ROTATION SENSOR

Abstract

The invention provides a rotation sensor enabling simplification of manufacturing process, such as an inspection step, while maintaining measurement accuracy of the rotation sensor. Lead frames of a rotation sensor have positioning sections which contact a side surface section of a case and, in this state of contact, keep the insertion depth dimension of a magnetism detection unit in the internal space of the case to a prescribed dimension; a flange lower flat surface of a flange section is provided further towards the case bottom surface side than a flange lower flat surface of a ring-shaped rib, a portion of the outer peripheral section of the case and the ring-shaped rib are exposed in a ring shape from an exterior molding section, and the case is provided with a plurality of projections along the inner side surface of the case which constitutes the internal space.

Claims

1. A rotation sensor detecting rotation of a rotary body, the sensor comprising: a case; a pair of lead frames and a magnetism detection unit, wherein the case has a bottom surface section disposed at an interval from a surface of the rotary body, and a side surface section which is connected to the bottom surface section and which, together with the bottom surface section, forms a hollow internal space; an opening spatially connecting with the internal space is provided in the side surface section of the case on an opposite side to the bottom surface section; an outer peripheral section of the case has a ring-shaped rib; each of the pair of lead frames has a transmission path forming section having one end section and another end section, the transmission path forming section forming a transmission path for an electrical signal or a transmission path for electric power; the one end section of the transmission path forming section of the pair of lead frames is inserted into the internal space of the case via the opening; the pair of lead frames are disposed in such a manner that the other end section of the transmission path forming section projects to the outer side of the case; the magnetism detection unit is provided in the one end section of the transmission path forming section and is accommodated in the internal space of the case; the magnetism detection unit has magnetism detection means for detecting change in a magnetic field of a magnet provided in the rotary body or change in a magnetic field of a magnet accommodated in the internal space of the case; the pair of lead frames respectively have positioning sections which contact the side surface section of the case when the transmission path forming section is inserted into the internal space of the case, and in this state of contact, keep an insertion depth dimension of the magnetism detection unit in the internal space of the case to a prescribed dimension; the rotation sensor is further provided with an exterior molding section having a flange section about the periphery of the case; and a flange lower flat surface of the flange section is provided further towards the case bottom surface side than the flange lower flat surface of the ring-shaped rib, an outer peripheral section of the case and a portion of the ring-shaped rib are configured to be exposed in a ring shape from the exterior molding section, and a plurality of projections are provided along the inner side surface of the case which constitute the internal space.

2. The rotation sensor according to claim 1, wherein all or a portion of the projections on the inner side surface of the case constitute a portion of the inner periphery of a connector housing.

3. The rotation sensor according to claim 1, wherein the ring-shaped rib of the case has a relatively large-diameter section and a relatively small-diameter section; and a ring-shaped projection which is concentric with the ring-shaped rib and has a smaller diameter than the large-diameter section of the ring-shaped rib is provided on the small-diameter section.

4. The rotation sensor according to claim 1, wherein the ring-shaped rib of the case has a pair of relatively large-diameter sections and a relatively small-diameter section; the small-diameter section is positioned between the pair of large-diameter sections; and a ring-shaped projection which is concentric with the ring-shaped rib and has a smaller diameter than the large-diameter sections of the ring-shaped rib is provided on the small-diameter section.

5. The rotation sensor according to claim 1, wherein a ring-shaped projection which contacts the exterior molding section is formed on the flange lower flat surface of the flange section.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 is a diagram showing a constitution of an assembly structure of a rotation sensor according to a first embodiment of the invention;

[0024] FIG. 2 is a cross-sectional diagram showing a rotation sensor according to the first embodiment of this invention;

[0025] FIG. 3 is a cross-sectional diagram showing a rotation sensor according to the first embodiment of this invention;

[0026] FIG. 4 is a cross-sectional diagram showing a rotation sensor according to the first embodiment of this invention;

[0027] FIG. 5 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIG. 1;

[0028] FIG. 6 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIG. 1;

[0029] FIG. 7 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIG. 1;

[0030] FIG. 8 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIG. 1;

[0031] FIG. 9 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIG. 1;

[0032] FIG. 10 is a cross-sectional diagram showing a rotation sensor according to a second embodiment of this invention;

[0033] FIG. 11 is a cross-sectional diagram showing a rotation sensor according to a second embodiment of this invention;

[0034] FIG. 12 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in FIGS. 10 and 11;

[0035] FIG. 13 is a cross-sectional diagram showing a rotation sensor according to a third embodiment of this invention;

[0036] FIG. 14 is a cross-sectional diagram showing a rotation sensor according to a fourth embodiment of this invention;

[0037] FIG. 15 is a cross-sectional diagram showing a rotation sensor according to a fifth embodiment of this invention;

[0038] FIG. 16 is a cross-sectional diagram showing a rotation sensor according to a sixth embodiment of this invention;

[0039] FIG. 17 is a diagram showing a constitution of an assembly structure of a rotation sensor in an illustrative example;

[0040] FIG. 18 is a cross-sectional diagram showing a rotation sensor in an illustrative example;

[0041] FIG. 19 is a cross-sectional diagram showing a rotation sensor in an illustrative example;

[0042] FIG. 20 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in an illustrative example;

[0043] FIG. 21 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in an illustrative example; and

[0044] FIG. 22 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor in an illustrative example.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0045] Below, embodiments of the present invention are described with reference to the drawings. Same reference numerals are used for same or corresponding sections in the drawings.

First Embodiment

[0046] A rotation sensor for detecting rotation of a rotating body, which is used in an engine or transmission, etc. of an automobile, for example, is described as a first embodiment. FIGS. 1 to 4 are cross-sectional diagrams showing a rotation sensor according to the first embodiment of this invention. FIG. 3 is a cross-sectional diagram showing a state where a lead frame 3Y is viewed in the direction of arrow III in FIG. 2. In FIGS. 1 to 3, the rotation sensor 1 according to the first embodiment has a case (bottomed case) 2 which is a primary molding section, a pair of lead frames 3X, 3Y, an IC 4 serving as magnetism detection means, a sensor internal magnet 5, and a pair of wires 6X, 6Y. The IC 4, the sensor internal magnet 5 and the pair of wires 6X, 6Y are unified in a single body by epoxy resin, or the like, to constitute a magnetism detection unit (rotation detection unit) 7. The IC 4, includes a detection element, which is a Hall element, for example, and a signal processing circuit (neither illustrated in the drawings).

[0047] The case 2 has a bottom surface section 2a and a side surface section 2b. The shape of the side surface section 2b is a round ring-shape in cross-section. Furthermore, the lower end of the side surface section 2b is connected to the bottom surface section 2a. Moreover, the side surface section 2b, together with the bottom surface section 2a, forms a hollow internal space inside the case 2. Furthermore, an opening 2c is provided in the case 2 and is disposed so as to border the bottom surface section 2a and connect spatially with the internal space. The opening peripheral edge surface (the upper surface in FIGS. 1 to 3) 2d, which is the end surface of the side surface section 2b of the case 2 on the opposite side to the bottom surface section 2a, constitutes an abutting surface for abutting against the lead frames 3X, 3Y.

[0048] The outer surface of the bottom surface section 2a (the lower surface in FIGS. 1 to 3) constitutes a front end surface 2e of the rotation sensor 1. The case 2 has a ring-shaped rib 13 on the case opening 2c side of the outer peripheral section 2g, which is a portion that fits with the housing 10.

[0049] FIG. 4 is a cross-sectional diagram showing a state where the case 2 is viewed in the direction of arrow IV in FIG. 2, but as shown in FIG. 4, the case 2 has a plurality of projections 16 along the inner side surface.

[0050] An internal filling resin 8 is filled inside the case 2. Furthermore, the opening 2c side of the case 2 is covered by a secondary molding section (exterior resin) 9 which forms an exterior molding section. The secondary molding section (exterior resin) 9 forms a connector housing for external connection, a flange lower flat surface 9a, which is a sensor mounting surface for mounting the rotation sensor 1 on the housing 10, and a sensor exterior section.

[0051] The shape of the lead frames 3X, 3Y is like the Greek letter t (lowercase “tau”). Furthermore, the lead frames 3X, 3Y are disposed at intervals in the radial direction of the side surface section 2b of the case 2. Moreover, the lead frames 3X, 3Y are inserted into the internal space of the case 2 via the opening 2c.

[0052] The lead frames 3X, 3Y have terminal molding sections 3Xa, 3Ya, IC connection sections 3Xb, 3Yb, transmission path forming sections 3Xc, 3Yc, projecting sections 3Xd, 3Yd, and positioning sections 3Xe 3Ye.

[0053] The terminal forming sections 3Xa, 3Ya constitute terminals for external connection. The IC connection sections 3Xb, 3Yb are electrically connected to the IC 4 via wires 6X, 6Y. The shape of the transmission path forming sections 3Xc, 3Yc is a bar shape or plate shape. Furthermore, the transmission path forming sections 3Xc, 3Yc form signal/electric power transmission paths between the terminal forming sections 3Xa, 3Ya and the IC connection sections 3Xb, 3Yb.

[0054] The projecting sections 3Xd, 3Yd are formed so as to project (branch off) from the central portion of the transmission path forming section 3Xc, 3Yc in the lengthwise direction, in a direction perpendicular to the lengthwise direction of the transmission path forming sections 3Xc, 3Yc (the left/right direction in FIGS. 1 and 2). Furthermore, the projecting sections 3Xd, 3Yd and the transmission path forming sections 3Xc, 3Yc intersect perpendicularly. The projecting section 3Xd and the positioning section 3Xe, and the projecting section 3Yd and the positioning section 3Ye, are respectively formed in an L shape.

[0055] The positioning sections 3Xe, 3Ye project towards the IC connection sections 3Xb, 3Yb in the lengthwise direction of the transmission path forming sections 3Xc, 3Yc (downwards in FIGS. 1 and 2) from the opposite ends of the projecting sections 3Xd, 3Yd to the transmission path forming sections 3Xc, 3Yc. The lower end surfaces of the positioning sections 3Xe, 3Ye constitute positioning surfaces and contact the opening peripheral edge surface 2d of the case.

[0056] The IC connection section 3Yb is parallel to the bottom surface section 2a of the case 2, and has an IC installation surface section 3Yb′ which is a flat plate shape. The IC 4 is installed on one surface of the IC installation surface section 3Yb′ (the lower surface of the IC installation surface section 3Yb′ in FIGS. 1 to 3). The sensor internal magnet 5 is installed on the other surface of the IC installation surface section 3Yb′ (the upper surface of the IC installation surface section 3Yb′ in FIGS. 1 to 3).

[0057] The magnetism detection unit 7 has the detection element of the IC 4 as magnetism detection means, and the detection element of the IC 4 receives electric power from the transmission path forming section 3Yc via the wire 6Y, and generates a signal corresponding to the change in the magnetic field of the sensor internal magnet 5 due to the movement of the plurality of projection-shaped sections 12 (moving magnetic body). The detection element of the IC 4 outputs the generated signal to the transmission path forming section 3Xc via the wire 6X.

[0058] Here, the various dimensions of the rotation sensor 1 in FIG. 1 will be described. The dimension B which is important for maintaining the measurement accuracy of the rotation sensor is expressed by the following equation on the basis of dimension E, dimension D and gap A.

B=D−E+A

[0059] These dimensions are as indicated below.

A: Distance from sensor front end surface 2e to projection-shaped sections 12 of moving magnetic body
B: Dimension between moving magnetic body and IC 4 (surface on side of moving magnetic body: lower surface in FIG. 1)
D: Dimension between bottom surface section 2a of case 2 (sensor front end surface 2e) and opening peripheral edge surface 2d (contact surface)
E: Dimension between opening peripheral edge surface 2d of case 2 and IC 4 (surface on side of moving magnetic body: lower surface of FIG. 1) (insertion depth dimension)

[0060] The gap A is determined by the following equation, using the respective dimensions indicated in FIG. 1.

A=α+γ−β/2−C

[0061] Here, the dimensions shown in FIG. 1 are as indicated below.

α: distance from central position of assembly of moving magnetic body to assembly position of rotation sensor 1
β: diameter of moving magnetic body
γ: range of divergence between central position of rotation of moving magnetic body and assembly position of moving magnetic body in housing 10
C: pick-up length (length from flange lower flat surface 9a, which is the sensor mounting surface of the rotation sensor 1, to the sensor front end surface 2e)

[0062] In the present embodiment, the flange section 9′ is configured only by the secondary molding section (exterior resin) 9. By providing the flange lower flat surface 9a, which is a sensor mounting surface for mounting the rotation sensor 1 on the housing 10, on the case 2 further towards the side of the sensor front end surface 2e than the ring-shaped rib lower flat surface 13a, and by providing an exposed section 14 in which the outer peripheral section 2g of the case 2 and a portion of the ring-shaped rib 13 are exposed in a ring shape, the flange lower flat surface 9a which is configured by a secondary molding section (exterior resin) 9 is separated from the interface 15 between the primary molding section and the secondary molding section. Consequently, it is possible to prevent creep-up of the exterior molding resin onto the flange section, fluctuation in the dimension C (pick-up length) of the flange lower flat surface 9a and the sensor front end surface 2e is suppressed, and the dimension C can be kept to the prescribed dimension.

[0063] Below, a manufacturing process for configuring the rotation sensor 1 according to the first embodiment will be described. FIGS. 5 to 9 are illustrative diagrams for describing one step of a manufacturing process of the rotation sensor 1 in FIG. 1.

[0064] First Step

[0065] FIGS. 5 and 6 are illustrative diagrams for describing one step of a manufacturing process of the rotation sensor according to a first embodiment of the invention. FIG. 6 is a cross-sectional diagram showing a state where a lead frame 3Y is viewed in the direction of arrow VI in FIG. 5. As shown in FIGS. 5 and 6, a lead frame coupled body 3Z and the magnetism detection unit 7 are inserted into an internal space by passing through an opening 2c in the case 2, which is a primary molding section, and the magnetism detection unit 7 is accommodated inside the case 2. Positioning sections 3Xe, 3Ye for positioning with respect to the case 2 are provided in the lead frame coupled body 3Z, and the dimension E in FIG. 1 is determined with good accuracy. In other words, the insertion depth dimension of the lead frames 3X, 3Y and the magnetism detection unit 7 (IC 4) into the case 2 is kept to a prescribed dimension, by the positioning sections 3Xe, 3Ye, and in this state, the lead frames 3X, 3Y and the magnetism detection unit 7 are fixed by the internal filling resin 8. Accordingly, the height position of the magnetism detection unit 7 inside the case 2 is determined. Therefore, the dimension E in FIG. 1 is a prescribed dimension. Furthermore, the dimension D in FIG. 1 is determined by the structure of the single case 2.

[0066] Second Step

[0067] FIGS. 7 and 8 are illustrative diagrams for describing one step of a manufacturing process of the rotation sensor according to the first embodiment of the invention. FIG. 8 is a cross-sectional diagram showing a state where a lead frame 3Y is viewed in the direction of arrow VIII in FIG. 7. As shown in FIGS. 7 and 8, the internal filling resin 8 is filled inside the case 2 in a state where the magnetism detection unit 7 has been accommodated inside the case 2. After curing the internal filling resin 8, a coupling section 3Za, which links the lead frames 3X, 3Y, is removed from the lead frame coupled body 3Z. In other words, the lead frames 3X, 3Y in the lead frame coupled body 3Z are separated from each other.

[0068] Third Step

[0069] FIG. 9 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor according to the first embodiment of the invention. As shown in FIG. 9, the components which are in an assembled state in the case 2 from the second step are set in molding dies 40X, 40Y, 40Z of the secondary molding section (exterior resin) 9. The molding dies 40X, 40Z make contact with the outer peripheral section 2g and the ring-shaped rib 13 of the case 2, thereby fixing the case 2. The molding die 40Y contacts the terminal forming sections 3Xa, 3Ya of the lead frames 3X, 3Y, thereby fixing the lead frames 3X, 3Y. In order to configure the flange lower flat surface 9a by the secondary molding section (exterior resin) 9 only, the molding dies 40X, 40Z are divided into a region 15a which contacts the ring-shaped rib lower flat surface 13a of the case 2 (the contact section between the primary molding section and the molding die (called the “seal surface” below)), and a region 15b constituting the flange lower flat surface 9a configured by the secondary molding section (exterior resin) 9. By injecting exterior molding resin in the direction of arrow 6 in FIG. 9, from the gate 40a and into these molding dies 40X, 40Y, 40Z, a connector housing for external connection and a flange and sensor exterior section, which are a section for mounting on the housing 10, are formed in the case 2. According to the first embodiment, since the flange lower flat surface 9a is configured only by the secondary molding section (exterior resin) 9, then the pick-up length (dimension C) is determined accurately.

[0070] The rotation sensor 1 is manufactured by implementing the first to third steps indicated above.

[0071] As described above, by configuring the flange section only from a secondary molding section (exterior resin) 9, it is possible to prevent creep-up of the exterior molding resin onto the flange section, fluctuation in the dimension C (pick-up length) of the flange lower flat surface 9a and the sensor front end surface 2e is suppressed, and the dimension C can be kept to the prescribed dimension. Furthermore, in the first embodiment, a structure is adopted in which, when molding the exterior, the bottom surface section 2a of the case 2 does not contact the molding dies 40X, 40Z. By this means, when forming the exterior molding, since the only region where the case 2 and the molding dies 40X, 40Z are in contact is the seal surface 15a, then the filling pressure of the exterior molding resin is concentrated at the seal surface 15a, and a configuration that makes creep-up of exterior molding resin onto the ring-shaped rib lower flat surface 13a less liable to occur is achieved. Furthermore, even if creep-up of the second molding section (exterior molding resin) 9 onto the ring-shaped rib lower flat surface 13a occurs, the flange lower flat surface 9a and the ring-shaped rib lower flat surface 13a are not situated in the same plane, and therefore the pick-up length (dimension C) does not become larger.

[0072] Moreover, in the rotation sensor 1 according to the first embodiment, there is a plurality of projections 16 along the inner side surface of the case 2, as shown in FIG. 4. The rigidity of the case is increased in accordance with the projections 16, and the deformation in the 11 direction due to the filling pressure of the exterior molding resin is suppressed. Consequently, fluctuation in the dimension B is suppressed by suppressing distortion of the positioning section 2d of the lead frame.

[0073] Consequently, it is possible to suppress fluctuation in the dimension B, and a measurement accuracy equivalent to or higher than the conventional rotation sensor can be maintained. In addition, since creep-up of the exterior molding resin onto the flange section can be suppressed, then an inspection step can be omitted.

[0074] Furthermore, as an additional effect, by providing the exposed section 14 so as to contact the case outer peripheral section 2g, it is possible to prevent creep-up of the exterior molding resin onto the case outer peripheral section 2g. Therefore, fluctuation in the diameter dimension F of the outer peripheral section 2g of the case 2 in FIG. 1 is suppressed and can be kept to a prescribed dimension. When the fluctuation in the diameter dimension F has become larger, the fitting properties with the housing 10 become worse. If creep-up of the exterior molding resin occurs in the case outer peripheral section 2g, then an inspection step is necessary, but in the rotation sensor according to the first embodiment, the inspection step can be omitted.

[0075] Moreover, in the case of the rotation sensor 1 according to the first embodiment, since the flange lower flat surface 9a is provided on the secondary molding section (exterior resin) 9, then it is possible to change the pick-up length just by changing the die for exterior molding, without changing the shape of the case. For instance, in a vehicle-mounted rotation sensor, the distance between the housing and the moving magnetic body varies with the layout of the engine, and therefore a rotation sensor having a pick-up length corresponding to the layout is necessary. According to the present embodiment, it is possible to achieve rotation sensors having various pick-up lengths using the same case, and since common parts can be used for the case, then the manufacturing steps can be simplified and costs can be lowered.

[0076] As described above, according to the rotation sensor of the present invention, it is possible to prevent creep-up of exterior resin onto the flange lower flat surface and the case outer peripheral section during exterior molding, and the dimensions of the flange lower flat surface and the sensor front end surface (pick-up length) and/or the dimensions of the outer periphery of the case can be kept to prescribed dimensions. Furthermore, by suppressing deformation of the case during exterior molding, it is possible to maintain the positioning accuracy of the IC inside the sensor, and therefore a measurement accuracy equivalent to or greater than an existing rotation sensor can be maintained. In addition, it is possible to omit an inspection step for managing creep-up of the exterior molding resin onto the flange lower flat surface and the case outer peripheral section.

Second Embodiment

[0077] A second embodiment of the present invention is described here with reference to FIGS. 10 to 12. The second embodiment is similar to the first embodiment described above, with the exception of the content described below. FIGS. 10 and 11 are cross-sectional diagrams showing a rotation sensor according to the second embodiment of this invention. FIG. 11 is a cross-sectional diagram showing a state where a lead frame 3Y is viewed in the direction of arrow XI in FIG. 10. FIG. 12 is an illustrative diagram for describing one step of a manufacturing process of the rotation sensor according to the second embodiment of the invention. Below, a step of a molding process (corresponding to the third step of the first embodiment) for the secondary molding section (exterior resin) 9 which forms the connector housing and sensor exterior section according to the second embodiment will be described.

[0078] As shown in FIG. 12, a portion of the molding die 240Y of the connector housing section is inserted into an internal space of the case 2, and exterior molding resin is injected in the direction of arrow 6 from the gate 40a. With respect to the first embodiment, the second embodiment causes all or a part of the plurality of projections 16 provided along the inner side surface of the case 2 to contact the molding die 240Y. Consequently, the contact portion between the projections 16 and the molding die 240Y (called “die contact section” below) 16a forms a portion of the inner periphery of the connector housing.

[0079] By means of the die contact section 16a, it is possible to suppress deformation of the case 2 in the η direction due to the filling pressure of the exterior molding resin. Consequently, distortion of the positioning section of the lead frame due to deformation of the case 2 can be suppressed, and decline in the measurement accuracy of the rotation sensor can be prevented. Moreover, the fluctuation in the diameter dimension F of the case outer peripheral section 2g can be kept to a prescribed dimension.

Third Embodiment

[0080] FIG. 13 is a cross-sectional diagram showing a rotation sensor according to the third embodiment of this invention. The third embodiment is similar to the first embodiment described above, with the exception of the content described below. In a vehicle-mounted rotation sensor constituted by a first molding section and a second molding section, thin ribs (called “melt ribs” below) are disposed in order to raise the contact properties at the interface therebetween.

[0081] However, since the melt ribs must be extremely thin in order to reduce the heat capacity, and must be free of defects about the whole circumference thereof, it is necessary to be careful about damage to the melt ribs during manufacture. In the present embodiment, the melt ribs are protected by providing a diameter differential in the ring-shaped ribs 313. In the third embodiment, in relation to the first or second embodiment, the ring-shaped rib 313 of the case 2 has a relatively large-diameter section and a relatively small-diameter section, and ring-shaped projections 317 (melt ribs) having a smaller diameter than the ring-shaped rib 313 are provided concentrically with the ring-shaped rib 313, in the small-diameter section which contacts the secondary molding section (exterior resin) 9. Therefore, with the melt ribs 317 being protected by means of the ring-shaped rib 313, and damage due to handling, etc. in the manufacturing process can be prevented. Consequently, it is possible to omit an inspection step for external verification of the melt ribs 317.

Fourth Embodiment

[0082] FIG. 14 is a cross-sectional diagram showing a rotation sensor according to a fourth embodiment of this invention. The fourth embodiment is similar to the first embodiment described above, with the exception of the content described below. In the third embodiment, the melt ribs 317 are provided in the vicinity of the ring-shaped rib 413 of the case 2 and in a region which contacts the secondary molding section (exterior resin) 9, the melt ribs 317 being thinner than the other portions, being concentric with the ring-shaped rib 413, and having a smaller diameter than the ring-shaped rib 413, whereas in the fourth embodiment, large-diameter sections 418b having a larger diameter than the melt ribs 317 are also provided additionally so as to surround the melt ribs 317, between two ring-shaped ribs. In other words, the ring-shaped rib 413 of the case 2 has a pair of relatively large-diameter sections 418a, 418b and a relatively small-diameter section, the small-diameter section being positioned between the pair of large-diameter sections, and ring-shaped projections 317 (melt ribs) which are concentric with the ring-shaped rib 413 and have a smaller diameter than the ring-shaped rib 413 are provided in the small-diameter section that contacts the secondary molding section (exterior resin) 9. Consequently, since the melt ribs 317 are protected from above and below by the two portions of the ring-shaped rib, then it is possible to prevent damage caused by handling during the manufacturing process (such as jig contact or dropping). Consequently, it is possible to omit an inspection step for external verification of the melt ribs 317.

Fifth Embodiment

[0083] FIG. 15 is a cross-sectional diagram showing a rotation sensor according to a fifth embodiment of this invention. The fifth embodiment is similar to the first embodiment described above, with the exception of the content described below. In relation to the third embodiment, the fifth embodiment has a ring-shaped projection (melt ribs) 517 provided concentrically with the case outer peripheral section 2g and perpendicularly with respect to the ring-shaped rib lower flat surface 13a situated in the region that contacts the secondary molding section (exterior resin) 9. Therefore, since the ring-shaped projections 517 are protected by the ring-shaped rib 13 and the case bottom surface section 2a, then it is possible to prevent damage caused by handling during the manufacturing process (such jig contact or dropping). Consequently, it is possible to omit an inspection step for external verification of the ring-shaped projections 517. The fifth embodiment may also be applied suitably, since similar beneficial effects are obtained with respect to the first to fourth embodiments.

Sixth Embodiment

[0084] In the first to fifth embodiments, a configuration is described in which a detection element of an IC 4 detects change in the magnetic field of a sensor internal magnet 5 which is accommodated in an internal space of a case 2. In this respect, in the sixth embodiment, as shown in FIG. 16, the sensor internal magnet 5 of the first to fifth embodiments is omitted, and the detection element of the IC 4 detects change in the magnetic field of a plurality of sensor external magnets 55 provided on the outer peripheral surface of the rotary shaft 51. Here, in the first to fifth embodiments, the shape of the moving magnetic body is an uneven surface shape or a gear shape, but in the sixth embodiment, the shape of the moving magnetic body is a circular shape in a vertical cross-section. Furthermore, the plurality of sensor external magnets 55 are disposed in such a manner that the surface polarities of the moving magnetic bodies switch alternately between S and N. The remainder of the configuration and the manufacturing process is similar to the first to fifth embodiments. Even if a configuration of this kind is adopted, it is still possible to obtain similar beneficial effects to the first to fifth embodiments.

[0085] In FIG. 16, a mode is exemplified where the features of the sixth embodiment are combined with the first embodiment, but the sixth embodiment is not limited to FIG. 16, and may be implemented in a mode which combines the features of the sixth embodiment with any of the second to fifth embodiments.

[0086] The contents of the present invention have been specifically described above with reference to preferred embodiments, but it would be obvious to a person skilled in the art that various modifications can be made on the basis of the basic technical concepts and teachings of the present invention.