to be filled into the vias by applying a solvent to the substrate; the substrate is coated with an electrically insulating material such that the vias are filled up completely with the electrically insulating material in such a way that the electrically insulating material has as a flat surface, wherein the vias connect electrically conductive structures on a first side of the substrate to electrically conductive structures arranged on a second side of the substrate, and wherein said substrate provided with said solvent is introduced into a vacuum chamber, a pressure in said vacuum chamber being reduced, and said vacuum chamber being ventilated again after a holding time.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the following, the invention is disclosed in greater detail with reference to various embodiments, which are shown in the accompanying drawings, in which:

(2) FIG. 1 is a sectional view of part of a coated substrate provided with a via;

(3) FIG. 2 schematically shows the method according to the invention;

(4) FIG. 3 shows the conditioning step of the method of FIG. 2 in greater detail; and

(5) FIG. 4 is a graph showing the pressure progression over time during the conditioning of FIG. 3.

DETAILED DESCRIPTION OF THE INVENTION

(6) FIG. 1 schematically shows a substrate 10 (“wafer”), which may for example consist of a semiconductor material. The substrate 10 may be provided with various electrical or electronic components, of which merely an electrical contact 12 is schematically illustrated in this case.

(7) On the side opposite the contact, the substrate 10 is provided with an electrical conductor 14, which may be formed as a strip conductor or an electrically conductive coating. To connect the contact 12 to the conductor 14, the substrate 10 is provided with a via 16, in other words an opening which extends substantially perpendicularly to the plane of the substrate from at least one surface. In this case, the via 16 is formed as an opening extending from the side of the conductor 14 through the substrate 10 to the contact 12.

(8) Since the via 16 is closed at the underside by the contact 12 in the embodiment shown, it is a blind hole. It is also possible for the via 16 to connect the conductor 14 to a second conductor arranged on the underside of the substrate. In this case, the via would be a through-hole.

(9) The detail of the substrate 10 shown in FIG. 1 merely contains a single via 16. In reality, the substrate is provided with a very large number of vias. When “the” via 16 is being discussed in the following, this also applies to the further vias with which the substrate is provided, which are treated in the same way as the via shown in the drawing.

(10) In this case, the electrical connection between the contact 12 and the conductor 14 is provided by an electrically conductive coating 18 located on the wall of the via 16. The coating 18 may be applied retroactively, to connect the previously applied conductor 14 to the contact 12, or be applied in the same working step as the conductor 14.

(11) The side of the substrate 10 provided with the conductor 14 is coated with an electrically insulating material 20. The material 20 is for electrical insulation and optionally also for shielding. Suitable materials are for example a photoresist (resist), an epoxy resin or another dielectric.

(12) As can be seen in FIG. 1, the electrically insulating material 20 has a planar surface. This is in particular because the electrically insulating material 20 completely fills up the via 16, even though the depth of the via 16 is one to two times the diameter of the via 16 (and in some cases even larger depth ratios may be used).

(13) FIG. 2 schematically shows the method by which the electrically insulating material 20 can be applied in such a way that it completely fills the via 16.

(14) In a first method step I, the substrate 10 is conditioned. This is shown schematically here by the arrows P. The conditioning may be carried out by plasma-treating or oxidising the substrate 10. The conditioning may also be carried out by applying a solvent. Combinations of these two variants are also possible.

(15) After the conditioning, the substrate 10 is transported onwards into another treatment station, in which it is coated with the electrically insulating material (method step II).

(16) The coating may be applied by spin-coating, in such a way that the substrate 10 is arranged on a support 30 which can be set in rotation by a motor 32 (see arrow R). The desired electrically insulating material is being applied to the substrate 10 to the rotating substrate 10 using a nozzle 34.

(17) Subsequently, the substrate 10 is transported onwards into yet another treatment station in which the electrically insulating material is cured (method step III). The electrically insulating material 20 may in particular be cured by exposing it to UV light or heat (see the schematically shown heat source 36).

(18) FIG. 3 shows method step I in detail. In the conditioning embodiment shown here, the substrate 10 is coated with a solvent 40 by spin-coating. This takes place at atmospheric pressure.

(19) For coating, the substrate 10 may be arranged on a support 42 which can be set in rotation by a motor 44 (again, see arrow R).

(20) The solvent may for example be acetone, PGMEA (1-methoxy-2-propylacetate), ethyllactate or NMP (N-methyl-pyrrolidone).

(21) After the solvent 40 is applied, the substrate 10 is transported onwards into a vacuum chamber 50 where it is deposited on a support 52 which may be provided with a heater 54 (shown schematically). The substrate 10 (and thus the solvent 40 applied thereto) can be heated using the heater 54, for example to temperatures of >30° C.

(22) When the substrate 10 is introduced into the vacuum chamber 50, said chamber 50 is evacuated. A schematically shown vacuum pump 56 or a Venturi nozzle may be used for this purpose. In one embodiment, the pressure may be reduced from atmospheric pressure to a pressure of approximately 0.3 bar (see also FIG. 4).

(23) When the vias are being evacuated, part of the air located therein is also sucked out. This also locally influences the layer of solvent 40 located on the substrate 10.

(24) When the desired vacuum has been achieved, the pressure in the vacuum chamber 50 is kept constant or a predetermined holding time (t.sub.1 to t.sub.2). The holding time may for example be approximately 10 to 60 s. During this holding time, the air bubble which is initially enclosed under a solvent layer in the via 16 migrates upwards whilst solvent 40 migrates downwards into the via 16. As a result, the walls of the via are completely wetted with solvent 40.

(25) The rise of the air bubble which is initially enclosed in the via can be assisted by heating the substrate 10. This causes the air bubble in the via to expand even more than it already does because of the reduction in air pressure in the vacuum chamber.

(26) Once the holding time has elapsed, the vacuum chamber 50 is ventilated again, causing the pressure therein to rise to atmospheric pressure. In the process, air is drawn into the vias 16, also drawing solvent into the vias. This ensures that the solvent 40 completely wets the walls of the vias 16.

(27) Once the vacuum chamber 50 is back at the initial pressure, the substrate 10 is removed and transported to a further treatment station in which method step II, in other words the coating with the electrically insulating material 20, can be carried out. Since the walls of the vias 16 are wetted with the solvent, the electrically insulating material 20 flows into the vias 16 very well and fills them up completely. As a result, there are no problems due to air inclusions or the like, and so the electrically insulting material 20 has an (at least almost) planar surface even in the region of the vias 16.