This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least one component of the composition; and (2) moving a continuous flow of the chemical composition to a packaging station downstream of the mixing tank. The mixing and moving steps are performed continuously. This disclosure also features systems that can be used to perform such methods.

A small automatic polishing liquid cleaning device for rigid gas permeable contact lens includes a container; a containing chamber is provided inside the container; an exhaust pipe, and a liquid suction pipe, which communicates with the containing chamber disposed on the container; an outlet end of the exhaust pipe communicates with a vacuum orifice of a vacuum generator via a connector, a gas inlet of the vacuum generator communicates with a pipeline for a compressed gas, and a liquid inlet of the liquid suction pipe is disposed at the bottom of a waste liquid trough.

A small automatic polishing liquid cleaning device for rigid gas permeable contact lens includes a container; a containing chamber is provided inside the container; an exhaust pipe, and a liquid suction pipe, which communicates with the containing chamber disposed on the container; an outlet end of the exhaust pipe communicates with a vacuum orifice of a vacuum generator via a connector, a gas inlet of the vacuum generator communicates with a pipeline for a compressed gas, and a liquid inlet of the liquid suction pipe is disposed at the bottom of a waste liquid trough.

A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

The present invention provides a polishing apparatus including: a turntable which has a polishing pad attached thereto; a polishing head configured to hold a wafer; a tank configured to store a polishing agent; a polishing agent supply mechanism which supplies the polishing agent stored in the tank to the polishing pad; a waste liquid receiver which collects the polishing agent flowing down from an upper side of the turntable; and a circulation mechanism which is connected to the waste liquid receiver and supplies the polishing agent collected by the waste liquid receiver to the tank, the polishing agent is supplied to the polishing pad from the tank by the polishing agent supply mechanism, the used polishing agent which flows down from the upper side of the turntable is collected by the waste liquid receiver, a surface of the wafer held by the polishing head is rubbed against the polishing pad so that it is polished while supplying the collected polishing agent to the tank to circulate the polishing agent, and the polishing apparatus is characterized in that the waste liquid receiver is fixed to the turntable. Consequently, it is possible to provide the polishing agent which can suppress mixture with other solutions at the time of collecting the polishing agent to be reused, can suppress degradation of collection efficiency of the polishing agent, and can be easily maintained.

A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.