A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

An object of the present invention is to provide a laminate having a smaller transmission loss in a high frequency band.

A laminate having a metal layer and a resin layer in contact with at least one surface of the metal layer, in which a dielectric loss tangent of the resin layer at a temperature of 23° C. and a frequency of 28 GHz is less than 0.002, and an average length RSm at an interface between the metal layer and the resin layer in a cross-section along a thickness direction of the laminate is 1.2 μm or less.

Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A seamless three-dimensional cover (1) for an electronic device (2), the seamless three-dimensional cover (1) comprising of at least one glass base layer (3) and at least one glass rim layer (4). At least one layer of color inducing film (5) is arranged between at least one of the base layer (3) and the rim layer (4), or between two adjacent rim layers (4). The base layer (3), the rim layer(s) (4), and the layer of color inducing film (5) are fused together to form the seamless three-dimensional cover (1). This facilitates a strong and durable three-dimensional cover, which cover is translucent as well as at least partially colored. Furthermore, the cover does not affect the function of components such as millimeter-wave antennas.

Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device.

An element including: a first electrode; an intermediate layer made of a silicone rubber composition containing a silicone rubber; and a second electrode, where the first electrode, the intermediate layer, and the second electrode are disposed in this order, wherein a peak intensity ratio (1095±5 cm.sup.−1/1025±5 cm.sup.−1) of an infrared absorption spectrum of the intermediate layer varies along a vertical direction relative to a surface of the first electrode, and to a surface of the second electrode.

A casing component according to an embodiment of the present technology includes a decorating film and a casing part. The decorating film is formed on a base film by vapor deposition and includes a metal layer, fine cracks being formed in the metal layer by stretching the base film. The casing part has a decorated region, the decorating film being adhered to the decorated region.

An object of the present invention is to provide a transparent electrode including a substrate having thereon a conductive layer containing silver as a main component, wherein the transparent electrode has an organic functional layer between the substrate and the conductive layer; and the organic functional layer contains a first organic compound represented by Formula (1) and a second organic compound having a different structure from a structure of the first organic compound,

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