A conveying apparatus for conveying a plate-shaped workpiece includes a holding unit that holds the plate-shaped workpiece under suction, a moving unit that moves in a vertical direction together with the holding unit, a detection unit that detects that the holding unit has moved downward and made contact with the plate-shaped workpiece, and a control unit that performs control to stop a downward movement of the moving unit when the detection unit detects that the holding unit has made contact with the plate-shaped workpiece.

An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

The invention relates to a multilayer wood composite block comprising a plurality of wood layers, wherein at least 5 wood layers of the plurality of wood layers have a layer thickness of 0.05 to 1 mm; a plurality of plastic layers, wherein at least 5 plastic layers of the plurality of plastic layers consist of translucent and/or transparent plastic and have a layer thickness of 0.05 to 1 mm; and a plurality of adhesive layers; wherein the wood and/or plastic layers are arranged in a superimposed manner; and wherein the adhesive layers are arranged between successive wood and/or plastic layers and bond them together; and a multilayer wood veneer.

A winder unit (1) for winding cutting line (41), for vehicle glazing panel removal, has a rotatable spindle shaft (61) for winding the cutting line (41) and a ratchet device (90) mounted to the spindle shaft (61) by means of a one-way rotational bearing or clutch (75). Typically the ratchet device (90) has a component mounted to rotate in unison with the one-way rotational bearing or clutch. The improvement provides a rotational directional control providing 2 one-way rotational control devices in concert.

A decorative layer removal tool for flooring is configured with a removal shaft and either a drill attachment or handle to remove the decorative layer from a plank. The removal shaft includes a threaded end to attach to either the handle or drill attachment. The handle can be used when the user wishes to manually rotate the shaft and remove the decorative layer; the drill attachment can be used with a power drill for a motorized removal. The removal shaft includes a slit that extends from an unthreaded end to the threaded side. In typical implementations, the slit may not extend to the shaft's threads. At least a portion of the slit is used to receive the decorative surface layer from a plank, thereby enabling the decorative layer's removal.

A peeling tool includes a lower surface portion that is to be placed on a holding sheet affixed to a first surface of a workpiece, an upper surface portion corresponding to a second surface of the workpiece to which a protective sheet is affixed, and an abutting portion that has a shape conforming to an outer peripheral shape of the workpiece, that has a thickness corresponding to a thickness of the workpiece, and that is to abut on an outer peripheral portion of the workpiece. The upper surface portion has a width larger than a width of a peeling tape that is to be affixed to the protective sheet and used for peeling off the protective sheet, and is formed of a material that rejects affixing of the peeling tape. The lower surface portion is formed of a material that rejects affixing of the holding sheet.

A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of: step S1, providing a rigid substrate on which a flexible base is formed; step S2, forming a thin film transistor array layer on the flexible base; step S3, forming an OLED display unit on the thin film transistor array layer; step S4, forming an encapsulation layer on the OLED display unit; step S5, forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive; step S6, peeling off the rigid substrate, and completing a support film to be attached under the flexible base; step S7, removing the protective layer; and step S8, forming a protective cover on the encapsulation layer.

A method of manufacturing an optically anisotropic polymer thin film includes forming a composite structure that includes a polymer thin film and a high Poisson's ratio polymer thin film disposed directly over the polymer thin film, attaching a clip array to opposing edges of the composite, the clip array including a plurality of first clips slidably disposed on a first track located proximate to a first edge of the composite and a plurality of second clips slidably disposed on a second track located proximate to a second edge of the composite, applying a positive in-plane strain to the composite along a transverse direction by increasing a distance between the first clips and the second clips, and decreasing an inter-clip spacing amongst the first clips and amongst the second clips along a machine direction, wherein the high Poisson's ratio polymer thin film applies a negative in-plane strain to the polymer thin film along the machine.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

The present invention provides a device and a method for processing gold leaf to make the gold leaf float on a tea, beverage, alcohol, or the like to be suitable to drink. To this end, provided is a gold leaf processing device and a gold leaf processing method. The gold leaf processing device separates gold leaf from a gold leaf fabric having a first base material attached thereto, and attaches the separated gold leaf to a second base material, the gold leaf processing device comprising: a gold leaf attaching part which dips the gold leaf fabric in an aqueous solution to allow the first base material to be sunk and separated from the gold leaf, and attaches the second base material to the gold leaf remaining, in a floating state, on the surface of the aqueous solution; and a gold leaf fabric transfer part which transfers the gold leaf fabric to the gold leaf attaching part. The gold leaf processing method separates gold leaf from a gold leaf fabric having a first base material attached thereto, and attaches the separated gold leaf to a second base material, the gold leaf processing method comprising the steps of: dipping the gold leaf fabric in an aqueous solution to allow the gold leaf to float on the surface thereof and allow the first base material to be sunk and separated; and attaching the second base material to the gold leaf remaining, in a floating state, on the surface of the aqueous solution.