Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same

Abstract

A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 10.sup.3 Ohm-cm.

Claims

1. A printed circuit module comprising: a printed circuit substrate; a thinned die attached to the printed circuit substrate and having at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer; a top protective layer disposed onto the printed circuit substrate and up alongside the thinned die to at least a portion of the BOX layer; and a polymer layer over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 10.sup.3 Ohm-cm.

2. The circuit board of claim 1 wherein the top protective layer resides between the printed circuit substrate and the polymer layer.

3. The printed circuit module of claim 1 further including a bonding layer disposed onto the BOX layer.

4. The printed circuit module of claim 3 wherein the bonding layer is made of silicon nitride.

5. The printed circuit module of claim 1 further including an outer plastic layer disposed over the polymer layer to provide additional rigidity to the printed circuit module.

6. The printed circuit module of claim 5 wherein the outer plastic layer is cured epoxy.

7. The printed circuit module of claim 1 wherein a thickness of the polymer layer ranges from about 100 μm to around 500 μm.

8. The printed circuit module of claim 1 wherein the thinned die is a radio frequency integrated circuit (RFIC).

9. The printed circuit module of claim 1 wherein the thermal conductivity of the polymer layer ranges from around about 10 W/mK to around about 50 W/mK.

10. The printed circuit module of claim 1 wherein the thermal conductivity of the polymer layer ranges from around about 50 W/mK to around about 6600 W/mK.

11. The printed circuit module of claim 1 wherein the electrical resistivity of the polymer layer ranges from around about 10.sup.12 Ohm-cm to around about 10.sup.16 Ohm-cm.

12. The printed circuit module of claim 1 wherein the electrical resistivity of the polymer layer ranges from around about 10.sup.3 Ohm-cm to around about 10.sup.12 Ohm-cm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The accompanying drawings incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.

(2) FIG. 1 is a cross-sectional diagram of a related art semiconductor stack structure interfaced with a relatively low resistivity silicon wafer handle.

(3) FIG. 2 is a cross-sectional diagram of the related art semiconductor stack structure with a temporary carrier mount for carrying the semiconductor stack structure during subsequent processing steps.

(4) FIG. 3 is a cross-sectional diagram of the related art semiconductor stack structure after the relatively low resistivity silicon wafer handle has been removed.

(5) FIG. 4 is a cross-sectional diagram of the related art semiconductor stack structure after a polymer substrate has been disposed onto the buried oxide (BOX) layer to realize the semiconductor device of the present disclosure.

(6) FIG. 5 is a process diagram for a process that yields the related art semiconductor device having the polymer substrate disposed on the BOX layer of the semiconductor stack structure.

(7) FIG. 6 is a cross-sectional diagram of the related art semiconductor device showing heat flow paths through the semiconductor device with the polymer substrate after the semiconductor device has reached a steady state powered condition.

(8) FIG. 7 is a specification table that lists thermal, mechanical, electrical, and physical specifications for an exemplary polymer material that is usable to form the polymer substrate of the semiconductor device of the present disclosure.

(9) FIG. 8 is a cross-sectional diagram of an RF silicon-on-insulator (RFSOI) wafer with solder bumps or copper (Cu) pillars.

(10) FIG. 9 is a top view of the RFSOI wafer of FIG. 8.

(11) FIG. 10 is a top view of a printed circuit substrate having an array of dies that have been singulated from the RFSOI wafer of FIG. 8 and FIG. 9.

(12) FIG. 11 is a cross-sectional diagram of an incomplete printed circuit having an individual die mounted to the printed circuit substrate having a top protective layer.

(13) FIG. 12 is a cross-sectional diagram of the incomplete printed circuit further including a bottom protective layer while the handle layer is etched away to produce a thinned die.

(14) FIG. 13 is a cross-sectional diagram of the printed circuit having a polymer layer disposed over the thinned die to provide permanent protection of the thinned die.

(15) FIG. 14 is a cross-sectional diagram of a printed circuit in a completed state after the bottom protective layer has been removed.

(16) FIG. 15 is a process diagram that for a process that yields the printed circuit of the present disclosure.

DETAILED DESCRIPTION

(17) The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the disclosure and illustrate the best mode of practicing the disclosure. Upon reading the following description in light of the accompanying drawings, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

(18) It will be understood that when an element such as a layer, region, or substrate is referred to as being “over,” “on,” “in,” or extending “onto” another element, it can be directly over, directly on, directly in, or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over,” “directly on,” “directly in,” or extending “directly onto” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.

(19) Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

(20) Traditional RFCMOS SOI technologies have reached a fundamental barrier due to limitations inherent to silicon wafer handles that prevent the relatively better insulating characteristics available in group III-V or sapphire substrates. The disclosed semiconductor device replaces the silicon wafer handle with a polymer substrate. As such, the semiconductor device of this disclosure eliminates the need for a high resistivity silicon wafer handle in a provided semiconductor stack structure.

(21) Advanced silicon substrates for RF switch applications have resistivities that range from 1000 Ohm-cm to 5000 Ohm-cm and are significantly more costly than standard silicon substrates having much lower resistivities. Moreover, relatively complex process controls are needed to realize high resistivity in advanced silicon substrates. For these reasons standard silicon substrates are used ubiquitously in standard SOI technologies. However, standard silicon substrates with their much lower resistivities are not conducive for stacking a plurality of relatively low voltage field effect transistors (FETs) while maintaining a desired isolation between the low voltage FETs. Fortunately, the polymer substrate of the present disclosure replaces the silicon substrate and thus, eliminates the problems associated with both high and low resistivity silicon substrates.

(22) Additionally, the methods of the present disclosure allow for an immediate migration to 300 mm substrates for use in RF power switch applications. This is an important development since there is currently no commercially viable high volume supply of high resistivity RFSOI substrates in the 300 mm wafer diameter format. Fabricating the present semiconductor devices on 300 mm diameter wafers would provide a significant improvement in die costs. Moreover, the need for a trap rich layer and/or harmonic suppression techniques is eliminated, thereby resulting in a significantly simpler process flow and lower cost.

(23) Further still, the polymer substrate is expected to eliminate RF nonlinear effects resulting from the interface between the BOX layer and the silicon substrate used in traditional semiconductor processes to manufacture RF switch devices. The present methods realize RF switch devices that have linear characteristics relatively close to ideal linear characteristics.

(24) Additionally, the semiconductor device of this disclosure offers a near ideal voltage stacking of NFET transistors. Traditionally, the number of NFET devices that can be stacked is limited by silicon substrate resistivity combined with the interface effects between the BOX layer and the silicon wafer handle. This issue essentially limits the number of practical NFET transistors that can be stacked and thus, limits the highest RF operating voltage for the resulting NFET transistor stack. Replacing silicon wafer handles with the polymer substrate of the present disclosure allows relatively many more NFET transistors to be practically ideally stacked. The resulting semiconductor device is operable at relatively much higher RF power levels and RMS voltages than is traditionally allowable on silicon handle wafer technologies.

(25) Furthermore, the highest RF frequency of operation of RF power switches built with the disclosed polymer substrate can be extended beyond the highest frequency of operation achievable with traditional RFCMOS SOI technologies. Typically, a silicon wafer handle resistivity is in the range of 1000-3000 Ohm-cm, which effectively imposes an operational high frequency limit. The resulting resistivity of the polymer substrate region in the semiconductor device taught in this disclosure is several orders of magnitude higher than what is achieved in high resistivity silicon. For instance, there are polymers with nearly ideal electrically insulating characteristics, with resistivity values similar to what is obtained in gallium arsenide (GaAs) and sapphire semi-insulating substrates.

(26) FIG. 1 is a cross-sectional diagram of a related art semiconductor stack structure 10 interfaced with a relatively low resistivity silicon wafer handle 12. In the exemplary case of FIG. 1, the semiconductor stack structure 10 includes a buried oxide (BOX) layer 14, a field oxide layer 16, and an NFET device layer 18, with a gate 20. A source metal conductor 22 couples a source contact 24 with a source flipchip bump 26. Similarly, a drain metal conductor 28 couples a drain contact 30 with a drain flipchip bump 32. An interlayer dielectric (ILD) 34 protects the gate 20 and supports the source flipchip bump 26 and the drain flipchip bump 32.

(27) FIG. 2 is a cross-sectional diagram of the related art semiconductor stack structure 10 with a temporary carrier mount 36 for carrying the semiconductor stack structure 10 during subsequent processing steps. In this exemplary case, the temporary carrier mount 36 is attached to the source flipchip bump 26 and the drain flipchip bump 32. A goal of the temporary carrier mount 36 is to provide a good mechanical mount to the semiconductor stack structure 10 for further processing, and also for protecting a finished semiconductor device from being damaged by post process flows. A common technique for mounting to the temporary carrier mount 36 uses thick quartz carrier substrates that have several through-holes that are attached to the finished SOI wafer using a specially designed ultraviolet (UV) adhesive tapes. This effectively bonds the temporary carrier to the source flipchip bump 26 and the drain flipchip bump 32. This mounting technique provides chemical and mechanical protection needed during a process to replace the silicon wafer handle 12 with a polymer substrate. The mounting technique also allows for the easy dismount of a finished semiconductor device by a simple UV light exposure that makes the tape readily solvable in approved solvents. A number of other temporary carrier mount/dismount techniques are usable for the same purpose of providing chemical and mechanical protection needed during the process to replace the silicon wafer handle 12 with a polymer substrate.

(28) FIG. 3 is a cross-sectional diagram of the related art semiconductor stack structure 10 after the relatively low resistivity silicon wafer handle 12 has been removed. Once the semiconductor stack structure 10 is protected by the temporary carrier mount 36, the silicon wafer handle 12 may be removed by a number of different techniques. One technique uses a conventional grind operation that removes a majority of the silicon wafer handle 12 followed by a selective wet or dry etch step of the remaining silicon wafer handle 12, and selectively stopping at a first surface 38 of the semiconductor stack structure 10. In this exemplary case, the first surface 38 is also the exposed surface of the BOX layer 14. Other techniques for removal of the silicon wafer handle 12 exist and are well documented in the literature. Some of these other techniques are based on dry or wet etch processes. The process used to remove the silicon wafer handle 12 is not particularly relevant to the present disclosure. However, it is desirable for the removal of the silicon wafer handle 12 to be accomplished without damaging the BOX layer 14 and the remainder of the semiconductor stack structure 10 as well as the source flipchip bump 26 and the drain flipchip bump 32.

(29) FIG. 4 is a cross-sectional diagram of the related art semiconductor stack structure 10 after a polymer substrate 40 has been disposed onto the BOX layer 14 to realize a semiconductor device 42. The polymer material making up the polymer substrate 40 has a unique set of characteristics in that the polymer material is both a relatively excellent electrical insulator and a relatively excellent heat conductor. Typical polymer materials making up common plastic parts are extremely poor conductors of heat. Poor heat conduction is a common characteristic of plastics normally used in an over-mold operation. However, there are proprietary polymer materials that do provide relatively excellent heat conduction. Various formulations for such polymers yield thermal conductivities that range from around about 2 Watts per meter Kelvin (W/mK) to around about 50 W/mK. In one embodiment, the thermal conductivity of the polymer substrate ranges from around about 50 W/mK to around about 6600 W/mK. In another embodiment, a thermal resistivity of the polymer substrate is about zero. Future enhancements in polymer science may provide additional improvements in terms of thermal conductivity while maintaining nearly ideal electrical insulating characteristics in the polymer. The structure of this disclosure benefits from the optimization of the polymer thermal conductivity and it should be understood that there are no upper bound values in terms of polymer thermal conductivity.

(30) It is desirable that a polymer material usable for the polymer substrate 40 be relatively strongly bondable to the first surface 38 of the semiconductor stack structure 10. For example, the polymer material needs a bonding strength that allows the semiconductor device 42 to be dismounted from the temporary carrier mount 36 and remain permanently bonded after additional processing steps as well as throughout the operational lifetime of the semiconductor device 42. Moreover, a desirable thickness for the polymer substrate 40 ranges from around about 100 μm to around about 500 μm, but other desirable thicknesses for the polymer substrate 40 can be thinner or thicker depending on the characteristics of the polymer material used to make up the polymer substrate 40.

(31) The polymer material making up the polymer substrate 40 should also be a good electrical insulator. In general, the electrical resistivity of the polymer substrate 40 should be at least 10.sup.3 Ohm-cm and it is preferable for the polymer to have a relatively high electrical resistivity that ranges from around about 10.sup.12 Ohm-cm to around about 10.sup.16 Ohm-cm. In combination with relatively high electrical resistivity, it is preferred that the thermal conductivity of the polymer substrate 40 be on the order of the thermal conductivity of typical semiconductors, which is typically greater than 2 W/mK. In one embodiment, the thermal conductivity of the polymer substrate 40 ranges from greater than 2 W/mK to around about 10 W/mK. In yet another embodiment, the thermal conductivity of the polymer substrate 40 ranges from around about 10 W/mK to around about 50 W/mK. As polymer science provides materials with additional thermal conductivities, these materials can be utilized in the semiconductor device of this disclosure, as there are no upper bounds for how high the polymer thermal conductivity may be with regards to this disclosure.

(32) FIG. 5 is a related art process diagram that yields the semiconductor device 42 having the polymer substrate 40 disposed on the first surface 38 of the semiconductor stack structure 10. The exemplary process begins with providing the semiconductor stack structure 10 having the first surface 38 of the BOX layer 14 in direct contact with the silicon wafer handle 12 (step 100). While the semiconductor stack structure 10 is attached to the silicon wafer handle 12 at the beginning of the process, it is to be understood that a wafer handle made of other group IV or III-V semiconductors is also usable in place of the silicon wafer handle 12.

(33) The semiconductor stack structure 10 is then mounted to the temporary carrier mount 36 with the source flipchip bump 26 and the drain flipchip bump 32 facing the temporary carrier mount 36 (step 102). The process then continues by removing the silicon wafer handle 12 to expose the first surface 38 of the semiconductor stack structure 10 (step 104). The polymer substrate 40 can then be attached to the first surface 38 of the semiconductor stack structure 10 using various polymer material disposing methods (step 106). Such methods for attaching the polymer substrate 40 to the first surface 38 of the semiconductor stack structure 10 include, but are not limited to, injection molding, spin deposition, spray deposition, and pattern dispensing of polymer material directly onto the first surface 38 of the semiconductor stack structure 10. Once the polymer substrate 40 is attached to the first surface 38 of the semiconductor stack structure 10, the temporary carrier mount 36 is dismounted (step 108).

(34) The sequence of steps used in processes to manufacture the semiconductor device 42 will depend on the type of carrier and mounting processes used. There are a number of such processes available. A typical dismount step used extensively for through-substrate-via (TSV) processing includes exposing the UV adhesive tape that mounted the wafer to a transparent quartz carrier to UV light, which alters the chemistry of the UV tape so that the semiconductor device 42 can be easily separated from the temporary carrier mount 36. The semiconductor device 42 can then be cleaned with common chemical solvents and/or plasma cleaning processes.

(35) The semiconductor device 42 can then be singulated from an original wafer (not shown) into individual die by a number of different conventional processes. Typically a saw operation that cuts through the semiconductor stack structure 10 and polymer substrate 40 is the preferred method of die singulation. Other singulation methods such as laser sawing, laser scribing or diamond scribing can be used as alternatives.

(36) It should be noted that the semiconductor device and methods taught in this disclosure begin with a conventionally manufactured RFSOI CMOS wafer which in this exemplary case is the semiconductor stack structure 10 disposed on the silicon wafer handle 12. However, one distinction is that there is no need for the silicon wafer handle 12 to have high resistivity, since the silicon wafer handle 12 is removed and does not become part of the semiconductor device 42. If the semiconductor device 42 requires flipchip packaging, it should ideally already include the source flipchip bump 26 and the drain flipchip bump 32, although such a requirement may not be necessary depending on the specific characteristics of the bump or pillar packaging technology employed. In this exemplary case, it is assumed that a wafer process was completed through bumping.

(37) FIG. 6 is a related art cross-sectional diagram of the semiconductor device showing heat flow paths through the semiconductor device 42 with the polymer substrate 40 after the semiconductor device 42 has reached a steady state powered condition. Under normal operation, heat is generated by energy losses in the NFET 18. An origin for the heat generated is represented by a dashed oval in the BOX layer 14 adjacent to the NFET 18. The flow of heat is represented by dashed arrows. As usual for high performance RF applications, the semiconductor device 42 is flipchip mounted in its final application. As such, the heat to be extracted is transferred by thermal conduction to the source flipchip bump 26 and the drain flipchip bump 32. Thermal analysis of typical SOI technologies indicates that unless the silicon wafer handle 12 (FIG. 1) is replaced with a good thermal conductive material, the NFET 18 quickly overheats under nominal conditions and essentially becomes very unreliable and likely fails. Under normal conditions and design rules, back-end-of-line metallization layers (not shown) provide too high a thermal resistance path to be used effectively as a means to dissipate the heat generated by the device. The polymer substrate 40 accomplishes effectively the same function as the original silicon wafer handle 12 from a thermal management point of view while also providing much improved linear characteristics and effectively much higher substrate resistivity than the 1 kOhm-cm substrate resistivity of the silicon wafer handle 12.

(38) FIG. 7 is a specification table that lists thermal, mechanical, electrical, and physical specifications for an exemplary polymer material that is usable to form the polymer substrate 40 of the semiconductor device 42. It is to be understood that the specification table only provides exemplary specifications and that a variety of mechanical and physical properties are available within the scope of the present disclosure. Moreover, the quantitative values for the thermal and electrical properties provided in the table of FIG. 7 only represent exemplary values that are within the range of thermal and electrical properties already discussed in the above disclosure.

(39) FIG. 8 is a cross-sectional diagram of an RF silicon-on-insulator (RFSOI) wafer 44 with electrical contacts 46 such as solder bumps or copper (Cu) pillars that are disposed onto a device layer 48. The device layer 48 is protected by a buried oxide (BOX) layer 50 that is disposed between the device layer 48 and a handle wafer 52. The handle wafer 52 is a relatively low cost low-resistivity silicon substrate that is used to protect and handle the device layer 48 during processing steps that include a bumping step that adds the electrical contacts 46 to a top surface of the device layer 48.

(40) FIG. 9 is a top view of the RFSOI wafer 44 of FIG. 8. In this top view, the electrical contacts 46 are shown within outlines that represent dies 54. The dies 54 are typically singulated after the electrical contacts 46 are added to the device layer 48.

(41) FIG. 10 depicts a board panel 56 that is ultimately fabricated into printed circuit modules (not shown) having individual ones of the dies 54 mounted on a printed circuit substrate 58. The electrical contacts 46 are shown in dashed line to represent that the electrical contacts 46 are not visible in this top view.

(42) FIG. 11 is a cross-sectional diagram of an incomplete printed circuit 60 having a die 62, which is one of the dies 54 (FIG. 10), mounted to the printed circuit substrate 58. The electrical contacts 46 of the die 62 are typically soldered or fused to conductive pads 64 that are on a surface of the printed circuit substrate 58. Module bumps 66 are coupled to the conductive pads through a metallization layer 68 within the printed circuit substrate 58.

(43) A top protective layer 70 is disposed onto the printed circuit substrate 58 directly against the die 62 up to a plane P that is substantially even with an interface between a handle layer 72 that is a singulated portion of the handle wafer 52 (FIGS. 8 and 9). The top protective layer 70 is typically made up of a polymeric material such as the exemplary polymer listed in the specification table of FIG. 7. Alternatively, in at least one embodiment, the top protective layer 70 is made up of a dielectric material such as polyamide that is disposed over an entire top surface of the printed circuit substrate 58. There are a number of deposition and planarization techniques that are well known in the electronics industry that are usable to apply the top protective layer 70 to the top of the printed circuit substrate 58.

(44) FIG. 12 is a cross-sectional diagram of the incomplete printed circuit 60 further including a bottom protective layer 74 while the handle layer 72 (FIG. 11) is etched away to produce a thinned die 62T. Moreover, in some embodiments, a conventional grind operation removes a majority of the handle layer 72 before being followed by a selective wet or dry etch step of the remaining portions of the handle layer 72. In such cases, the bottom protective layer 74 is omitted and the module bumps 66 are protected using a number of techniques known to those skilled in the art. One such technique would be to cover the backside of the printed circuit substrate 58 with an adhesive protective sheet or tape, similar to that used during sawing of a board panel such as board panel 56 depicted in FIG. 10. However, the bottom protective layer 74 depicted in FIG. 12 is typically a dielectric material such as polyamide that is disposed over an entire bottom surface of the printed circuit substrate 58. The bottom protective layer 74 is at least thick enough to cover the module bumps 66.

(45) As further depicted in FIG. 12, one method for removing the handle layer 72 is to use wet chemistries such as a combination of ethylenediamine (EDA) and pyrocatechol (C.sub.6H.sub.4(OH).sub.2) and water. This combination etches silicon at rates of around 100 Angstroms/second but does not etch silicon dioxide at an appreciable rate. Other etchant chemistries such as potassium hydroxide (KOH) or tremethylammonium (TMAH) may also be employed. However, a stop process must be employed as the last of the handle layer 72 is removed. It is to be understood that the removal of handle layer 72 by various techniques is within the scope of the present disclosure so long as such a step is accomplished without significantly disturbing the BOX layer 50 and any desirably protected regions associated with the thinned die 62T and the printed circuit substrate 58.

(46) FIG. 13 is a cross-sectional diagram of the printed circuit 60 having a polymer layer 76 disposed over the thinned die 62T to provide permanent protection of the thinned die 62T. The polymer layer 76 has a relatively unique set of characteristics in comparison to plastics normally used in an over mold operation in that the vast majority of plastic compounds used in most applications are extremely poor conductors of heat. The polymer layer 76 is unique in that it provides relatively excellent electrical insulation while also providing excellent heat conduction. Proprietary plastic compounds with this particular set of characteristics are available in the industry. An exemplary material for polymer layer 76 is disclosed in the specification table of FIG. 7.

(47) The actual formulation of a material for polymer layer 76 is not itself important, provided that the material provides electrical resistivity that exceeds 1 Mega Ohm-cm) while providing a thermal conductivity of at least >2 W/mK). Materials for polymer layer 76 with thermal conductivity values in the range of 10-50 W/mK are presently available in the plastics industry. It is also highly desirable that a permanent adhesion bond is established between the BOX layer 50 and the polymer layer 76. In some embodiments, a bonding layer 78 such as a nitride layer is disposed onto the BOX layer 50 to enhance adhesion between the polymer layer 76 and the BOX layer 50.

(48) Once the polymer layer 76 is disposed over the BOX layer 50 by molding or other deposition process, the polymer layer 76 provides rigidity necessary for additional processing steps such as the removal of the bottom protective layer 74. An appropriate thickness for the polymer layer 76 ranges from about 100 μm to around 500 μm. However, the polymer layer 76 can be 75% thinner or 200% thicker depending on the mechanical characteristics of the actual polymer used.

(49) The polymer layer 76 can be formed using various methods. Such methods include simple injection and compression molding techniques, spin-on deposition, sprayed-on type of processes, and dispensing of the polymeric material in a predetermined pattern such as a rectangle or other polygonal shapes. An optional outer plastic layer 80 can be disposed over the polymer layer 76 to provide additional rigidity for the incomplete printed circuit 60. The outer plastic layer 80 can be made of a thermoplastic material such as cured epoxy.

(50) FIG. 14 is a cross-sectional diagram of a printed circuit module 82 that is a completed version of the incomplete printed circuit 60 (FIG. 13) after the bottom protective layer 74 (FIG. 13) has been removed by removal processes that are well known in the electronics industry. However, a number of the printed circuit modules 82 are completed from one of a plurality of dies 62 on the board panel 56 that are processed to add the polymer layer 76 (FIG. 10). Therefore individual ones of the printed circuit module 82 are typically singulated from the board panel 56 using a high speed diamond blade. Other singulation methods such as laser sawing, laser scribing or diamond scribing may also be used as alternatives. Typically, the bottom protective layer 74 is removed by exposing the bottom protective layer to ultraviolet (UV) light. The removal of the bottom protective layer 74 uncovers the module bumps 66 so that the printed circuit module 82 can be coupled to a circuit board (not shown) making up a final product.

(51) FIG. 15 is a process diagram that provides a general process that yields the printed circuit module 82. The process begins by providing a die 62 attached to a top side of a printed circuit substrate 58 (step 200). The handle layer 72 faces away from the printed circuit substrate 58 and a BOX layer 50 that is at this point beneath the handle layer 72. The process continues by disposing a top protective layer 70 onto the printed circuit substrate 58 directly against the die 62 up to a plane that is substantially even with an interface between the handle layer 72 and the BOX layer 50 (step 202). This step is followed by disposing a bottom protective layer 74 onto a bottom side of the printed circuit substrate 58 (204). Next, the process continues by removing the handle layer 72 from the die 62 using mechanical etching, chemical etching, or by a combination of mechanical etching and chemical etching (step 206). This step is followed by disposing a polymer layer 76 over the BOX layer 50 with the polymer layer having a thermal conductivity greater than 2 Watts per meter Kelvin (W/mK) and an electrical resistivity greater than 10.sup.3 Ohm-cm (step 208). The process is generally completed to yield printed circuit module 82 by removing the bottom protective layer 74 from the bottom side of the printed circuit substrate 58 (step 210).

(52) Those skilled in the art will recognize improvements and modifications to the embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.