A process for support material removal for 3D printed parts wherein the part is placed in a media filled tank and support removal is optimized in a multi-parameter system through an artificial intelligence process which may include, but is not limited to, the use of historical data, parametric testing data, normal support removal data, and outputs from other support removal AI models to generate optimally efficient use of each parameter in terms of pulse repetition interval (PRI) and cycle time as defined by pulse width (PW). The input parameters may include heat, circulation, ultrasound and chemical reaction, which are used in sequence and/or in parallel, to optimize efficiency of support removal. Sequentially and/or in parallel, heat, pump circulation and ultrasound may vary in application or intensity. Selection of means of agitation depends on monitored feedback from the support removal tank and application of a statistically dynamic rule based system (SDRBS).

A controller is provided for use in controlling a blade sharpening system that includes at least one grinding wheel operable to sharpen the blade. The controller includes a memory device, and a processor communicatively coupled to the memory device. The processor is configured to receive signals from at least one sensor, the at least one sensor operable to monitor rotation of the at least one grinding wheel. The processor is further configured to adjust a position of the at least one grinding wheel relative to the blade based on the received signals.

An automatic grinding machine with positioning effect has a body, at least two positioning sets, and a processing set. The body has a base, a grinding mount, a drive device, and a fixture. The base has a chamber. The at least two positioning sets are connected to the body and each positioning set has a displacement device and an optical module. The displacement device is mounted in the chamber. The optical module is disposed on the displacement device and is moved relative to the grinding mount by the drive device to position locations of the grinding mount and a probe card. The processing set is electrically connected to the drive device and the fixture of the body and the displacement device and the optical module of each positioning set, and has a computer control interface.

A method of thinning a wafer includes measuring an initial thickness of the wafer. The method further includes calculating a polishing time using the initial thickness. The method further includes polishing the wafer for a first duration equal to the polishing time to obtain a polished wafer. The method further includes measuring a polished thickness of the polished wafer. The method further includes calculating an etching time using the polished thickness. The method further includes etching the polished wafer for a second duration equal to the etching time to obtain an etched wafer, wherein the wafer has a total thickness variation of less than or equal to 0.15 μm after etching the polished wafer.

A method of thinning a wafer includes measuring an initial thickness of the wafer. The method further includes calculating a polishing time using the initial thickness. The method further includes polishing the wafer for a first duration equal to the polishing time to obtain a polished wafer. The method further includes measuring a polished thickness of the polished wafer. The method further includes calculating an etching time using the polished thickness. The method further includes etching the polished wafer for a second duration equal to the etching time to obtain an etched wafer, wherein the wafer has a total thickness variation of less than or equal to 0.15 μm after etching the polished wafer.

A double-sided or single-sided machine tool includes a first working disk and a counter-bearing element. The first working disk and the counter-bearing element can be driven rotationally relative to each other by means of a rotary drive. A working gap is formed between the first working disk and the counter-bearing element for the double-sided or single-sided machining of flat workpieces. The double-sided or single-sided machine tool comprises multiple sensors that record measurement data relating to tool and/or machining parameters of the double-sided or single-sided machine tool during operation. A control apparatus obtains the measurement data recorded by the sensors during operation. The control apparatus comprises an artificial neural network that is designed to create a state vector of the double-sided or single-sided machine tool from the measurement data and to compare said state vector with at least one target state vector.

A double-sided or single-sided machine tool includes a first working disk and a counter-bearing element. The first working disk and the counter-bearing element can be driven rotationally relative to each other by means of a rotary drive. A working gap is formed between the first working disk and the counter-bearing element for the double-sided or single-sided machining of flat workpieces. The double-sided or single-sided machine tool comprises multiple sensors that record measurement data relating to tool and/or machining parameters of the double-sided or single-sided machine tool during operation. A control apparatus obtains the measurement data recorded by the sensors during operation. The control apparatus comprises an artificial neural network that is designed to create a state vector of the double-sided or single-sided machine tool from the measurement data and to compare said state vector with at least one target state vector.

A double- or single-sided processing machine and a method for configuring a double- or single-sided processing machine are described. A first working disk and a counter-bearing element are driven rotationally relative to each other. A working gap for processing of flat workpieces is formed between the first working disk and the counter-bearing element. A control apparatus actuates step-by-step or continuous deformation of the first working disk between a concave shape and a convex shape. During the deformation, the working gap width at two or more radially spaced apart locations of the first working disk is measured. The control apparatus determines measurement value averages from the measurement values. The control apparatus determines the minimum of the measurement value averages and, using the determined minimum, specifies a target value for deforming the first working disk as a starting value for the processing of a flat workpiece.

A double- or single-sided processing machine and a method for configuring a double- or single-sided processing machine are described. A first working disk and a counter-bearing element are driven rotationally relative to each other. A working gap for processing of flat workpieces is formed between the first working disk and the counter-bearing element. A control apparatus actuates step-by-step or continuous deformation of the first working disk between a concave shape and a convex shape. During the deformation, the working gap width at two or more radially spaced apart locations of the first working disk is measured. The control apparatus determines measurement value averages from the measurement values. The control apparatus determines the minimum of the measurement value averages and, using the determined minimum, specifies a target value for deforming the first working disk as a starting value for the processing of a flat workpiece.

A polishing tool wear amount prediction device, machine learning device, and system capable of predicting a wear amount of a polishing tool unit of a polishing tool during polishing are provided. The polishing tool wear amount prediction device includes a machine learning device which observes polishing condition data indicating a processing condition of polishing as a state variable indicating a current environment state and performs, based on the state variable, learning or prediction by using a learning model which stores a correlation of the wear amount of the polishing tool with respect to the processing condition of polishing.