B81C1/00

Vent Attachment System For Micro-Electromechanical Systems
20180009655 · 2018-01-11 ·

A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device.

Method for manufacturing a membrane component and a membrane component
11708265 · 2023-07-25 · ·

The present invention relates to a method for manufacturing a membrane component with a membrane made of a thin film (<1 μm, thin-film membrane). The membrane component can be used in microelectromechanical systems (MEMS). The invention is intended to provide a method for manufacturing a membrane component, the membrane being manufacturable with high-precision membrane dimensions and a freely selectable membrane geometry. This is achieved by a method comprising . . . providing a semiconductor wafer (100) with a first layer (116), a second layer (118) and a third layer (126). Depositing (12) a first masking layer (112) on the first layer (116), the first masking layer (112) defining a first selectively processable area (114) for determining a geometry of the membrane (M.sub.1). Forming (13) a first recess (120) by anisotropic etching (13) of the first layer (116) and removing the first masking layer (112). Introducing (14) a material (122) in the first recess (120) and depositing (15) a membrane layer (124) on the first layer (116) with the introduced material (122). Depositing on the third layer (126) a second masking layer that defines a second selectively processable area. Forming a second recess by anisotropic etching of the third layer (126) and of the second layer (118) up to the first layer (116). Removing the second masking layer; and isotropically etching (18) the first layer (116), the isotropic etching being limited by the membrane layer (124) and by the introduced material (122), so that the membrane (M.sub.1) will be exposed.

USE OF A REACTIVE, OR REDUCING GAS AS A METHOD TO INCREASE CONTACT LIFETIME IN MICRO CONTACT MEMS SWITCH DEVICES

A MEMS device comprises an electro mechanical element in a sealed chamber containing a gas comprising a reactive gas selected to react with any contaminants that may be present or formed on the operating surfaces of the device in a manner to maximize the electrical conductivity of the surfaces during operation of the device. The MEMS device may comprise a MEMS switch having electrical contacts as the operating surfaces. The reactive gas may comprise hydrogen or an azane, optionally mixed with an inert gas, or any combination of the gases. The corresponding process provides a means to substantially reduce or eliminate contaminants present or formed on the operating surfaces of MEMS devices in a manner to maximize the electrical conductivity of the surfaces during operation of the devices.

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
20180011385 · 2018-01-11 ·

A display apparatus includes: a substrate; a pixel electrode above the substrate; a first low reflection layer spaced apart from the pixel electrode at a same layer as the pixel electrode and comprising a lower layer having conductivity and an upper layer above the lower layer; a pixel-defining layer above the first low reflection layer and having an opening exposing at least a part of the pixel electrode; an intermediate layer above the pixel electrode and comprising an organic emission layer; and an opposite electrode above the intermediate layer.

Pressure sensing implant

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

Microfluidic device with integrated micro-structured electrodes and methods thereof

The present disclosure provides a microfluidic device comprising a set of micro-structured electrodes. The electrodes are made of a fusible alloy such as Field's Metal and are patterned on a layer of PDMS. The molten fusible alloy is poured over the patterned PDMA layer and a suction force is applied to ensure uniformity of flow of the molten metal. A second layer comprising a flow channel orthogonal to the direction of the micro-structured electrodes is disposed under the first layer to form the microfluidic device. The device shows enhanced sensitivity to RBC detection at high frequencies that are also bio-compatible (above 2 MHz). Multiple layers of the micro-structures electrodes can be sandwiched between layers of flow channels to provide a 3D microfluidic device.

Manufacturing method of semiconductor structure

A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

TEXTILES HAVING A MICROSTRUCTURED SURFACE AND GARMENTS COMPRISING THE SAME
20230234838 · 2023-07-27 ·

The present invention relates to textile articles and clothing such as outdoor garments, indoor garments, and commercial protective wear exposed to contact mixtures of water and oil, swimwear and winter wear exposed to mixtures of water and air. At least part of these textile articles possess a surface provided with at least one of 1) a high surface area, 2) hierarchical pattern, 3) contact angles such that hydrophilic portion of a contact mixture possesses a high contact angle and the hydrophobic portion of a contact mixture possesses a low contact angle, and 4) hysteresis angle greater than 5 degrees. Hydrophobic/Hydrophilic contact mixtures of the present invention can be surfaces where water and or ice are present in combination with oil and or air. The textile articles of the present invention resist slippage on surfaces possessing hydrophobic/hydrophilic contact mixtures.

METHOD TO ACHIEVE TILTED PATTERNING WITH A THROUGH RESIST THICKNESS USING PROJECTION OPTICS
20230236517 · 2023-07-27 ·

Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

MICRO-ELECTROMECHANICAL SYSTEM PACKAGE HAVING MOVABLE PLATFORM
20230002214 · 2023-01-05 ·

A MEMS package including a fixed frame, a moveable platform and elastic restoring members is provided. The moveable platform is moved with respect to the fixed frame. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position.