The invention provides an anti-fouling lighting system (1) configured for preventing or reducing biofouling on a fouling element (1201) of an object (1200). The fouling element (1201) is during use at least partly moving and at least temporarily exposed to water. Fouling is prevented by irradiating an anti-fouling light (211) onto said fouling element (1201). The anti-fouling lighting (1) system comprises at least one laser light source (2) configured to generate the anti-fouling light (211) and to provide said anti-fouling light (211) to said fouling element (1201) during use, wherein the system (1) is arranged such that during use the fouling element (1201) at least partly moves with respect to the laser light source (2).

A shoe cleaning apparatus and method configured for cleaning a user's shoes while the user is wearing said shoes. A cleaning solution can be supplied by the shoe cleaning apparatus and operation of the shoe cleaning apparatus can agitate the surface of the shoe and the cleaning solution. The shoe cleaning apparatus can be provided as part of a decorative or storage unit, entry system, portable system, or built-in system.

A patient warming system for stabilizing and/or heating and cooling a patient includes a plurality of solid-surface sections arranged for attachment to a surgical table and a warming pad layer comprising a plurality of warming pads configured for removable connection to the plurality of solid-surface sections. At least one of the plurality of solid-surface sections includes a power connector for connection to an external power source. Each warming pad of the plurality of warming pads includes a foam insulation layer, a distributed heating element layer having a warming-pad power connection for connection to the power connector, an isothermal layer, and a flexible waterproof layer. Power supplied to the warming-pad power connection of the distributed heating element layer of the respective warming pad can be used to provide a user-selected uniform temperature over the surface of the flexible waterproof layer in order to prevent hot spots.

Typical prior art circuits for ignition and operation of UV lamps do not optimize power usage through the whole cycle of ignition and ongoing operation. Typically, the higher power required to initially ignite the UV lamp is not diminished once the UV lamp is burning brightly and at a desired temperature. The circuit of the present invention utilizes a sensor to monitor the light emitted from the UV lamp and a sensor to measure the temperature of the device containing the UV lamp as voltage is applied to it. Once the constant light and desired temperature are achieved, the voltage boost converter is latched away and constant lower voltage is provided to the UV lamp from that point forward, thus optimizing the energy consumption or the energy used for a battery powered device incorporating a UV lamp.

The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

A manual laser cleaning device for removing foreign matter present on the surface of a workpiece according to an embodiment includes a laser generator oscillating a laser beam, a controller controlling the laser generator, and a laser cleaning head receiving the laser beam emitted from the laser generator through an optical fiber and irradiating a surface of a workpiece with the received laser beam. The laser cleaning head includes a head housing having a handle, a collimator placed in the head housing and collimating the laser beam scattered at one end of the optical fiber into parallel light, a high-speed Galvano scanner scanning the laser beam transmitted through the collimator at high speed using a mirror mounted on a scanning motor, and a focal lens focusing the laser beam scanned by the high-speed Galvano scanner at a focal distance and irradiating the surface of the workpiece with the laser beam.

Proposed are a method and a system for removing L-FC in a plasma etching process, in which L-FC, which is condensed on a wafer, an electrode, a substrate, a head, or the like, is removed by using infrared or ultraviolet rays in a plasma etching process using an L-FC precursor.

Methods of cleaning a substrate support comprise: introducing a cleaning gas into a processing chamber containing the substrate support; applying a radio frequency (RF) power to a remote plasma source that is in fluid communication with the processing chamber to establish a reactive etching plasma from the cleaning gas in the processing chamber; reacting deposits on the substrate support with the reactive etching plasma to form a by-products phase; and evacuating the by-products phase from the processing chamber.

Methods of cleaning a substrate support comprise: introducing a cleaning gas into a processing chamber containing the substrate support; applying a radio frequency (RF) power to a remote plasma source that is in fluid communication with the processing chamber to establish a reactive etching plasma from the cleaning gas in the processing chamber; reacting deposits on the substrate support with the reactive etching plasma to form a by-products phase; and evacuating the by-products phase from the processing chamber.

Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.